JPS6263932U - - Google Patents

Info

Publication number
JPS6263932U
JPS6263932U JP15559385U JP15559385U JPS6263932U JP S6263932 U JPS6263932 U JP S6263932U JP 15559385 U JP15559385 U JP 15559385U JP 15559385 U JP15559385 U JP 15559385U JP S6263932 U JPS6263932 U JP S6263932U
Authority
JP
Japan
Prior art keywords
board
anisotropic conductive
conductive tape
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15559385U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15559385U priority Critical patent/JPS6263932U/ja
Publication of JPS6263932U publication Critical patent/JPS6263932U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP15559385U 1985-10-09 1985-10-09 Pending JPS6263932U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15559385U JPS6263932U (fr) 1985-10-09 1985-10-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15559385U JPS6263932U (fr) 1985-10-09 1985-10-09

Publications (1)

Publication Number Publication Date
JPS6263932U true JPS6263932U (fr) 1987-04-21

Family

ID=31076431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15559385U Pending JPS6263932U (fr) 1985-10-09 1985-10-09

Country Status (1)

Country Link
JP (1) JPS6263932U (fr)

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