JPS6262435U - - Google Patents
Info
- Publication number
- JPS6262435U JPS6262435U JP15293585U JP15293585U JPS6262435U JP S6262435 U JPS6262435 U JP S6262435U JP 15293585 U JP15293585 U JP 15293585U JP 15293585 U JP15293585 U JP 15293585U JP S6262435 U JPS6262435 U JP S6262435U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- resin material
- separately
- molds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 3
- 238000000465 moulding Methods 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985152935U JPH0432755Y2 (US20030204162A1-20031030-M00001.png) | 1985-10-04 | 1985-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985152935U JPH0432755Y2 (US20030204162A1-20031030-M00001.png) | 1985-10-04 | 1985-10-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6262435U true JPS6262435U (US20030204162A1-20031030-M00001.png) | 1987-04-17 |
| JPH0432755Y2 JPH0432755Y2 (US20030204162A1-20031030-M00001.png) | 1992-08-06 |
Family
ID=31071366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985152935U Expired JPH0432755Y2 (US20030204162A1-20031030-M00001.png) | 1985-10-04 | 1985-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432755Y2 (US20030204162A1-20031030-M00001.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04299543A (ja) * | 1991-03-28 | 1992-10-22 | Nec Corp | 半導体製造装置 |
| JPH0732415A (ja) * | 1993-07-22 | 1995-02-03 | Towa Kk | 電子部品の樹脂封止成形方法及び装置 |
| JPH0732414A (ja) * | 1993-07-22 | 1995-02-03 | Towa Kk | 電子部品の樹脂封止成形方法及び装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5138875A (en) * | 1974-09-27 | 1976-03-31 | Matsushita Electronics Corp | Handotaisochino jushifujihoho |
| JPS59159535A (ja) * | 1983-03-02 | 1984-09-10 | Sanyo Electric Co Ltd | 半導体素子の樹脂モ−ルド方法 |
-
1985
- 1985-10-04 JP JP1985152935U patent/JPH0432755Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5138875A (en) * | 1974-09-27 | 1976-03-31 | Matsushita Electronics Corp | Handotaisochino jushifujihoho |
| JPS59159535A (ja) * | 1983-03-02 | 1984-09-10 | Sanyo Electric Co Ltd | 半導体素子の樹脂モ−ルド方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04299543A (ja) * | 1991-03-28 | 1992-10-22 | Nec Corp | 半導体製造装置 |
| JPH0732415A (ja) * | 1993-07-22 | 1995-02-03 | Towa Kk | 電子部品の樹脂封止成形方法及び装置 |
| JPH0732414A (ja) * | 1993-07-22 | 1995-02-03 | Towa Kk | 電子部品の樹脂封止成形方法及び装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0432755Y2 (US20030204162A1-20031030-M00001.png) | 1992-08-06 |
