JPS6260091U - - Google Patents
Info
- Publication number
- JPS6260091U JPS6260091U JP15073285U JP15073285U JPS6260091U JP S6260091 U JPS6260091 U JP S6260091U JP 15073285 U JP15073285 U JP 15073285U JP 15073285 U JP15073285 U JP 15073285U JP S6260091 U JPS6260091 U JP S6260091U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- chip component
- chip
- conductive
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15073285U JPS6260091U (bs) | 1985-10-01 | 1985-10-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15073285U JPS6260091U (bs) | 1985-10-01 | 1985-10-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6260091U true JPS6260091U (bs) | 1987-04-14 |
Family
ID=31067138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15073285U Pending JPS6260091U (bs) | 1985-10-01 | 1985-10-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6260091U (bs) |
-
1985
- 1985-10-01 JP JP15073285U patent/JPS6260091U/ja active Pending