JPS6260051U - - Google Patents
Info
- Publication number
- JPS6260051U JPS6260051U JP15162285U JP15162285U JPS6260051U JP S6260051 U JPS6260051 U JP S6260051U JP 15162285 U JP15162285 U JP 15162285U JP 15162285 U JP15162285 U JP 15162285U JP S6260051 U JPS6260051 U JP S6260051U
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- receiving sensor
- light
- sealing structure
- transparent resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15162285U JPS6260051U (lm) | 1985-10-02 | 1985-10-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15162285U JPS6260051U (lm) | 1985-10-02 | 1985-10-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6260051U true JPS6260051U (lm) | 1987-04-14 |
Family
ID=31068859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15162285U Pending JPS6260051U (lm) | 1985-10-02 | 1985-10-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6260051U (lm) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006051726A1 (ja) * | 2004-11-09 | 2006-05-18 | Kyushu University, National University Corporation | センサ部及び生体センサ |
-
1985
- 1985-10-02 JP JP15162285U patent/JPS6260051U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006051726A1 (ja) * | 2004-11-09 | 2006-05-18 | Kyushu University, National University Corporation | センサ部及び生体センサ |
JP2006130208A (ja) * | 2004-11-09 | 2006-05-25 | Kyushu Univ | センサ部及び生体センサ |
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