JPS6260034U - - Google Patents
Info
- Publication number
- JPS6260034U JPS6260034U JP1985151573U JP15157385U JPS6260034U JP S6260034 U JPS6260034 U JP S6260034U JP 1985151573 U JP1985151573 U JP 1985151573U JP 15157385 U JP15157385 U JP 15157385U JP S6260034 U JPS6260034 U JP S6260034U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electronic component
- lead
- melting point
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985151573U JPS6260034U (enrdf_load_stackoverflow) | 1985-10-04 | 1985-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985151573U JPS6260034U (enrdf_load_stackoverflow) | 1985-10-04 | 1985-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6260034U true JPS6260034U (enrdf_load_stackoverflow) | 1987-04-14 |
Family
ID=31068770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985151573U Pending JPS6260034U (enrdf_load_stackoverflow) | 1985-10-04 | 1985-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6260034U (enrdf_load_stackoverflow) |
-
1985
- 1985-10-04 JP JP1985151573U patent/JPS6260034U/ja active Pending