JPS6259157B2 - - Google Patents
Info
- Publication number
- JPS6259157B2 JPS6259157B2 JP11138279A JP11138279A JPS6259157B2 JP S6259157 B2 JPS6259157 B2 JP S6259157B2 JP 11138279 A JP11138279 A JP 11138279A JP 11138279 A JP11138279 A JP 11138279A JP S6259157 B2 JPS6259157 B2 JP S6259157B2
- Authority
- JP
- Japan
- Prior art keywords
- eraser
- weight
- plastic
- parts
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 14
- 229920003023 plastic Polymers 0.000 claims description 11
- 239000004033 plastic Substances 0.000 claims description 11
- 239000004014 plasticizer Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000003094 microcapsule Substances 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 8
- 239000011162 core material Substances 0.000 claims description 7
- 239000004094 surface-active agent Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000002775 capsule Substances 0.000 claims description 3
- 239000003921 oil Substances 0.000 description 10
- 235000019198 oils Nutrition 0.000 description 10
- 238000000465 moulding Methods 0.000 description 9
- 238000003756 stirring Methods 0.000 description 7
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 239000002904 solvent Substances 0.000 description 5
- 239000003381 stabilizer Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- PGMYKACGEOXYJE-UHFFFAOYSA-N pentyl acetate Chemical compound CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- MXVMODFDROLTFD-UHFFFAOYSA-N 2-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]ethanol Chemical compound CCCCOCCOCCOCCOCCO MXVMODFDROLTFD-UHFFFAOYSA-N 0.000 description 1
- SXNRWWNGEQMQCB-UHFFFAOYSA-N 2-[2-[2-(2-propoxyethoxy)ethoxy]ethoxy]ethanol Chemical compound CCCOCCOCCOCCOCCO SXNRWWNGEQMQCB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- UPGSWASWQBLSKZ-UHFFFAOYSA-N 2-hexoxyethanol Chemical compound CCCCCCOCCO UPGSWASWQBLSKZ-UHFFFAOYSA-N 0.000 description 1
- HXDLWJWIAHWIKI-UHFFFAOYSA-N 2-hydroxyethyl acetate Chemical compound CC(=O)OCCO HXDLWJWIAHWIKI-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PVCJKHHOXFKFRP-UHFFFAOYSA-N N-acetylethanolamine Chemical compound CC(=O)NCCO PVCJKHHOXFKFRP-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- WDIHJSXYQDMJHN-UHFFFAOYSA-L barium chloride Chemical compound [Cl-].[Cl-].[Ba+2] WDIHJSXYQDMJHN-UHFFFAOYSA-L 0.000 description 1
- 229910001626 barium chloride Inorganic materials 0.000 description 1
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-M dihydrogenphosphate Chemical compound OP(O)([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-M 0.000 description 1
- PVRATXCXJDHJJN-UHFFFAOYSA-N dimethyl 2,3-dihydroxybutanedioate Chemical compound COC(=O)C(O)C(O)C(=O)OC PVRATXCXJDHJJN-UHFFFAOYSA-N 0.000 description 1
- DROMNWUQASBTFM-UHFFFAOYSA-N dinonyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCC DROMNWUQASBTFM-UHFFFAOYSA-N 0.000 description 1
- XWVQUJDBOICHGH-UHFFFAOYSA-N dioctyl nonanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCC(=O)OCCCCCCCC XWVQUJDBOICHGH-UHFFFAOYSA-N 0.000 description 1
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- XBAYYJIDJARTJQ-UHFFFAOYSA-L disodium sulfate trihydrate Chemical compound O.O.O.[Na+].[Na+].[O-]S([O-])(=O)=O XBAYYJIDJARTJQ-UHFFFAOYSA-L 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 239000007970 homogeneous dispersion Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N methyl 2-hydroxypropionate Chemical group COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229940114930 potassium stearate Drugs 0.000 description 1
- ANBFRLKBEIFNQU-UHFFFAOYSA-M potassium;octadecanoate Chemical compound [K+].CCCCCCCCCCCCCCCCCC([O-])=O ANBFRLKBEIFNQU-UHFFFAOYSA-M 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000012047 saturated solution Substances 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 1
- 229950006389 thiodiglycol Drugs 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- MGMXGCZJYUCMGY-UHFFFAOYSA-N tris(4-nonylphenyl) phosphite Chemical compound C1=CC(CCCCCCCCC)=CC=C1OP(OC=1C=CC(CCCCCCCCC)=CC=1)OC1=CC=C(CCCCCCCCC)C=C1 MGMXGCZJYUCMGY-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Description
本発明は、非浸透性物質に対し油性インキによ
り筆記した際の筆跡あるいは、非浸透性物質の油
汚れに対して特に優れた消去性を有するプラスチ
ツク製字消に関するものである。
従来、ガラス、金属、プラスチツク板、プラス
チツクフイルム等の非浸透性物質上の油性インキ
の筆跡を消去する場合、あるいは油汚れを落す場
合には、洗剤で磨粉をつけたブラシで擦りおと
し、水洗する方法が採用されているが、この方法
は、手間がかかるし、又小部分だけ処理し難いと
いう欠点を有していた。その為、インキ溶剤を吸
蔵させた固型字消が考えられているが、十分な消
去性が得られないのが現状である。
そこで、本発明者等は、簡便性、操作性を考慮
すれば、基本的には固型の字消タイプが適してい
るとの発想に基づき、更に消去性を向上させる為
に、字消中に含有せしめる物質を種々検討の結
果、本発明を完成したものである。
即ち、本発明は、樹脂と可塑剤を主材とした基
材中に、少なくとも吸湿性無機粉体、界面活性
剤、有機溶剤を芯物質とするマイクロカプセルを
含有せしめたプラスチツク製字消を基本的要旨と
するものである。
樹脂と可塑剤を主材とした基材中に吸湿性無機
粉体と、界面活性剤と、有機溶剤を芯物質とする
マイクロカプセルを含有せしめると、何故消去性
が向上するかは定かでないが、吸湿性無機粉体が
水分を吸収し、界面活性剤の働きを助け、油や油
性インキとの濡れをよくすること、有機溶剤が、
油や油性インキのバインダー樹脂を溶かす働きを
すること、消し屑が傷をつけない研磨材の働きを
するなどが相乗して作用する結果と推考される。
尚、本発明における「字消」とは、前記せる如
く、通常の筆跡文字の消去をはじめとし、インキ
汚れ落し、油汚れ落し等の広義の意味を有するも
のである。
次に本発明について詳細に説明する。
基材としては、樹脂、可塑剤を主材とし、その
他適宜安定剤、充填材などを添加したものであ
る。樹脂としては、公知のプラスチツク製字消に
使用されているものならほとんど使用可能である
が、消去性、他の素材との相溶性、成形時の安定
性などを考慮すれば、ポリ塩化ビニル、塩化ビニ
ル―酢酸ビニル共重合体が特に好ましい。その使
用量は字消全量に対して30〜45重量%が好まし
い。
可塑剤としては、ジオクチルフタレート、ジノ
ニルフタレート等のフタル酸系、ジオクチルアジ
ペート等のアジピン系、ジオクチルアゼレート等
の脂肪酸系、又、安定剤としても使用されるエポ
キシ化大豆油等のエポキシ系の可塑剤等が使用さ
れる。
その使用量は、字消全量に対して25〜50重量%
が好ましい。
安定剤としては、ステアリン酸カリウム、ステ
アリン酸バリウム等の各種金属塩、トリノニルフ
エニルホスフアイト等のリン系の安定剤等が使用
される。その使用量は、字消全量に対して5重量
%以下が好ましい。
充填材としては、炭酸カルシウム、ケイ酸、タ
ルク等の無機充填材が好ましい。その使用量は他
の素材を好慮すれば字消全量に対して20重量%以
下が好ましい。
吸湿性無機粉体は、硫酸ナトリウム、リン酸水
素2ナトリウム、リン酸水素2カリウム、炭酸ナ
トリウム、塩化バリウム、硫酸銅、リン酸水素2
アンモニウム、硫酸亜鉛、亜硫酸ナトリウム等が
使用できるが、固相の共存する飽和溶液とした場
合の密閉空間の湿度が20℃で80%以上のものが好
ましく、80%以下の湿度を示す吸湿性無機粉体を
使用した場合は、高湿度の場所に字消を放置した
場合、経時的に吸湿性無機粉体が潮解し字消中の
細孔を通つてしみ出してくる事があり好ましくな
い。又、その使用量は字消全量に対して5重量%
以下では効果が比較的弱く、20重量%以上では字
消の性状が悪くなることがあるため、5〜20重量
%が好ましい。
界面活性剤としては、各種の界面活性剤が使用
可能であるが、非イオンおよび陰イオン界面活性
剤が他の素材との反応性が少ないという点で好ま
しい。その使用量は、字消全量に対して0.2重量
%以下では、効果が顕著でなく、5重量%以上使
用しても効果が増さないため、0.2〜5重量%が
好ましい。
有機溶剤を芯物質とするマイクロカプセルのカ
プセル壁は、字消成型時の圧力で壊れず、字消使
用時の圧力で壊れて消し屑とともに有機溶剤がし
み出してくるものなら特に限定なく、各種の方法
が採用できるが、特に本出願人が先に出願した
(特願昭53−37331号(特開昭54−128483号公
報)、同53−37332号(特開昭54−128484号公
報))シリカ粒子集合体は前記条件の他に化学的
安定性、経時的安定性を十分満足するため好まし
い。
有機溶剤は、インキ中のバインダー樹脂、或い
は油などを溶解し得るものなら広範囲に使用可能
であるが、沸点が字消成型時の成型温度より低い
溶剤を使用すると、カプセルを壊して揮散する恐
れがあるので、字消成型時の成型温度(基材によ
り異なるが一般的には110〜130℃である)より高
い沸点を有する溶剤が好ましく、例えば、2―エ
トキシエチルアセテート、ジエチレングリコール
モノメチルエーテル、トリエチレングリクールモ
ノメチルエーテル、トリエチレングリコールモノ
ブチルエーテル、ジエチレングリコールモノヘキ
シルエーテル、テトラエチレングリコールモノブ
チルエーテル、テトラエチレングリコールモノプ
ロピルエーテル、エチレングリコールモノアセテ
ート、エチレングリコールヘキシルエーテル、モ
ルホリン、N―メチルモルホリン、酒石酸ジメチ
ル、N―β―ヒドロキシエチルアセトアミド、ホ
ルムアルデヒド、N―メチルホルムアミド、ジメ
チルホルムアミド、ジメチルスルホキシド、スル
ホラン、モノエタノールアミン、エチレングリコ
ール、ジエチレングリコール、チオジグリコー
ル、トリエチレングリコール、酢酸ペンチル、テ
トラヒドロフルフリールアルコール、乳酸メチ
ル、2―ピロリドン、N―メチル―2―ピロリド
ン、ヘキサメチルホスホロアミド等が単独もしく
は適宜組み合わせて使用できる。又、有機溶剤を
芯物質とするマイクロカプセルの使用量は、字消
全量に対して5重量%以下では、効果が少なく、
又、20重量%以上では字消の性状が悪くなること
から5〜20重量%が好ましい。この芯物質中に特
性向上の為、適宜物質を添加することができる。
尚、上記素材以外のものとして顔料や香料等も
適宜添加してもよい。
これらの素材を常温あるいは加温して均一に混
合撹拌し、加熱成型することによりプラスチツク
製字消が得られるが、この際有機溶剤を芯物質と
するマイクロカプセルは、撹拌中にマイクロカプ
セルが壊される恐れがあるため、他の素材を先に
十分撹拌し、最後にマイクロカプセルを加え撹拌
する事が好ましい。又、加熱成型は、一般に使用
されている注型、プレス成型、押出成型、射出成
型等の各種の方法が採用され得る。
以下、実施例に基づき本発明を更に詳細に説明
するが、実施例中「部」とあるのは「重量部」を
示すものとする。
実施例 1
塩ビペーストレジン(塩化ビニル樹脂) 1000部
ジオクチルフタレート 800部
ジオクチルアジペート 100部
硫酸ナトリウム・3水塩の粉末 300部
ソルボンT−80(東邦化学(株)製、非イオン界面
活性剤) 25部
エポキシ化大豆油(アデカ・アーガス(株)製、0
−130−P、安定剤) 30部
炭酸カルシウム 100部
上記成分を40℃に加温して、ホモジナイザーで
10000r.p.mで5分間撹拌して均一分散物を得
た。この均一分散物中に、ジエチレングリコール
70重量部と炭酸マグネシウム50重量部よりなる混
合ペーストを回転刃のついた撹拌装置内でシリカ
微粒子(平均粒径12mμ、表面積200m2/g、見
掛比重60g/)26重量部中に投入し、回転数
1200r.p.mで1分間撹拌することにより得たシリ
カ粒子集合体壁であるマイクロカプセル(200メ
ツシユ全網全通)140重量部を加えて混合し、プ
ラスチツク製字消の基材混合液を得た。この混合
液をプレス成型(温度120℃、20分間)して本発
明のプラスチツク製字消を得た。この字消の消去
性能は下表のように優れたものであつた。
尚、比較例は、インキ溶剤を吸蔵させた市販の
字消(西ドイツ、ステツドラー社製、ルモプラス
ト)を使用した。
The present invention relates to a plastic letter eraser that has particularly excellent erasability for handwriting written with oil-based ink on non-penetrating materials or oil stains on non-penetrating materials. Traditionally, when erasing oil-based ink marks on non-penetrating materials such as glass, metal, plastic plates, and plastic films, or removing oil stains, it is necessary to scrub the area with a brush dipped in detergent and then rinse with water. However, this method is time-consuming and has the disadvantage that it is difficult to process only small portions. For this reason, solid erasers that absorb ink solvent have been considered, but at present they do not have sufficient erasability. Therefore, based on the idea that a solid erasable type is basically suitable in terms of simplicity and operability, the inventors developed a medium erasable type in order to further improve erasability. The present invention was completed as a result of various studies on the substances to be contained in the liquid. That is, the present invention is based on a plastic eraser in which microcapsules containing at least a hygroscopic inorganic powder, a surfactant, and an organic solvent as core materials are contained in a base material mainly composed of a resin and a plasticizer. The main points are as follows. Although it is not clear why erasability improves when microcapsules containing hygroscopic inorganic powder, surfactant, and organic solvent as core materials are contained in a base material mainly composed of resin and plasticizer. , hygroscopic inorganic powder absorbs water, helps the surfactant function, and improves wetting with oil and oil-based ink; organic solvents
It is thought that this is the result of a synergistic effect: it works to dissolve the binder resin of oil and oil-based ink, and the eraser dust works as an abrasive that does not cause scratches. As mentioned above, the word "erasing" in the present invention has a broad meaning, including erasing ordinary handwritten characters, removing ink stains, and removing oil stains. Next, the present invention will be explained in detail. The base material is mainly composed of a resin and a plasticizer, and other stabilizers, fillers, etc. are added as appropriate. As the resin, most of the resins used in known plastic letter erasers can be used, but considering erasability, compatibility with other materials, stability during molding, etc., polyvinyl chloride, Particularly preferred is vinyl chloride-vinyl acetate copolymer. The amount used is preferably 30 to 45% by weight based on the total amount of paper. Examples of plasticizers include phthalic acid-based plasticizers such as dioctyl phthalate and dinonyl phthalate, adipine-based plasticizers such as dioctyl adipate, fatty acid-based plasticizers such as dioctyl azelate, and epoxy-based plasticizers such as epoxidized soybean oil, which is also used as a stabilizer. Plasticizers etc. are used. The amount used is 25 to 50% by weight of the total amount.
is preferred. As the stabilizer, various metal salts such as potassium stearate and barium stearate, phosphorus stabilizers such as trinonylphenyl phosphite, and the like are used. The amount used is preferably 5% by weight or less based on the total amount of the eraser. As the filler, inorganic fillers such as calcium carbonate, silicic acid, and talc are preferred. The amount used is preferably 20% by weight or less based on the total amount of eraser, if other materials are taken into consideration. Hygroscopic inorganic powders include sodium sulfate, disodium hydrogen phosphate, dipotassium hydrogen phosphate, sodium carbonate, barium chloride, copper sulfate, dihydrogen phosphate,
Ammonium, zinc sulfate, sodium sulfite, etc. can be used, but it is preferable that the humidity in a closed space is 80% or more at 20°C when made into a saturated solution with the coexistence of a solid phase. When powder is used, if the eraser is left in a place with high humidity, the hygroscopic inorganic powder may deliquesce over time and seep out through the pores in the eraser, which is undesirable. Also, the amount used is 5% by weight based on the total amount of eraser.
If it is less than 20% by weight, the effect will be relatively weak, and if it is more than 20% by weight, the eraser properties may deteriorate, so 5 to 20% by weight is preferable. Various surfactants can be used as the surfactant, but nonionic and anionic surfactants are preferred because they have less reactivity with other materials. The amount used is preferably 0.2 to 5% by weight, since the effect is not significant if it is less than 0.2% by weight, and the effect is not increased even if it is used more than 5% by weight. The capsule wall of microcapsules whose core material is an organic solvent is not particularly limited, as long as it does not break under the pressure during erase molding and when used, the organic solvent oozes out along with the eraser waste. However, in particular, the method filed earlier by the present applicant (Japanese Patent Application No. 53-37331 (Japanese Unexamined Patent Publication No. 54-128483), No. 53-37332 (Japanese Unexamined Patent Application No. 1988-128484) ) Silica particle aggregates are preferable because they fully satisfy the above conditions as well as chemical stability and stability over time. A wide range of organic solvents can be used as long as they can dissolve the binder resin or oil in the ink, but if you use a solvent whose boiling point is lower than the molding temperature during ink molding, there is a risk that it will break the capsule and volatilize. Therefore, it is preferable to use a solvent with a boiling point higher than the molding temperature (generally 110 to 130°C, although it varies depending on the base material) during erase molding. For example, 2-ethoxyethyl acetate, diethylene glycol monomethyl ether, and Ethylene glycol monomethyl ether, triethylene glycol monobutyl ether, diethylene glycol monohexyl ether, tetraethylene glycol monobutyl ether, tetraethylene glycol monopropyl ether, ethylene glycol monoacetate, ethylene glycol hexyl ether, morpholine, N-methylmorpholine, dimethyl tartrate, N-β-hydroxyethylacetamide, formaldehyde, N-methylformamide, dimethylformamide, dimethyl sulfoxide, sulfolane, monoethanolamine, ethylene glycol, diethylene glycol, thiodiglycol, triethylene glycol, pentyl acetate, tetrahydrofurfuryl alcohol, lactic acid Methyl, 2-pyrrolidone, N-methyl-2-pyrrolidone, hexamethylphosphoramide, and the like can be used alone or in appropriate combinations. In addition, if the amount of microcapsules whose core material is an organic solvent is less than 5% by weight based on the total amount, the effect will be small;
Further, if the content is more than 20% by weight, the eraser properties will deteriorate, so the content is preferably 5 to 20% by weight. Appropriate substances can be added to this core material to improve properties. In addition, pigments, fragrances, etc. may be added as appropriate in addition to the above-mentioned materials. Plastic erasers can be obtained by uniformly mixing and stirring these materials at room temperature or at elevated temperatures, and then heating and molding them. However, in this case, microcapsules whose core material is an organic solvent may be broken during stirring. To prevent this, it is preferable to thoroughly stir the other materials first, and then add and stir the microcapsules last. Furthermore, various commonly used methods such as casting, press molding, extrusion molding, and injection molding may be employed for the heat molding. Hereinafter, the present invention will be explained in more detail based on Examples, where "parts" in the Examples indicate "parts by weight." Example 1 PVC paste resin (vinyl chloride resin) 1000 parts Dioctyl phthalate 800 parts Dioctyl adipate 100 parts Sodium sulfate trihydrate powder 300 parts Sorbon T-80 (manufactured by Toho Chemical Co., Ltd., nonionic surfactant) 25 Part epoxidized soybean oil (manufactured by Adeka Argus Co., Ltd., 0
-130-P, stabilizer) 30 parts Calcium carbonate 100 parts Warm the above ingredients to 40℃ and use a homogenizer.
A homogeneous dispersion was obtained by stirring at 10,000 rpm for 5 minutes. In this uniform dispersion, diethylene glycol
A mixed paste consisting of 70 parts by weight and 50 parts by weight of magnesium carbonate was added to 26 parts by weight of silica fine particles (average particle diameter 12 mμ, surface area 200 m 2 /g, apparent specific gravity 60 g /) in a stirring device equipped with a rotating blade. , rotation speed
140 parts by weight of microcapsules (200 mesh, all mesh) obtained by stirring at 1200 rpm for 1 minute were added and mixed to obtain a base material mixture for plastic erasers. . This mixed solution was press-molded (temperature: 120° C., 20 minutes) to obtain a plastic letter eraser of the present invention. The erasing performance of this eraser was excellent as shown in the table below. In the comparative example, a commercially available eraser (Lumoplast, manufactured by Städler AG, West Germany) which occluded ink solvent was used.
【表】
尚、本発明のプラスチツク製字消は金属部分の
そうじ等に使用した場合には水洗い等の必要がな
いため錆等の心配がないという利点がある。又、
本発明のプラスチツク製字消は、鉛筆の筆跡消去
にも勿論使用でき、更に、溶剤などの選択により
前記表にても明らかな如く、水性インキの筆跡消
去にも使用できるものである。[Table] Furthermore, when the plastic eraser of the present invention is used for cleaning metal parts, etc., there is no need for washing with water, so there is no need to worry about rust. or,
The plastic character eraser of the present invention can of course be used for erasing pencil handwriting, and can also be used for erasing water-based ink handwriting, depending on the selection of solvents, etc., as shown in the table above.
Claims (1)
とも吸湿性無機粉体、界面活性剤、有機溶剤を芯
物質とするマイクロカプセルを含有せしめたプラ
スチツク製字消。 2 マイクロカプセルのカプセル壁をシリカ粒子
集合体となした特許請求の範囲第1項記載のプラ
スチツク製字消。[Scope of Claims] 1. A plastic eraser containing microcapsules whose core materials are at least a hygroscopic inorganic powder, a surfactant, and an organic solvent in a base material mainly composed of a resin and a plasticizer. 2. The plastic letter eraser according to claim 1, wherein the capsule wall of the microcapsules is an aggregate of silica particles.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11138279A JPS5636554A (en) | 1979-08-31 | 1979-08-31 | Plastic eraser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11138279A JPS5636554A (en) | 1979-08-31 | 1979-08-31 | Plastic eraser |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5636554A JPS5636554A (en) | 1981-04-09 |
JPS6259157B2 true JPS6259157B2 (en) | 1987-12-09 |
Family
ID=14559756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11138279A Granted JPS5636554A (en) | 1979-08-31 | 1979-08-31 | Plastic eraser |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5636554A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210271084A1 (en) * | 2018-07-10 | 2021-09-02 | Shimadzu Corporation | Image display device |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6271699A (en) * | 1985-09-26 | 1987-04-02 | ぺんてる株式会社 | Eraser composition for erasing water-color ink |
JP2654815B2 (en) * | 1988-11-14 | 1997-09-17 | シードゴム工業株式会社 | Eraser-containing microcapsules and manufacturing method thereof, and eraser containing the microcapsules |
DE19624419A1 (en) * | 1996-06-19 | 1998-01-02 | Haarmann & Reimer Gmbh | Desiccant containing fragrance |
KR100812512B1 (en) | 2007-06-25 | 2008-03-11 | 주식회사 엘지화학 | Chlorinated vinyl resin composition for eraser |
CN106243554A (en) * | 2016-07-31 | 2016-12-21 | 吴东华 | Pen writing special eraser is wiped |
-
1979
- 1979-08-31 JP JP11138279A patent/JPS5636554A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210271084A1 (en) * | 2018-07-10 | 2021-09-02 | Shimadzu Corporation | Image display device |
US11698532B2 (en) * | 2018-07-10 | 2023-07-11 | Shimadzu Corporation | Image display device |
Also Published As
Publication number | Publication date |
---|---|
JPS5636554A (en) | 1981-04-09 |
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