JPS6258447B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention involves patterning a film obtained by hydrolyzing a metal compound mixture on a transparent plastic substrate by electroless plating or by selective electroless plating using ultraviolet light exposure. The present invention relates to an encoder slit plate characterized by the following.

Conventionally, encoder slit plates have been made by forming a chromium coating on a glass substrate by etching metal or vapor depositing chromium, and patterning it into a desired shape. However, in the case of metal etching, fine etching with a slit hole diameter requires
There were limitations as an encoder with a high resolution function. Furthermore, encoder slit plates made by patterning a metallic chromium film obtained by vapor deposition of chromium on glass into a desired shape cannot be made in large quantities or with a large surface area at one time; Furthermore, it has been difficult to reduce costs due to the use of vacuum equipment. Furthermore, when an appropriate acrylic resin plate is used as the encoder slit plate with high plastic transmittance, vapor deposition is used because electroless plating is not normally covered. After all, it has the same drawbacks as a glass substrate. Among the plastics currently used, acrylic and methacrylic resins have excellent mechanical properties and are aesthetically pleasing, but compared to metals and other inorganic materials, they have poor wear resistance, surface hardness, heat resistance, and chemical resistance. Diethylene glycol bisacrylic carbide resin is a resin that has relatively excellent abrasion resistance but has poor properties, but the abrasion resistance and surface hardness of this resin are not necessarily sufficient for practical use.

The present invention eliminates such drawbacks, and its purpose is to use a transparent plastic substrate that is easier to machine and mold than glass, and to provide a coating obtained by hydrolyzing a metal compound mixture thereon, which is then exposed to ultraviolet light. By patterning the shape using selective electroless plating, it is possible to create fine patterns for encoder slits, and by not using vacuum equipment, costs can be reduced, large areas can be produced, and mass production can be achieved.Additionally, a selective plating method using ultraviolet light exposure has been developed. This shows that when used, the process can be shortened and quality can be improved.

The substrate used in the present invention may be any light-transmissive substrate, but due to its smoothness, transmittance, and low coefficient of thermal expansion, acrylic resin, polyester, polycarbonate resin, CR-39 resin, repolymer resin, etc. There are resins, polysulfone resins, polyethersulfone resins, spiran resins, etc. The substrate used is one with a thickness of 100 μm to several mm. It enables electroless plating on these plastic substrates, improves adhesion, and also brings the substrate closer to metal in hardness and coefficient of expansion, alleviating stress between metal and plastic due to thermal expansion and preventing cracks caused by strain. In order to prevent this, RM(OCnH _{2o+1 )}
Metal selected from Nb, Ta, Co, Al, Ge, In,
A film obtained by hydrolyzing a metal compound mixture consisting of x: an integer value taking into account the valence of the metal, and n: an integer is formed, and a film obtained by hydrolyzing a metal compound mixture consisting of ) After processing with electroless plating metal coating, a photosensitive resist was applied and patterned into the desired shape by ultraviolet exposure, the resist was etched in unnecessary areas, metal etching was performed, and then resist etching was performed. The selective electroless plating method by patterning or UV exposure is as follows: (1) The coated substrate described above is coated with SnCl ₂ (HCl acidic).
Dip into the solution and dry after a few minutes.

(2) A photomask made of Sekiei glass is closely attached to the substrate, and ultraviolet light with a wavelength of 2600 Å or less is irradiated for an appropriate amount of time.

(3) Immerse the substrate in PdCl ₂ (acidic HCl) solution, rinse with water, and then place in an electroless nickel bath for several minutes to plate.

The ultraviolet light in (2) turns into Sn ²⁺ U, VSn ⁴⁺ , and the reaction in the non-exposed area becomes Sn ²⁺ + Pd ²⁺ → Sn ⁴⁺ + Pd ⁰ by immersion in the PdCl ₂ solution in (3), and the palladium metal changes. It is thought that nickel is precipitated. Furthermore, since the UV-exposed area is Sn ⁴⁺ , it is impossible to reduce Pd ²⁺ . Therefore, nickel is not deposited.

We take into consideration hardness, adhesion, and low price for the metal fittings.
Ni-P was used. The plating thickness is about 300 Å to 1 μm, and in the case of an encoder slit plate, a pinhole of 1000 Å to 3000 Å is sufficient as a few pinholes will not be a problem as long as the slit side edges are firm. The encoder slit plate obtained in this way can be formed into a fine pattern, and the manufacturing cost can be reduced, the process can be shortened, and the plate cannot be rubbed out. Furthermore, since no resist is used, quality can be improved.

Example 1 On an acrylic substrate, TMS (6 parts), isopropyl alcohol (10 parts)
0.05NHCl (2 parts) Add SnCl ₂ as a catalyst, mix and stir, reflux and cure to some extent, apply by dipping method or spinner method, and then apply for 70 minutes.
After soaking in 10N NaOH which was dried and cured at about ℃ for 3 hours, it was thoroughly washed with water and plated. this coat is very well
It adsorbed Sn ²⁺ and had good plating adhesion. The plating process is as described above.

Example 2 Katsuta Kako KK made on acrylic board
NIKCOATA430 (base agent) 93 parts Z-102 (catalyst Z-
102) 7 parts were mixed and stirred to remove the cells, and then applied by dipping or spinner coating. Dry curing at 70℃
I went there in 3 hours. The following steps are the same as in Example 1.

Example 3 H ₂ N on an acrylic plate
5 parts of CH ₂ CH ₂ NHCH ₂ CHCH ₂ Si(OCH ₃ ) ₃ (SH6020 manufactured by Toshiba Silicon) and 5 parts of A-430 (manufactured by Katsuta Kako) were mixed and stirred, and after defoaming, coating was performed by dipping or spinner method. The drying temperature was 70°C for 3 hours. The following steps are the same as in Example 1.

Example 4 The acrylic plates of Examples 1, 2, and 3 were also tested on polycarbonate.

Claims (1)

[Claims] 1. RM on a transparent plastic substrate
(OCnH _2o+1 ) _x (R: an alkyl group, or an alkyl group containing at least an epoxy group, an amino group, etc., M:
Ti, Si, Zr, Hf, V, Nb, Ta, Co, Al, Ge,
A metal compound consisting of a metal selected from Ga, In, x: an integer value considering the valence of the metal, n: an integer),
1. A method for manufacturing an encoder slit plate, comprising forming a film obtained by hydrolyzing a mixture, and patterning the film by selective electroless plating using ultraviolet light exposure. 2. The metal compound shown in claim 1,
A method for producing an encoder slit plate, which comprises patterning a desired shape on a film obtained by hydrolyzing a mixture.