JPS6258076U - - Google Patents
Info
- Publication number
- JPS6258076U JPS6258076U JP14845285U JP14845285U JPS6258076U JP S6258076 U JPS6258076 U JP S6258076U JP 14845285 U JP14845285 U JP 14845285U JP 14845285 U JP14845285 U JP 14845285U JP S6258076 U JPS6258076 U JP S6258076U
- Authority
- JP
- Japan
- Prior art keywords
- land portions
- printed wiring
- wiring board
- board
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14845285U JPS6258076U (es) | 1985-09-28 | 1985-09-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14845285U JPS6258076U (es) | 1985-09-28 | 1985-09-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6258076U true JPS6258076U (es) | 1987-04-10 |
Family
ID=31062733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14845285U Pending JPS6258076U (es) | 1985-09-28 | 1985-09-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6258076U (es) |
-
1985
- 1985-09-28 JP JP14845285U patent/JPS6258076U/ja active Pending