JPS6257648B2 - - Google Patents
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- Publication number
- JPS6257648B2 JPS6257648B2 JP13286784A JP13286784A JPS6257648B2 JP S6257648 B2 JPS6257648 B2 JP S6257648B2 JP 13286784 A JP13286784 A JP 13286784A JP 13286784 A JP13286784 A JP 13286784A JP S6257648 B2 JPS6257648 B2 JP S6257648B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- epoxy
- weight
- compound
- properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- 150000001875 compounds Chemical class 0.000 claims description 28
- 239000004593 Epoxy Substances 0.000 claims description 27
- -1 cyclic acid anhydride Chemical class 0.000 claims description 11
- 239000011342 resin composition Substances 0.000 claims description 11
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 9
- 125000003700 epoxy group Chemical group 0.000 claims description 5
- 239000013034 phenoxy resin Substances 0.000 claims description 5
- 229920006287 phenoxy resin Polymers 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical group 0.000 claims description 3
- 150000002431 hydrogen Chemical group 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 125000000962 organic group Chemical group 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 21
- 239000011347 resin Substances 0.000 description 21
- 238000010438 heat treatment Methods 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 4
- XENMLDGAMXHYMH-UHFFFAOYSA-N 2-[(2-prop-2-enylphenoxy)methyl]oxirane Chemical compound C=CCC1=CC=CC=C1OCC1OC1 XENMLDGAMXHYMH-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 230000004580 weight loss Effects 0.000 description 4
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 2
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 2
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- CUFXMPWHOWYNSO-UHFFFAOYSA-N 2-[(4-methylphenoxy)methyl]oxirane Chemical compound C1=CC(C)=CC=C1OCC1OC1 CUFXMPWHOWYNSO-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 206010040880 Skin irritation Diseases 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- FJDJVBXSSLDNJB-LNTINUHCSA-N cobalt;(z)-4-hydroxypent-3-en-2-one Chemical compound [Co].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O FJDJVBXSSLDNJB-LNTINUHCSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000036556 skin irritation Effects 0.000 description 1
- 231100000475 skin irritation Toxicity 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は新規な低粘度エポキシ含浸樹脂に関す
るものであり、さらに詳しくは、エポキシ化合物
にアリルエポキシ化合物、ビニルモノマーを配合
することにより、機械特性、電気特性などの諸特
性にすぐれ、かつポツトライフの長い低粘度エポ
キシ含浸樹脂に関するものである。Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to a novel low-viscosity epoxy-impregnated resin, and more specifically, by blending an allyl epoxy compound and a vinyl monomer with an epoxy compound, mechanical properties, This invention relates to a low-viscosity epoxy-impregnated resin that has excellent electrical properties and other properties and has a long pot life.
エポキシ含浸樹脂に関しては、今までに数多く
の特許が出願されており、多くのエポキシ系含浸
樹脂が実際の機器に適用されている。
Many patents have been filed for epoxy impregnated resins, and many epoxy impregnated resins have been applied to actual devices.
しかし、これらエポキシ含浸樹脂の多くは、室
温で高粘度でかつポツトライフも短かいものが多
い。樹脂の低粘度化という方向では、希釈剤の添
加が一般的であるが、通常の希釈剤は皮膚刺激性
が大きく、かつ特性の低下の激しいものが多く、
十分な特性が得られないのが現状である。 However, many of these epoxy-impregnated resins have a high viscosity at room temperature and a short pot life. In order to lower the viscosity of resins, it is common to add diluents, but ordinary diluents are often highly irritating to the skin and severely degrade properties.
At present, sufficient characteristics cannot be obtained.
本発明者らはこれらの現状に鑑み、上記諸欠点
が改良されたエポキシ含浸樹脂について鋭意研究
を重ねた結果、本発明に到達したものである。
In view of these current circumstances, the present inventors have conducted extensive research into epoxy-impregnated resins that have been improved from the above-mentioned drawbacks, and as a result, have arrived at the present invention.
即ち本発明者らは、一分子中に少なくとも２個
のエポキシ基をもつエポキシ化合物100重量部
（以下、単に部と記す）に対し、一般式（）で
示され一分子中にアリル基とエポキシ基を併せも
つエポキシ化合物
（Ｒは水素、ハロゲン又は一価の有機基）
0.1〜100部、液状の環状酸無水物50〜150部、お
よび重合性二重結合を有する化合物５〜300部を
配合することにより、低粘度でかつポツトライフ
が長く、硬化特性の良好なエポキシ含浸樹脂組成
物を与えることを見出し、本発明を完成させるに
至つた。 That is, the present inventors determined that, for 100 parts by weight (hereinafter simply referred to as parts) of an epoxy compound having at least two epoxy groups in one molecule, allyl groups and epoxy Epoxy compounds with groups (R is hydrogen, halogen, or a monovalent organic group) By blending 0.1 to 100 parts, 50 to 150 parts of a liquid cyclic acid anhydride, and 5 to 300 parts of a compound having a polymerizable double bond, it has a low viscosity. The present inventors have discovered that it is possible to provide an epoxy-impregnated resin composition that has a long pot life and good curing properties, and has completed the present invention.
本発明の特徴は、低毒性で低粘度のアリルエポ
キシ化合物を用いることにより組成物の粘度を下
げ、かつアリルエポキシ化合物が一分子中にビニ
ル基とエポキシ基を併せもつことにより、エポキ
シ化合物と酸無水物およびビニルモノマーとの反
応系双方と反応して均一網目をつくる成分として
介在し、硬化物特性を向上させることにある。 The characteristics of the present invention are that the viscosity of the composition is lowered by using an allyl epoxy compound with low toxicity and low viscosity, and that the allyl epoxy compound has both a vinyl group and an epoxy group in one molecule, so that the epoxy compound and the acid Its purpose is to intervene as a component that reacts with both the anhydride and the vinyl monomer reaction system to form a uniform network, thereby improving the properties of the cured product.
本発明で用いることのできるエポキシ化合物と
しては一分子中に少なくとも２個のエポキシ基を
もつ化合物であればいずれでも良く、例えばビス
フエノールＡジグリシジルエーテルタイプの
DER332（ダウ社商品名）、エピコート828（シエ
ル社商品名）、GY−255（チバ社商品名）など、
ノボラツクタイプのDEN431（ダウ社商品名）、
脂環族タイプのCY−179（チバ社商品名）などが
あり、これらを単独あるいは混合して用いること
ができる。 The epoxy compound that can be used in the present invention may be any compound having at least two epoxy groups in one molecule, such as bisphenol A diglycidyl ether type.
DER332 (product name of Dow Company), Epicote 828 (product name of Ciel Company), GY-255 (product name of Ciba Company), etc.
Novolac type DEN431 (Dow company product name),
There are alicyclic types such as CY-179 (trade name of Ciba Corporation), and these can be used alone or in combination.
本発明で用いることのできる上記一般式（）
のアリルエポキシ化合物としては、２−アリルフ
エニルグリシジルエーテル、２−アリル−５−メ
チルフエニルグリシジルエーテル、２−アリル−
４−メチルフエニルグリシジルエーテルなどがあ
る。一般式（）中Ｒは水素、ハロゲン、又は一
価の有機基、例えばアルキル基などである。 The above general formula () that can be used in the present invention
The allyl epoxy compounds include 2-allylphenyl glycidyl ether, 2-allyl-5-methylphenyl glycidyl ether, 2-allyl-
Examples include 4-methylphenyl glycidyl ether. In the general formula (), R is hydrogen, halogen, or a monovalent organic group, such as an alkyl group.
また、本発明で用いることのできる液状の環状
酸無水物としては、メチルテトラヒドロフタル酸
無水物、メチルヘキサヒドロフタル酸無水物、メ
チルエンドメチレンヘキサヒドロフタル酸無水物
などがある。 Furthermore, examples of liquid cyclic acid anhydrides that can be used in the present invention include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, and methylendomethylenehexahydrophthalic anhydride.
さらに、本発明で用いることのできる重合性二
重結合を有する化合物としては、スチレン、ビニ
ルトルエン、ジビニルベンゼン、ジアクリレート
類、ジメタクリレート類、トリメチロールプロパ
ントリアクリレート、トリヒドロキシエチルイソ
シアヌレートトリアクリレート、トリヒドロキシ
エチルイソシアヌレートトリメタクリレート、ト
リアリルトリメリテート、トリアリルイソシアヌ
レートなどがあり、これらを単独あるいは混合し
て用いることができる。 Further, compounds having a polymerizable double bond that can be used in the present invention include styrene, vinyltoluene, divinylbenzene, diacrylates, dimethacrylates, trimethylolpropane triacrylate, trihydroxyethyl isocyanurate triacrylate, Examples include trihydroxyethyl isocyanurate trimethacrylate, triallyl trimellitate, and triallyl isocyanurate, and these can be used alone or in combination.
アリルエポキシ化合物の配合量はエポキシ化合
物100部に対し、0.1〜100部が望ましい。配合量
が0.1部に満たない場合には、エポキシ成分とビ
ニル成分との橋かけが十分でなく添加効果が示さ
れず、また、100部を越えるとアリルエポキシ化
合物の単独の性質が大きく出ることにより、組成
物の性質の低下（機械強度の低下、電気特性の悪
化）を招く。 The amount of allyl epoxy compound blended is preferably 0.1 to 100 parts per 100 parts of epoxy compound. If the amount is less than 0.1 part, the cross-linking between the epoxy component and the vinyl component will not be sufficient and the addition effect will not be shown, and if it exceeds 100 parts, the independent properties of the allyl epoxy compound will become significant. , resulting in a decrease in the properties of the composition (deterioration in mechanical strength, deterioration in electrical properties).
液状の環状酸無水物の配合量は、エポキシ化合
物100部に対し50〜150部が望ましい。配合量が50
部に満たないと架橋密度が不十分で特性の低下を
招き、150部を越えると未反応成分の存在により
硬化不十分となる。 The blending amount of the liquid cyclic acid anhydride is preferably 50 to 150 parts per 100 parts of the epoxy compound. The amount is 50
If the amount is less than 150 parts, the crosslinking density will be insufficient and the properties will deteriorate, and if it exceeds 150 parts, the curing will be insufficient due to the presence of unreacted components.
重合性二重結合を有する化合物はエポキシ化合
物100部に対し５〜300部の範囲で配合することが
望ましい。配合量が５部に満たないと、ビニル化
合物の添加効果（低粘度化など）が得られず、
300部を越えると収縮率が大きくなりすぎ樹脂と
しての性質が低下する。 The compound having a polymerizable double bond is desirably blended in an amount of 5 to 300 parts per 100 parts of the epoxy compound. If the blending amount is less than 5 parts, the effect of adding the vinyl compound (lower viscosity, etc.) cannot be obtained,
If it exceeds 300 parts, the shrinkage rate becomes too large and the properties as a resin deteriorate.
さらに、樹詩への接着性の向上、可撓性付与の
観点からは、フエノキシ樹脂の添加効果が大き
く、エポキシ化合物100部に対し分子量10000〜
50000のフエノキシ樹脂を10部を越えない範囲で
加えることができる。添加量が10部を越えると粘
度上昇が大きく実用に耐え得ない。 Furthermore, from the viewpoint of improving adhesion to trees and imparting flexibility, the addition of phenoxy resin has a large effect, with a molecular weight of 10,000 to 10,000 parts per 100 parts of epoxy compound.
50,000 phenoxy resin may be added in an amount not exceeding 10 parts. If the amount added exceeds 10 parts, the viscosity increases so much that it cannot be put to practical use.
本発明によるエポキシ含浸樹脂組成物の反応を
促進する目的で、触媒の添加が効果的である。エ
ポキシ化合物の反応を促進する触媒としては、コ
バルトアセチルアセトネート、オクチル酸亜鉛、
オクチル酸錫などの有機金属塩類、イミダゾール
類、BF3，BCl3等のルイス酸類などがある。 Addition of a catalyst is effective for promoting the reaction of the epoxy-impregnated resin composition according to the present invention. Catalysts that promote the reaction of epoxy compounds include cobalt acetylacetonate, zinc octylate,
Examples include organic metal salts such as tin octylate, imidazoles, and Lewis acids such as BF 3 and BCl 3 .
また、さらにジクミルパーオキサイド、ベンゾ
イルパーオキサイドなどのパーオキサイド、アゾ
ビスイソブチロニトリルなどビニル重合開始触媒
を用いることにより、硬化を促進することができ
る。 Furthermore, curing can be accelerated by using a peroxide such as dicumyl peroxide or benzoyl peroxide, or a vinyl polymerization initiation catalyst such as azobisisobutyronitrile.
上記のようにして得られた本発明のエポキシ含
浸樹脂組成物は、低粘度で含浸性にすぐれるのは
もちろん、電気特性、機械特性の良好な硬化物を
与える。 The epoxy-impregnated resin composition of the present invention obtained as described above not only has low viscosity and excellent impregnating properties, but also provides a cured product with good electrical and mechanical properties.
以下実施例に基づき本発明を詳細に説明する。 The present invention will be explained in detail below based on Examples.
実施例 １
エポキシ化合物としてエピコート828（シエル
社商品名）80部に対し、２−アリルフエニルグリ
シジルエーテル20部、トリメチロールブロパント
リアクリレート20部、スチレン20部、メチルテト
ラヒドロフタル酸無水物80部を加え、触媒として
ジクミルパーオキサイド0.05部、オクチル酸亜鉛
0.5部を添加し、エポキシ含浸樹脂組成物とし
た。この樹脂の初期粘度は25℃で50センチポイズ
であつた。含浸樹脂のポツトライフは、樹脂を温
度25℃、相対湿度35％の恒温恒湿槽中に放置し、
粘度を定期的に測定することにより追跡した。即
ち、この測定での25℃の粘度が400センチポイズ
に達するまでの日数をポツトライフとした。その
結果、この含浸樹脂は６ケ月以上のポツトライフ
を示した。Example 1 20 parts of 2-allylphenyl glycidyl ether, 20 parts of trimethylolpropane triacrylate, 20 parts of styrene, and 80 parts of methyltetrahydrophthalic anhydride were added to 80 parts of Epicote 828 (trade name of Ciel Corporation) as an epoxy compound. and 0.05 part of dicumyl peroxide and zinc octylate as a catalyst.
0.5 part was added to prepare an epoxy-impregnated resin composition. The initial viscosity of this resin was 50 centipoise at 25°C. The pot life of the impregnated resin is determined by leaving the resin in a constant temperature and humidity chamber at a temperature of 25°C and a relative humidity of 35%.
The viscosity was followed by periodic measurements. That is, the number of days until the viscosity at 25°C reached 400 centipoise in this measurement was defined as the pot life. As a result, this impregnated resin showed a pot life of 6 months or more.
次にこの樹脂を110℃で６時間、150℃で16時間
加熱硬化させ硬化物とした。 Next, this resin was cured by heating at 110°C for 6 hours and at 150°C for 16 hours to obtain a cured product.
この硬化物の曲げ強度は25℃で11Kg／mm2を示
し、200℃で16日後の加熱重量減少は1.0％と良好
な特性を示した（JIS C2103による）。また、こ
のものの誘電正接は100℃で１％以下と良好な特
性を示した（JIS C2103による）。皮膚刺激性試
験では、皮膚にいかなる変化も観測されなかつ
た。 The bending strength of this cured product was 11 Kg/mm 2 at 25°C, and the weight loss after heating at 200°C for 16 days was 1.0%, showing good properties (according to JIS C2103). Furthermore, the dielectric loss tangent of this material was 1% or less at 100°C, showing good properties (according to JIS C2103). In the skin irritation test, no changes were observed on the skin.
実施例 ２
エポキシ化合物としてGY−255（チバ社商品
名）100部に対し、２−アリルフエニルグリシジ
ルエーテル0.1部、トリヒドロキシエチルイソシ
アヌレートトリアクリレート20部、スチレン20
部、メチルエンドメチレンテトラヒドロフタル酸
無水物90部、触媒としてジクミルパーオキサイド
0.1部、およびコバルドアセチルアセトネート0.3
部を添加し、エポキシ含浸樹脂組成物とした。Example 2 As an epoxy compound, 0.1 part of 2-allylphenyl glycidyl ether, 20 parts of trihydroxyethyl isocyanurate triacrylate, and 20 parts of styrene were added to 100 parts of GY-255 (trade name of Ciba Corporation).
parts, 90 parts of methylendomethylenetetrahydrophthalic anhydride, dicumyl peroxide as catalyst
0.1 parts, and 0.3 parts of cobald acetylacetonate
part was added to prepare an epoxy-impregnated resin composition.
この樹脂の初期粘度は、25℃で60センチポイズ
であつた。 The initial viscosity of this resin was 60 centipoise at 25°C.
含浸樹脂のポツトライフを実施例１と同様の方
法で測定し、400センチポイズに達するまでの日
数で６ケ月以上のポツトライフを示した。 The pot life of the impregnated resin was measured in the same manner as in Example 1, and it showed a pot life of 6 months or more based on the number of days until it reached 400 centipoise.
次にこの樹脂を120℃で６時間、150℃で16時間
加熱硬化させ硬化物とした。 Next, this resin was cured by heating at 120°C for 6 hours and at 150°C for 16 hours to obtain a cured product.
この硬化物の曲げ強度は25℃で12Kg／mm2を示
し、200℃で16日後の加熱重量減少は1.2％と良好
な特性を示した（JIS C2103による）。 The bending strength of this cured product was 12 Kg/mm 2 at 25°C, and the weight loss after heating at 200°C for 16 days was 1.2%, showing good properties (according to JIS C2103).
また、このものの誘電正接は100℃で１％以下
と良好な特性を示した（JIS C2103による）。 Furthermore, the dielectric loss tangent of this material was 1% or less at 100°C, showing good properties (according to JIS C2103).
実施例 ３
エポキシ化合物としてGY−255（チバ社商品
名）100部に対し、分子量約30000のフエノキシ樹
脂0.1部、４−メチル−２−アリルフエニルグリ
シジルエーテル３部、トリヒドロキシエチルイソ
シアヌレートトリメタクリレート10部、トリアリ
ルトリメリテート10部、ビニルトルエン５部、メ
チルヘキサヒドロフタル酸無水物88部、触媒とし
てジクミルパーオキサイド0.2部、BF3−モノエ
チルアミン0.5部を添加し、エポキシ含浸樹脂組
成物とした。Example 3 0.1 part of phenoxy resin with a molecular weight of about 30,000, 3 parts of 4-methyl-2-allylphenyl glycidyl ether, and trihydroxyethyl isocyanurate trimethacrylate to 100 parts of GY-255 (trade name of Ciba Corporation) as an epoxy compound. 10 parts of triallyl trimellitate, 5 parts of vinyltoluene, 88 parts of methylhexahydrophthalic anhydride, 0.2 parts of dicumyl peroxide as a catalyst, and 0.5 parts of BF3 -monoethylamine were added to form an epoxy-impregnated resin composition. I made it into a thing.
この樹脂の初期粘度は25℃で60センチポイズ達
するまでの日数で６ケ月以上のポツトライフを示
した。 This resin had a pot life of more than 6 months until the initial viscosity reached 60 centipoise at 25°C.
次にこの樹脂を110℃で６時間、160℃で16時間
加熱硬化させ硬化物とした。 Next, this resin was cured by heating at 110°C for 6 hours and at 160°C for 16 hours to obtain a cured product.
この硬化物の曲げ強度は25℃で125Kg／mm2を示
し、200℃で16日後の加熱重量減少は0.8％と良好
な特性を示した（JIS C2103による）。 The bending strength of this cured product was 125 Kg/mm 2 at 25°C, and the weight loss after heating at 200°C for 16 days was 0.8%, showing good properties (according to JIS C2103).
また、このものの誘電正接は100℃で１％以下
と良好な特性を示した（JIS C2103による）。 Furthermore, the dielectric loss tangent of this material was 1% or less at 100°C, showing good properties (according to JIS C2103).
実施例 ４
エポキシ化合物としてDER332（ダウ社商品
名）100部に対し、分子量約30000のフエノキシ樹
脂1.0部、２−アリルフエニルグリシジルエーテ
ル５部、トリヒドロキシエチル−イソシアヌレー
トトリアクリレート30部、トリアリルイソシアヌ
レート５部、メチルテトラヒドロフタル酸無水物
90部を加え、触媒としてベンゾイルパーオキサイ
ド0.1部、オクチル酸亜鉛0.3部を添加し、エポキ
シ含浸樹脂組成物とした。Example 4 For 100 parts of DER332 (trade name of Dow Corporation) as an epoxy compound, 1.0 part of phenoxy resin with a molecular weight of about 30,000, 5 parts of 2-allylphenyl glycidyl ether, 30 parts of trihydroxyethyl isocyanurate triacrylate, and triallyl. 5 parts of isocyanurate, methyltetrahydrophthalic anhydride
Then, 0.1 part of benzoyl peroxide and 0.3 part of zinc octylate were added as catalysts to obtain an epoxy-impregnated resin composition.
この樹脂の粘度は25℃で70センチポイズであつ
た。 The viscosity of this resin was 70 centipoise at 25°C.
含浸樹脂のポツトライフは実施例１と同様の方
法で測定し、400センチポイズに達するまでの日
数が６ケ月以上であつた。 The pot life of the impregnated resin was measured in the same manner as in Example 1, and it took more than 6 months to reach 400 centipoise.
次にこの樹脂を120℃で６時間、150℃で16時間
加熱硬化させ硬化物とした。 Next, this resin was cured by heating at 120°C for 6 hours and at 150°C for 16 hours to obtain a cured product.
この硬化物の曲げ強度は25℃で11Kg／mm2を示
し、200℃で16日後の加熱重量減少は1.0％と良好
な値を示した（JIS C2103による）。 The bending strength of this cured product was 11 Kg/mm 2 at 25°C, and the weight loss after heating at 200°C for 16 days was a good value of 1.0% (according to JIS C2103).
また、このものの誘電正接は100℃で１％以下
であつた（JIS C2103による）。 Further, the dielectric loss tangent of this material was 1% or less at 100°C (according to JIS C2103).
以上のように本発明のエポキシ含浸樹脂組成物
は、低粘度で含浸性にすぐれ、電気特性、機械特
性の良好な硬化物を与える効果がある。
As described above, the epoxy-impregnated resin composition of the present invention has a low viscosity, excellent impregnation properties, and has the effect of providing a cured product with good electrical properties and mechanical properties.
Claims (1)
するエポキシ化合物100重量部に対し、一般式
（）で示され一分子中にアリル基とエポキシ基
を併せもつアリルエポキシ化合物 （Ｒは水素、ハロゲン、又は一価の有機基） 0.1〜100重量部、液状の環状酸無水物50〜150重
量部、および重合性二重結合を有する化合物５〜
300重量部を配合してなることを特徴とするエポ
キシ含浸樹脂組成物。 ２ エポキシ含浸樹脂組成物が、エポキシ化合物
100重量部に対し、分子量10000〜50000のフエノ
キシ樹脂を10重量部以下の範囲で配合してなる特
許請求の範囲第１項記載のエポキシ含浸樹脂組成
物。[Scope of Claims] 1. An allyl epoxy compound having both an allyl group and an epoxy group in one molecule, which is represented by the general formula (), based on 100 parts by weight of an epoxy compound having at least two epoxy groups in one molecule. (R is hydrogen, halogen, or a monovalent organic group) 0.1 to 100 parts by weight, 50 to 150 parts by weight of a liquid cyclic acid anhydride, and 5 to 5 parts of a compound having a polymerizable double bond.
An epoxy-impregnated resin composition characterized in that it contains 300 parts by weight. 2 The epoxy-impregnated resin composition is an epoxy compound
The epoxy-impregnated resin composition according to claim 1, which contains a phenoxy resin having a molecular weight of 10,000 to 50,000 in an amount of 10 parts by weight or less per 100 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13286784A JPS6112718A (en) | 1984-06-29 | 1984-06-29 | Epoxy impregnated resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13286784A JPS6112718A (en) | 1984-06-29 | 1984-06-29 | Epoxy impregnated resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6112718A JPS6112718A (en) | 1986-01-21 |
| JPS6257648B2 true JPS6257648B2 (en) | 1987-12-02 |
Family
ID=15091400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13286784A Granted JPS6112718A (en) | 1984-06-29 | 1984-06-29 | Epoxy impregnated resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6112718A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61148230A (en) * | 1984-12-21 | 1986-07-05 | Hitachi Chem Co Ltd | Thermosetting resin composition |
| JPH01278523A (en) * | 1988-04-28 | 1989-11-08 | Kanegafuchi Chem Ind Co Ltd | Resin composition and fiber-reinforced composite material consisting thereof |
| JP2015000952A (en) * | 2013-06-17 | 2015-01-05 | 三菱化学株式会社 | Epoxy resin composition and cured product thereof |
| WO2022039121A2 (en) * | 2020-08-17 | 2022-02-24 | 東亞合成株式会社 | Thermosetting resin composition |
-
1984
- 1984-06-29 JP JP13286784A patent/JPS6112718A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6112718A (en) | 1986-01-21 |
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