JPS6257341B2 - - Google Patents
Info
- Publication number
- JPS6257341B2 JPS6257341B2 JP52053377A JP5337777A JPS6257341B2 JP S6257341 B2 JPS6257341 B2 JP S6257341B2 JP 52053377 A JP52053377 A JP 52053377A JP 5337777 A JP5337777 A JP 5337777A JP S6257341 B2 JPS6257341 B2 JP S6257341B2
- Authority
- JP
- Japan
- Prior art keywords
- grid
- screen
- pattern
- conductive layer
- ray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 29
- 230000000903 blocking effect Effects 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims description 6
- 239000012780 transparent material Substances 0.000 claims description 5
- 238000001259 photo etching Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000002601 radiography Methods 0.000 claims 1
- 238000005323 electroforming Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Apparatus For Radiation Diagnosis (AREA)
Description
【発明の詳細な説明】
本発明はＸ線撮影用グリツドの製造方法に関す
るものであり、特に電鋳法により鉛スクリーンを
作製し、この鉛スクリーンを複数枚接着積層して
Ｘ線撮影用グリツドを製造する方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an X-ray imaging grid, and in particular, a lead screen is produced by electroforming, and a plurality of lead screens are bonded and laminated to form an X-ray imaging grid. It relates to a manufacturing method.
Ｘ線撮影をする場合、被写体の内部でＸ線の吸
収と散乱が起こり、Ｘ線像は主線束の減弱により
形成されるため、被写体の内部で生じる散乱線は
鮮明なＸ線像形成をさまたげる。被写体からの散
乱線を除去するため、感光フイルム前面にグリツ
ドが配置される。かかる、グリツド１は第１図に
示される如く、Ｘ線遮断物質２と透過物質３とを
適当な厚さに配置してなるものである。しかして
Ｘ線撮影に当つて、主線５束は透過物質３を通し
て透過するが、散乱線６は遮断物質２に当たり、
透過しないようにして、主線束のみをグリツド１
を透過するように構成し、鮮明なＸ線像を得るも
のである。かかるグリツド１の製造に於いて、従
来はt1の厚さの遮断物質２例えば、鉛板とt2の厚
さの透過物質３例えば、プラスチツク板とを矢印
７方向に交互に順次積層して製造していた。一般
にt1，t2はそれぞれ0.05mm、0.3mmであり、又必要
とされるグリツドの幅は40mm位であるから、かか
るグリツドを製造するには極めて多くの枚数の遮
断物質２、透過物質３を積層しなければならない
ため、製造困難なものであつた。 When performing X-ray photography, absorption and scattering of X-rays occur inside the subject, and the X-ray image is formed by attenuation of the principal ray flux, so the scattered rays generated inside the subject hinder the formation of a clear X-ray image. . A grid is placed in front of the photosensitive film to remove scattered radiation from the subject. As shown in FIG. 1, the grid 1 is made up of an X-ray blocking material 2 and a transmitting material 3 arranged at appropriate thicknesses. During X-ray photography, the 5 principal rays pass through the transmitting material 3, but the scattered rays 6 hit the blocking material 2.
Make only the main line bundle grid 1 so that it does not pass through.
The X-ray is constructed so that it transmits light, thereby obtaining a clear X-ray image. In manufacturing such a grid 1, conventionally, a blocking material 2 having a thickness of t 1 and a transparent material 3 having a thickness of t 2 , such as a plastic plate, are alternately and sequentially laminated in the direction of the arrow 7. was manufacturing. Generally, t 1 and t 2 are 0.05 mm and 0.3 mm, respectively, and the required width of the grid is about 40 mm, so in order to manufacture such a grid, an extremely large number of blocking materials 2 and transmitting materials 3 are required. It was difficult to manufacture because it required laminating layers.
本発明は従来のかかる欠点を改良するために発
明されたものであり、電鋳法により鉛スクリーン
を複数枚作製し、これを積層してなるグリツドの
製造方法に関するものである。 The present invention was invented in order to improve these conventional drawbacks, and relates to a method for producing a grid by producing a plurality of lead screens by electroforming and laminating them.
以下、一実施例により本発明を詳細に説明す
る。第２図に示す如く、パターンフイルム１０は
製造すべきグリツドのパターン（遮断物質と透過
物質の平面形状）と同様のパターン１１を有する
写真フイルムであり、即ち、かかるパターン１１
は製造すべきグリツドの遮断物質に相当する幅t1
の透明部分１２と透過物質に相当する幅t2の非透
明部分１３とよりなるものである。 Hereinafter, the present invention will be explained in detail using one example. As shown in FIG. 2, the pattern film 10 is a photographic film having a pattern 11 similar to the pattern of the grid to be manufactured (planar shape of the blocking material and the transmitting material).
is the width t 1 corresponding to the blocking material of the grid to be produced
, and a non-transparent part 13 having a width t 2 corresponding to the transparent material.
このパターンフイルム１０は光学機械等によ
り、パターンを描き、これを銀塩写真フイルムに
縮小撮影等の方法で得ることができる。 This pattern film 10 can be obtained by drawing a pattern using an optical machine or the like and then reducing the pattern onto a silver salt photographic film.
一方、感光板２０はＸ線透過物質例えば、塩化
ビニルシート、ポリエステルシート、ポリカーボ
ネートシート等の合成樹脂シートよりなるスクリ
ーン基材２１表面に導電層２２を形成し、さらに
その表面にフオトエツチング用感光層２３を形成
してなるものである。導電層２２の形成方法とし
ては、銅、アルミニウム等のエツチング可能な金
属をメツキ法、塗まつ法、蒸着法等によつてスク
リーン基材に施す、又はスクリーン基材に金属板
を接着する等の方法により形成することができ
る。又、感光層２３の形成方法としては、フオト
エツチング用感光剤例えばKPR（イーストマン
コダツク社製）、ポリビニルアルコール等の感光
剤をホワイラー塗布等の方法で形成することがで
きる。 On the other hand, the photosensitive plate 20 has a conductive layer 22 formed on the surface of a screen base material 21 made of an X-ray transparent material such as a synthetic resin sheet such as a vinyl chloride sheet, a polyester sheet, a polycarbonate sheet, and a photosensitive layer for photoetching on the surface. 23. The conductive layer 22 can be formed by applying an etched metal such as copper or aluminum to the screen base material by plating, coating, vapor deposition, etc., or by bonding a metal plate to the screen base material. It can be formed by a method. The photosensitive layer 23 can be formed by using a photosensitive agent such as KPR (manufactured by Eastman Kodak Co., Ltd.), polyvinyl alcohol, etc., by whiter coating.
このようにしてなる感光板２０上に前記パター
ンフイルム１０を重ね合わせて、密着し、適当な
光源で露光し、現像した後腐蝕液にてエツチング
処理を施し、さらにフオトレジストを剥離して第
３図に示す如き遮断物質を形成すべきパターンに
導電層２２′が形成されたスクリーン基材２１を
得る。 The pattern film 10 is superimposed on the photosensitive plate 20 formed in this manner, adhered to the photosensitive plate 20, exposed to light with an appropriate light source, developed, and then etched with an etchant. A screen base material 21 is obtained in which a conductive layer 22' is formed in a pattern in which a blocking material is to be formed as shown in the figure.
上記フオトエツチング方法はよく知られた技術
であるので、鮮細な説明は省略する。 Since the above-mentioned photoetching method is a well-known technique, detailed explanation will be omitted.
次にこのようにしてなるスクリーン基材２１に
Ｘ線遮断物質例えば、鉛を電鋳して第４図に示す
如きスクリーン基材２１上の導電層２２′上に遮
断物質２４の電鋳されたスクリーン２５を得る。
遮断物質の電鋳厚d2としては、スクリーンのピツ
チにもよるが0.4mmmm〜0.6mmmmが適当であり、そ
れ以上厚く形成すると遮断物質２４のパターン精
度が得られないので、好ましくなく、又あまり薄
くすると積層枚数を増さなければならず好ましく
ない。 Next, an X-ray blocking material such as lead is electroformed on the screen base material 21 thus formed, and a blocking material 24 is electroformed on the conductive layer 22' on the screen base material 21 as shown in FIG. Screen 25 is obtained.
The appropriate electroforming thickness d2 of the blocking material is 0.4mmmm to 0.6mmmm, although it depends on the pitch of the screen.If it is formed thicker than that, the pattern accuracy of the blocking material 24 cannot be obtained, so it is not preferable and If it is made thinner, the number of laminated sheets must be increased, which is not preferable.
このようにして得られたスクリーン２５を複数
枚作製し、第５図に示す如く接着剤３０により位
置を合わせて接着積層してＸ線撮影用グリツド３
１を完成する。 A plurality of screens 25 obtained in this manner are manufactured, and as shown in FIG.
Complete 1.
この積層に当つて接着剤３０として光硬化性樹
脂例えば、アサヒフオトレジスト（旭化成社製）
を用い、先ず１枚目のスクリーン２５１と２枚目
のスクリーン２５２とを接着剤３０を介して位置
を合わせて重ね合わせ、適当な光源により光を当
てて接着剤３０を硬化せしめ、次に３枚目のスク
リーン２５３を同様な方法で接着し、順次積層す
ることにより、スクリーン２５の遮断物質２４の
相互の位置を正確に接着することができる。 In this lamination, a photocurable resin is used as the adhesive 30, such as Asahi Photoresist (manufactured by Asahi Kasei Co., Ltd.).
First, the first screen 25 1 and the second screen 25 2 are aligned and overlapped via the adhesive 30, and the adhesive 30 is cured by applying light from an appropriate light source. By bonding the third screen 253 in the same manner and stacking them one after another, the mutual positions of the blocking materials 24 of the screen 25 can be bonded accurately.
このようにして４〜７枚のスクリーン２５を積
層してＸ線撮影用グリツド３１を完成する。 In this way, four to seven screens 25 are stacked to complete the X-ray imaging grid 31.
又、従来のグリツドは遮断物質２が全て平行に
配置されていたため、その周縁に於いて主線５束
に対し遮断物質２が平行にならず、カツトオフが
生じたが、これを解消するグリツドとして、第６
図に示す如く１枚目〜ｎ枚目の各スクリーンの遮
断物質２４１〜２４oの配置を主線５に対し平行
となるように配置すれば良い。 In addition, in the conventional grid, all the blocking substances 2 were arranged in parallel, so the blocking substances 2 were not parallel to the 5 main line bundles at the periphery, resulting in cut-off, but as a grid to solve this problem, 6th
As shown in the figure, the blocking materials 24 1 to 24 o of the first to nth screens may be arranged parallel to the main line 5.
この場合、各スクリーン２５１〜２５oを作る
ための対応したパターンのパターンフイルムを用
意し製造すれば良い。 In this case, pattern films with corresponding patterns for making each screen 25 1 to 25 o may be prepared and manufactured.
又、従来のグリツドの製法では万線状のグリツ
ドしか製造し得なかつたが、パターンフイルムの
パターンを格子状、蜂の巣状とすることにより、
格子状、蜂の巣状のグリツドが製造し得る。これ
により両方向の散乱線を除去し得る。 In addition, conventional grid manufacturing methods could only produce grids in the form of parallel lines, but by making the pattern of the pattern film into a grid or honeycomb pattern,
Lattice-like, honeycomb-like grids can be produced. This makes it possible to remove scattered radiation in both directions.
本発明は以上の如き構成であるから、従来の製
造方法に比較し、極めて容易に製造し得るととも
に、周縁部に於ける主線束のカツトオフの無いグ
リツドを得ることができ、又、任意のパターンの
グリツドが製造し得る。従つて両方向散乱線を除
去できるグリツドを製造し得る。 Since the present invention has the above-described structure, it can be manufactured extremely easily compared to conventional manufacturing methods, and it is also possible to obtain a grid without cut-off of the main wire bundle at the periphery. grids can be produced. It is therefore possible to produce a grid that can eliminate bidirectionally scattered radiation.
＜実施例 １＞
万線状パターンを作成し、これを感光フイルム
と一定スペースをあけて配置し、光源を左右に振
ることにより、透明部の幅を調節する方式により
感光フイルムを撮影し、現像処理して透明部分の
幅0.05mm、非透明部分の幅0.3mmの万線パターン
のパターンフイルムを用意した。次に、厚さ0.15
mmのポリエステルシートに銅を２〜３μｍ厚に銅
をメツキして導電層を形成し、フオトエツチング
用感光剤としてKPRをホワイラー塗布し、感光
板を得た。次に、該感光板にパターンフイルムを
密着して重ね合わせ、水銀燈で露光し、KPR用
現像剤にて現像した。次に、塩化第二鉄溶液にて
フオトレジストの形成されてない部分の導電層を
腐蝕し、次に、トリクレンによりフオトレジスト
を剥離して導電層をパターン化した。<Example 1> A linear pattern is created, placed at a certain distance from the photosensitive film, and the photosensitive film is photographed and developed using a method in which the width of the transparent part is adjusted by swinging the light source from side to side. After processing, a patterned film with a line pattern with a width of 0.05 mm in the transparent part and a width of 0.3 mm in the non-transparent part was prepared. Then thickness 0.15
A conductive layer was formed by plating copper to a thickness of 2 to 3 .mu.m on a 2-3 .mu.m thick polyester sheet, and a photosensitive plate was obtained by whiter coating KPR as a photosensitizer for photoetching. Next, a pattern film was closely placed on the photosensitive plate, exposed to light using a mercury lamp, and developed using a KPR developer. Next, the portions of the conductive layer where the photoresist was not formed were corroded with a ferric chloride solution, and then the photoresist was peeled off with trichlene to pattern the conductive layer.
次に、この導電層に鉛を0.5〜0.6mm厚に電鋳し
て遮断層を形成し、スクリーンを得た。 Next, a shielding layer was formed by electroforming lead to a thickness of 0.5 to 0.6 mm on this conductive layer to obtain a screen.
同様の工程で５枚のスクリーンを用意し、アサ
ヒフオトレジストを塗布して１枚目のスクリーン
と２枚目のスクリーンを位置合わせして、重ね合
わせ、水銀燈により光を当てて前記光硬化性樹脂
を硬化して１枚目のスクリーンと２枚目のスクリ
ーンとを接着した。 Prepare five screens in the same process, apply Asahi photoresist, align the first screen and second screen, overlap them, and apply light with a mercury lamp to make the photocurable resin. was cured to adhere the first screen and the second screen.
同様の工程で全５枚のスクリーンを接着積層し
てＸ線撮影用グリツドを完成した。 Using the same process, all five screens were glued and laminated to complete an X-ray imaging grid.
図面は本発明の一実施例を示すもので、第１図
は従来のグリツドの断面図、第２図〜第５図は本
発明の製造工程を示す断面図であり、第２図は露
光工程、第３図はパセターン化された導電層の形
成されたスクリーン基材、第４図はスクリーン、
第５図は完成されたグリツドをそれぞれ示し、第
６図は他の実施例のグリツドの断面図である。
５……主線、６……散乱線、１０……パターン
フイルム、１１……パターン、２０……感光板、
２１……スクリーン基材、２２……導電層、２３
……感光層、２５……スクリーン、３０……接着
剤、３１……グリツド。
The drawings show one embodiment of the present invention; FIG. 1 is a sectional view of a conventional grid, FIGS. 2 to 5 are sectional views showing the manufacturing process of the present invention, and FIG. 2 is a sectional view of the exposure process. , FIG. 3 shows a screen base material on which a patterned conductive layer is formed, FIG. 4 shows a screen,
FIG. 5 shows each completed grid, and FIG. 6 is a cross-sectional view of another embodiment of the grid. 5... Main line, 6... Scattered line, 10... Pattern film, 11... Pattern, 20... Photosensitive plate,
21... Screen base material, 22... Conductive layer, 23
...Photosensitive layer, 25...Screen, 30...Adhesive, 31...Grid.
Claims (1)
ツドのパターンに対応するパターンの導電層が形
成され、該導電層にＸ線遮断物質が電鋳されたス
クリーンを複数枚接着積層してなるＸ線撮影用グ
リツドの製造方法において、Ｘ線透過物質よりな
るスクリーン基材にフオトエツチング法により所
望のパターンの導電層を形成し、該導電層にＸ線
遮断物質を電鋳してスクリーンを得、該スクリー
ンを複数枚接着剤にて接着することを特徴とする
Ｘ線撮影用グリツドの製造方法。 ２ 接着剤が光硬化性樹脂である第１項記載のＸ
線撮影用グリツドの製造方法。[Claims] 1. A conductive layer with a pattern corresponding to the grid pattern is formed on a screen base material made of an X-ray transparent material, and a plurality of screens each having an X-ray blocking material electroformed on the conductive layer are bonded and laminated. In the method for manufacturing an X-ray imaging grid, a conductive layer with a desired pattern is formed on a screen base material made of an X-ray transparent material by a photoetching method, and an X-ray blocking material is electroformed on the conductive layer. A method for producing an X-ray imaging grid, which comprises obtaining a screen and bonding a plurality of screens with an adhesive. 2. X according to item 1, wherein the adhesive is a photocurable resin.
A method of manufacturing a grid for radiography.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5337777A JPS53138294A (en) | 1977-05-10 | 1977-05-10 | Xxray camera grid and method of producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5337777A JPS53138294A (en) | 1977-05-10 | 1977-05-10 | Xxray camera grid and method of producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53138294A JPS53138294A (en) | 1978-12-02 |
| JPS6257341B2 true JPS6257341B2 (en) | 1987-11-30 |
Family
ID=12941121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5337777A Granted JPS53138294A (en) | 1977-05-10 | 1977-05-10 | Xxray camera grid and method of producing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53138294A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007024156B3 (en) * | 2007-05-24 | 2008-12-11 | Siemens Ag | X-ray absorption grating |
| JP5660910B2 (en) * | 2010-03-30 | 2015-01-28 | 富士フイルム株式会社 | Method for manufacturing grid for radiographic imaging |
| CN105139913B (en) * | 2015-09-08 | 2017-10-13 | 清华大学 | A kind of grating and radiation imaging apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5074391A (en) * | 1973-10-31 | 1975-06-19 | ||
| JPS5074389A (en) * | 1973-10-31 | 1975-06-19 |
-
1977
- 1977-05-10 JP JP5337777A patent/JPS53138294A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5074391A (en) * | 1973-10-31 | 1975-06-19 | ||
| JPS5074389A (en) * | 1973-10-31 | 1975-06-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53138294A (en) | 1978-12-02 |
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