JPS6257275B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for processing micro pins with minute dimensions used as micro connectors for mounting superconducting elements.

Conventionally, to manufacture connectors with relatively large dimensions and shapes, processing methods such as cutting, rolling, press punching, etc. have been applied because the pin spacing is large and the diameter of each pin is large.

With these processing methods, it is impossible to form micro pins with minute dimensions and shapes used as the micro connector for mounting superconducting elements of the present invention, and there are no examples.

The present invention is characterized in that the pin seat of the micro pin is polygonal, and its purpose is to provide a processing method that makes it possible to form the micro pin by cutting or electrical discharge machining the blank of the micro pin. It is in.

FIG. 1 shows a perspective view of an embodiment of a micropin having a polygonal pin seat formed by the processing method of the present invention. 1 is a micro pin with a polygonal pin seat, 2 is a Si foot or wiring module, 2
Reference numeral a represents a wiring pattern, and reference numeral 3 represents a solder bump that connects the micro pin 1 to the Si foot or wiring module 2. The micro pin 1 is made of a material with good conductivity, such as platinum in this embodiment. The dimensions of each part are: pin diameter 1a is 100 μm or less;
The height 1a' of the micro pin is 150 to 200 μm, the side 1b of the pin seat is approximately 150 to 200 μm, and the height of the pin seat is approximately 150 to 200 μm.
1b' is very small, about 50 μm. Furthermore, the micro pins 1 are arranged in such a way that the distance between the micro pins is 1000 μm at most, and they are arranged in a staggered manner, with a total of 60 micro pins in one row and two rows.
One set consists of 120 pieces.

FIG. 2 is a part of a blank plan view of an embodiment in which 120 micropins are formed at once by the processing method of the present invention. 1'' is a platinum sheet (indicated by a two-dot chain line), 1' is a micropin blank with a quadrilateral cross section, and 4 is a reinforcing plate. 5 is a groove width, and the depth of the groove is The thickness is greater than or equal to .

An embodiment of the processing method according to the present invention will be described in detail below.

(1) Attach a platinum sheet 1″ with a thickness equivalent to the total length of the micro pin to the reinforcing plate 4.

(2) After depositing solder (corresponding to 3 in Figure 1) on the exposed surface of the platinum sheet 1'', a groove with a groove width of 5 is bored by milling or electric discharge machining to form a blank for multiple micro pins. 1' is formed.

(3) Wiring pattern 2a is drawn in advance.
After positioning the silicon foot or wiring module 2 and the solder-deposited surface of the platinum sheet on which the micropin blank 1' is formed to face each other, pressure welding is performed by soldering, and then only the reinforcing plate 4 is bonded. Remove.

(4) A sheet in which 120 holes corresponding to the pin diameter 1a shown in Fig. 3 are punched with high precision in the Si foot or wiring module 2 on which the micropin blank 1' having a polygonal cross section is planted. The electric discharge machining electrode 6 is
The micropin shown in FIG. 1 can be formed by lowering the electrical discharge machining electrode 6 and electrical discharge machining the micropin blank 1' while applying a voltage between the micropin blank 1' and the micropin blank 1'.
Of course, a method of processing single pins one by one using a pipe-shaped electrode with an inner diameter corresponding to the pin diameter 1a may also be used.

As explained above, since the shape of the micro pin seat is polygonal, it is possible to mill the micro pin blank, and the pin diameter is processed after bonding to the silicon foot or wiring module. The advantage of this method is that it does not require much precision in the placement of pin blanks, such as the pitch of the pin blanks.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a micropin with a polygonal pin seat according to the present invention, FIG. 2 is a partial blank plan view of the micropin according to the present invention, and FIG. 3 is a perspective view showing the state of electrical discharge machining. . 1...Micro pin, 1a...Pin diameter, 1a'...
...Pin height, 1b...Pin seat side, 1b'...Pin seat height, 1'...Micro pin blank,
1''...Platinum sheet, 2...Si foot or wiring module, 2a...Wiring pattern, 3...Solder bump, 4...Reinforcement plate, 5...Groove width, 6...Electro discharge machining electrode.

Claims (1)

[Claims] 1 In a micropin processing method that forms micropins of a predetermined shape on a substrate, the first step is to attach a sheet made of micropin material with a thickness equivalent to the total length of the micropin to a reinforcing plate, and a second step of depositing solder on the exposed surface of the sheet and then forming grooves with a predetermined groove width on the sheet surface by milling or electrical discharge machining to form blanks for a plurality of micropins having polygonal cross sections; After positioning the Si foot or wiring module on which the wiring pattern has been drawn in advance and the solder-deposited surface of the sheet on which the micropin blank is formed so as to face each other, pressure welding is performed, and then the reinforcing plate is removed. The third step is the Si in which the micropin blank with a polygonal cross section is planted.
a fourth step of forming micro pins of a predetermined shape by subjecting the foot or wiring module to electrical discharge machining using a sheet-like electrode with openings corresponding to the diameter of the micro pins. Processing method for micro pins for mounting conductive elements.