JPS6256237U - - Google Patents
Info
- Publication number
- JPS6256237U JPS6256237U JP14910785U JP14910785U JPS6256237U JP S6256237 U JPS6256237 U JP S6256237U JP 14910785 U JP14910785 U JP 14910785U JP 14910785 U JP14910785 U JP 14910785U JP S6256237 U JPS6256237 U JP S6256237U
- Authority
- JP
- Japan
- Prior art keywords
- guide
- support base
- guide body
- piston
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 10
- 238000004080 punching Methods 0.000 description 2
Landscapes
- Punching Or Piercing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14910785U JPS6256237U (enExample) | 1985-09-30 | 1985-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14910785U JPS6256237U (enExample) | 1985-09-30 | 1985-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6256237U true JPS6256237U (enExample) | 1987-04-07 |
Family
ID=31064002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14910785U Pending JPS6256237U (enExample) | 1985-09-30 | 1985-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6256237U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05226539A (ja) * | 1992-02-13 | 1993-09-03 | Nec Yamagata Ltd | 半導体装置用切断金型 |
-
1985
- 1985-09-30 JP JP14910785U patent/JPS6256237U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05226539A (ja) * | 1992-02-13 | 1993-09-03 | Nec Yamagata Ltd | 半導体装置用切断金型 |
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