JPS6254213B2 - - Google Patents
Info
- Publication number
- JPS6254213B2 JPS6254213B2 JP54072490A JP7249079A JPS6254213B2 JP S6254213 B2 JPS6254213 B2 JP S6254213B2 JP 54072490 A JP54072490 A JP 54072490A JP 7249079 A JP7249079 A JP 7249079A JP S6254213 B2 JPS6254213 B2 JP S6254213B2
- Authority
- JP
- Japan
- Prior art keywords
- electrical insulating
- present
- insulating board
- functional derivative
- aromatic polyester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 125000003118 aryl group Chemical group 0.000 claims description 12
- 229920000728 polyester Polymers 0.000 claims description 11
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 10
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000004952 Polyamide Substances 0.000 claims description 9
- 229920002647 polyamide Polymers 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 5
- 238000010292 electrical insulation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 9
- 238000004080 punching Methods 0.000 description 9
- 239000011342 resin composition Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229920002292 Nylon 6 Polymers 0.000 description 3
- 229920002302 Nylon 6,6 Polymers 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- -1 alkylene glycols Chemical class 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 1
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- 239000004420 Iupilon Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 229910005965 SO 2 Inorganic materials 0.000 description 1
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229910052916 barium silicate Inorganic materials 0.000 description 1
- HMOQPOVBDRFNIU-UHFFFAOYSA-N barium(2+);dioxido(oxo)silane Chemical compound [Ba+2].[O-][Si]([O-])=O HMOQPOVBDRFNIU-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Description
本発明は電気絶縁板に関するものであり、さら
に詳しくは芳香族ジカルボン酸またはその誘導体
と二価フエノールまたはその誘導体とから得られ
る芳香族ポリエステル共重合体とポリアミドとか
らなる樹脂組成物よりなる基材とする耐熱性電気
絶縁板に関するものである。
従来、電気絶縁板としては各種熱硬化樹脂を基
材とするものが一般に使用されている。これらの
うち、とくに代表的なものとしては紙基材フエノ
ール樹脂板をはじめとするフエノール積層板があ
げられる。
しかしながら、かかる電気絶縁板は靭性が不足
しているためにパンチング加工時に騒音が大きい
とか粉塵の発生が多いなどの欠点を有し、さらに
はホツトパンチング加工時には熱収縮を見込んだ
金型設計が必要であるなどの問題点を有する。ま
た、熱硬化性樹脂を基材とするために製品をパン
チングした後の基材を再生利用することがむつか
しく、さらに一般には連続した板状ではなく、た
とえば1050mm角に切断された板状の形態で供給さ
れるのでパンチング加工への供給システムの自動
化が制限されるという問題点を有する。また、厚
み精度が劣るために製品の組立て工程や製品の使
用上で支障が生じるといつた問題点をも有する。
さらには、パンチング加工されたものについては
金属端子によつてかしめられるとかリベツト締め
される際に、靭性の不足のために割れや欠けが発
生するなどの問題点を有している。
本発明者は、電気絶縁板に適した電気絶縁特
性、耐熱性および機械的性質を有し、かつ前記の
ごとき従来の熱硬化性樹脂を基材とした電気絶縁
板がもつ欠点や問題点を有しないような電気絶縁
板を提供することを目的として鋭意研究を重ねた
結果、電気絶縁板の基材として特定の芳香族ポリ
エステル共重合体とポリアミドとからなる樹脂組
成物により上記の目的が達成できるという事実を
見出して本発明に到達したものである。
すなわち、本発明は、(A)テレフタル酸またはそ
の機能誘導体とイソフタル酸またはその機能誘導
体の混合物（ただし、テレフタル酸基とイソフタ
ル酸基のモル比は１対９ないし９対１）と、二価
フエノールまたはその機能誘導体とから得られる
芳香族ポリエステル共重合体70〜５重量％と、(B)
ポリアミド30〜95重量％とからなる樹脂組成物よ
りなり、厚さが0.3〜３mmである耐熱性電気絶縁
板を要旨とするものである。
本発明の耐熱性電気絶縁板を構成する芳香族ポ
リエステル共重合体は、テレフタル酸またはその
機能誘導体とイソフタル酸またはその機能誘導体
の混合物と二価フエノールまたはその機能誘導体
とから得られるものである。
本発明においてはテレフタル酸またはその機能
誘導体とイソフタル酸またはその機能誘導体とを
モル比で１：９ないし９：１、好ましくは３：７
ないし７：３、とくに好ましくは５：５の割合で
混合して使用したものが望ましい。
好ましい二価フエノールは次の一般式（）あ
るいは（）で示されるものである。
（ただし、ＸはＯ、Ｓ、SO2、SO、CO、アルキ
レン基およびアルキリデン基からなる群から選ば
れ、R1、R2、R3、R4、R1′、R2′、R3′、および
R4′は水素原子、ハロゲン原子、あるいはアルキ
ル基を表わす。）
HO−Ar−OH （）
（ただし、Arは
The present invention relates to an electrical insulating board, and more specifically to a base material made of a resin composition made of an aromatic polyester copolymer obtained from an aromatic dicarboxylic acid or a derivative thereof and a dihydric phenol or a derivative thereof, and a polyamide. The present invention relates to a heat-resistant electrical insulating board. Conventionally, electrical insulating boards based on various thermosetting resins have generally been used. Among these, phenol laminates including paper-based phenolic resin boards are particularly representative. However, such electrical insulating boards have drawbacks such as high noise and generation of dust during punching due to lack of toughness, and furthermore, mold design that takes into account heat shrinkage is required during hot punching. It has problems such as: In addition, because the base material is thermosetting resin, it is difficult to recycle the base material after punching the product, and in general, it is not a continuous plate shape, but a plate shape cut into, for example, 1050 mm squares. There is a problem in that automation of the supply system for punching processing is limited. Further, there is a problem in that the poor thickness accuracy causes problems in the product assembly process and in the use of the product.
Furthermore, punched products have problems such as cracking or chipping due to lack of toughness when caulked with metal terminals or riveted. The present inventor has created an electrical insulating board that has electrical insulating properties, heat resistance, and mechanical properties suitable for an electrical insulating board, and also overcomes the drawbacks and problems of the conventional electrical insulating board based on thermosetting resin as described above. As a result of intensive research with the aim of providing an electrical insulating board that does not have the same characteristics, the above objective was achieved by using a resin composition made of a specific aromatic polyester copolymer and polyamide as a base material for an electrical insulating board. The present invention was achieved by discovering the fact that it is possible. That is, the present invention provides (A) a mixture of terephthalic acid or a functional derivative thereof and isophthalic acid or a functional derivative thereof (provided that the molar ratio of terephthalic acid groups to isophthalic acid groups is 1:9 to 9:1); 70 to 5% by weight of an aromatic polyester copolymer obtained from phenol or its functional derivative; and (B)
The gist is a heat-resistant electrical insulating board made of a resin composition containing 30 to 95% by weight of polyamide and having a thickness of 0.3 to 3 mm. The aromatic polyester copolymer constituting the heat-resistant electrical insulating board of the present invention is obtained from a mixture of terephthalic acid or its functional derivative, isophthalic acid or its functional derivative, and divalent phenol or its functional derivative. In the present invention, the molar ratio of terephthalic acid or its functional derivative to isophthalic acid or its functional derivative is 1:9 to 9:1, preferably 3:7.
It is desirable to use a mixture at a ratio of 7:3 to 7:3, particularly preferably 5:5. Preferred dihydric phenols are those represented by the following general formula () or (). (However, X is selected from the group consisting of O, S , SO 2 , SO , CO, alkylene group, and alkylidene group, and ',and
R 4 ' represents a hydrogen atom, a halogen atom, or an alkyl group. ) HO−Ar−OH () (However, Ar is
【式】【formula】
【式】を表わし、アリレ
ーン基はアルキル基あるいはハロゲン原子で置換
されていてもよい。）
一般式（）あるいは（）で示される二価フ
エノールの好ましい具体例としては、２・２−ビ
ス（４−ヒドロキシフエニル）プロパン、２・２
−ビス（４−ヒドロキシ−３・５−ジブロモフエ
ニル）プロパン、２・２−ビス（４−ヒドロキシ
−３・５−ジクロロフエニル）プロパン、４・
4′−ジヒドロキシジフエニルスルホン、４・4′−
ジヒドロキシジフエニルエーテル、４・4′−ジヒ
ドロキシフエニルスルフイド、４・4′−ジヒドロ
キシジフエニルケトン、４・4′−ジヒドロキシジ
フエニルメメタン、２・２−ビス（４−ヒドロキ
シ−３・５−ジメチルフエニル）プロパン、１・
１−ビス（４−ヒドロキシフエニル）エタン、
１・１−ビス（４−ヒドロキシフエニル）シクロ
ヘキサン、４・4′−ジヒドロキシジフエニル、ベ
ンゾキノンなどがあげられるが、最も好ましく使
用され代表的なものは２・２−ビス（４−ヒドロ
キシフエニル）プロパン、すなわちビスフエノー
ルＡと呼ばれるものである。もし必要ならば二価
フエノールは混合して使用することができるし、
またエチレングリコールやプロピレングリコール
などのようなアルキレングリコールを一部混合し
て使用することもできる。
本発明に用いられる芳香族ポリエステル共重合
体は界面重合法、溶液重合法、溶融重合法などの
任意の方法で合成される。
また、本発明において用いられるポリアミドと
しては、ポリカプロラクタム（ナイロン６）、ポ
リヘキサメチレンアジパミド（ナイロン６、
６）、ポリテトラメチレンアジパミド（ナイロン
４、６）等が挙げられる。
本発明の耐熱性電気絶縁板は、上記のように芳
香族ポリエステル共重合体とポリアミドとからな
る樹脂組成物を基材とするものであるが、かかる
樹脂組成物を構成する芳香族ポリエステル共重合
体とポリアミドの配合割合は、重量％で70対30〜
５対95であることが必要であるが、60対40〜10対
90が好ましく、特に50対50〜20対80が好ましい。
上記樹脂組成物には、必要に応じて耐光剤、耐
熱剤、難熱剤、着色防止剤、流動性改質剤、発泡
剤、染料、顔料、無機添加剤等を配合してもよ
い。無機添加剤としては、例えばガラス繊維、ガ
ラス粉末、ガラスビーズ、ケイ酸バリウム、ケイ
酸カルシウム、シリカ、タルク、クレイ、カオリ
ン、アスベスト、マイカ、炭素繊維等が挙げられ
るが、特にケイ酸カルシウムが好ましい。
本発明における上記樹脂組成物を配合する方法
としては、タンブラーやスーパーミキサー等の公
知の混合装置を用いる方法を採用することができ
る。
本発明の電気絶縁板は熱可塑性の芳香族ポリエ
ステル共重合体とポリアミドからなる樹脂組成物
を基材とするものであるから、溶融押出成形法に
おける加工性に優れており、本発明の電気絶縁板
を製造するにあたつては溶融押出成形法によつて
容易に連続した長い板状物として得ることができ
る。かかる溶融押出成形において、連続した長い
板状物は通常巻物として巻取られるが、このよう
な連続した長い板状物を用いた場合には、パンチ
ング加工の工程における供給システムを自動化し
易いという利点がある。
次に、本発明の電気絶縁板の厚さは、上記のよ
うに0.3〜３mmであるが、特に0.3〜２mmが好まし
い。厚さが３mmより厚くなると、連続した板状物
として製造する場合に、板状物に巻ぐせが残り易
くなる。一方、厚さが0.3mmより薄くなると、電
気絶縁板が変形し易くなるので、好ましくない。
本発明の電気絶縁板は上記のような構成を有す
るので、耐熱性に優れるばかりでなく、パンチン
グ加工において、粉塵の発生や騒音が少なく、し
かも仕上がりがよいという利点があり、また、冷
間加工性にも優れる。しかも、ポリアミドの存在
により耐薬品性においても優れるものがある。さ
らに、本発明の電気絶縁板は、熱可塑性樹脂から
なる上記樹脂組成物を基材とするので、パンチン
グ加工した後に残る板状物を粉砕して再生利用す
ることができ、コストの点でも有利である。しか
も、本発明の電気絶縁板は、金属端子による「か
しめ」やリベツト締めによつても、割れたり、欠
けたりしにくいという利点がある。
上記のような本発明の電気絶縁板は、様々な形
状にパンチング加工することができる。その様な
加工品としては、例えば各種スイツチ部品、端子
板、バリコン、ボリユーム、管球ベース、照明器
具の絶縁板、自動車部品等の各種の電子機器の絶
縁構造物を挙げることができる。それらの具体例
としては、スペーサー、絶縁板、座板、取付板、
端子板、ベース、基板、カバー、ローター等が挙
げられる。
次に、本発明を実施例によつて具体的に説明す
る。
実施例１〜４、比較例１〜３
テレフタル酸ジクロリドとイソフタル酸ジクロ
リドのモル比が１：１である混合酸ジクロリドの
塩化メチレン溶液と、ビスフエノールＡの苛性ソ
ーダ水溶液を混合し、界面重合することにより対
数粘度0.60〔フエノール／テトラクロルエタン
（６：４、重量比）中、１ｇ／dl、25℃で測定〕
の芳香族ポリエステル共重合体を得た。
一方、ナイロン６〔フエノール／テトラクロル
エタン（６：４、重量比）中、１ｇ／dl、25℃で
測定した対数粘度が1.0のもの〕、ナイロン66〔フ
エノール／テトラクロルエタン（６：４、重量
比）中、１ｇ／dl、25℃で測定した対数粘度が
1.0のもの〕、ポリカーボネート（三菱瓦斯化学(株)
製ユーピロンS1000）を用意し、これらをそれぞ
れ第１表に示した割合で上記芳香族ポリエステル
共重合体と混合した後、エクストルーダーを用い
て溶融押出して厚さ0.7mm、巾600mmのシートを得
た。
得られたシートを金属用のスリツターを用いて
巾78mmにスリツトした後、積層板用の金型を使用
して冷間状態にてパンチング加工を行い、一辺が
15mmの菱形をしたロータリースイツチ用のカバー
部品を作成した。
パンチング加工時の騒音の程度（著しいものを
10、ほとんどないものを１として10段階で評
価）、発生する粉塵の程度（著しいものを10、ほ
とんどないものを１として10段階で評価）及び得
られた成形品の金属端子でかしめ加工したときの
割れの発生率は、第２表のとおりであつた。
また、得られた電気絶縁板の性能は第３表に示
すとおりであつた。
第２表から明らかなように、本発明の電気絶縁
板は、パンチング加工時の騒音も少なく、粉塵の
発生も少なく、しかも、かしめ加工時の割れの発
生率も少ないものであつた。さらに、第３表から
明らかなように、電気絶縁板の性能においても優
れたものであつた。[Formula] is represented, and the arylene group may be substituted with an alkyl group or a halogen atom. ) Preferred specific examples of the dihydric phenol represented by the general formula () or () include 2,2-bis(4-hydroxyphenyl)propane, 2,2
-bis(4-hydroxy-3,5-dibromophenyl)propane, 2,2-bis(4-hydroxy-3,5-dichlorophenyl)propane, 4.
4′-dihydroxydiphenyl sulfone, 4・4′-
Dihydroxydiphenyl ether, 4,4'-dihydroxyphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, 4,4'-dihydroxydiphenylmemethane, 2,2-bis(4-hydroxy-3,5 -dimethylphenyl)propane, 1.
1-bis(4-hydroxyphenyl)ethane,
Examples include 1,1-bis(4-hydroxyphenyl)cyclohexane, 4,4'-dihydroxydiphenyl, and benzoquinone, but the most preferably used and typical one is 2,2-bis(4-hydroxyphenyl). ) propane, or bisphenol A. If necessary, dihydric phenols can be used in combination and
Further, alkylene glycols such as ethylene glycol and propylene glycol can also be used in combination. The aromatic polyester copolymer used in the present invention can be synthesized by any method such as an interfacial polymerization method, a solution polymerization method, or a melt polymerization method. In addition, polyamides used in the present invention include polycaprolactam (nylon 6), polyhexamethylene adipamide (nylon 6,
6), polytetramethylene adipamide (nylon 4, 6), and the like. The heat-resistant electrical insulating board of the present invention is based on a resin composition composed of an aromatic polyester copolymer and a polyamide as described above, and the aromatic polyester copolymer constituting the resin composition is The blending ratio of coalesce and polyamide is 70:30 by weight.
Needs to be 5 to 95, but 60 to 40 to 10
90 is preferred, particularly 50:50 to 20:80. The resin composition may optionally contain a light stabilizer, a heat resistant agent, a heat retardant, a color inhibitor, a fluidity modifier, a blowing agent, a dye, a pigment, an inorganic additive, and the like. Examples of inorganic additives include glass fiber, glass powder, glass beads, barium silicate, calcium silicate, silica, talc, clay, kaolin, asbestos, mica, and carbon fiber, with calcium silicate being particularly preferred. . As a method for blending the resin composition in the present invention, a method using a known mixing device such as a tumbler or a super mixer can be adopted. Since the electrical insulating board of the present invention is based on a resin composition consisting of a thermoplastic aromatic polyester copolymer and polyamide, it has excellent processability in melt extrusion molding. In manufacturing the plate, it can be easily obtained as a continuous long plate by melt extrusion molding. In such melt extrusion molding, a continuous long plate-like material is usually wound up as a roll, but when such a continuous long plate-like material is used, the advantage is that it is easy to automate the supply system in the punching process. There is. Next, the thickness of the electrically insulating plate of the present invention is 0.3 to 3 mm as described above, and particularly preferably 0.3 to 2 mm. When the thickness is greater than 3 mm, curls tend to remain in the plate when manufactured as a continuous plate. On the other hand, if the thickness is less than 0.3 mm, the electrical insulating plate becomes easily deformed, which is not preferable. Since the electrical insulating board of the present invention has the above-described structure, it not only has excellent heat resistance, but also has the advantage of generating less dust and noise during punching processing, and producing a good finish. It is also excellent in sex. Moreover, some of them have excellent chemical resistance due to the presence of polyamide. Furthermore, since the electrical insulating board of the present invention uses the above-mentioned resin composition made of thermoplastic resin as a base material, the plate-like material remaining after punching can be crushed and recycled, which is advantageous in terms of cost. It is. Moreover, the electrical insulating plate of the present invention has the advantage that it is not easily cracked or chipped even when caulked with metal terminals or riveted. The electrical insulating board of the present invention as described above can be punched into various shapes. Such processed products include, for example, various switch parts, terminal boards, variable capacitors, volumes, tube bases, insulating plates for lighting equipment, and insulating structures for various electronic devices such as automobile parts. Specific examples include spacers, insulating plates, seat plates, mounting plates,
Examples include terminal boards, bases, substrates, covers, rotors, etc. Next, the present invention will be specifically explained using examples. Examples 1 to 4, Comparative Examples 1 to 3 A methylene chloride solution of a mixed acid dichloride in which the molar ratio of terephthalic acid dichloride and isophthalic acid dichloride is 1:1 and a caustic soda aqueous solution of bisphenol A are mixed and interfacially polymerized. Logarithmic viscosity 0.60 [measured in phenol/tetrachloroethane (6:4, weight ratio) at 1 g/dl at 25°C]
An aromatic polyester copolymer was obtained. On the other hand, nylon 6 [1 g/dl in phenol/tetrachloroethane (6:4, weight ratio) with a logarithmic viscosity of 1.0 measured at 25°C], nylon 66 [phenol/tetrachloroethane (6:4, weight ratio), Weight ratio), the logarithmic viscosity measured at 1g/dl at 25℃ is
1.0], polycarbonate (Mitsubishi Gas Chemical Co., Ltd.)
Prepare Iupilon S1000), mix these with the above aromatic polyester copolymer in the proportions shown in Table 1, and then melt extrude using an extruder to obtain a sheet with a thickness of 0.7 mm and a width of 600 mm. Ta. The obtained sheet was slit to a width of 78 mm using a metal slitter, and then punched in a cold state using a mold for laminates, so that one side was
I created a 15mm diamond-shaped cover part for a rotary switch. Level of noise during punching process (significant)
10. Rating on a 10-point scale with 1 being almost non-existent), degree of dust generated (10 being significant and 1 being almost non-existent), and when caulking the resulting molded product with metal terminals. The incidence of cracking was as shown in Table 2. Further, the performance of the obtained electrical insulating board was as shown in Table 3. As is clear from Table 2, the electrical insulating board of the present invention produced less noise and less dust during punching, and also had a lower incidence of cracking during caulking. Furthermore, as is clear from Table 3, the electrical insulating board was also excellent in performance.
【表】【table】
【表】
〓注〓 数字は重量部
[Table] Note: Numbers are parts by weight
【表】【table】
【表】【table】
Claims (1)
フタル酸またはその機能誘導体の混合物（ただ
し、テレフタル酸基とイソフタル酸基のモル比は
１対９ないし９対１）と、二価フエノールまたは
その機能誘導体とから得られる芳香族ポリエステ
ル共重合体70〜５重量％と、(B)ポリアミド30〜95
重量％とからなる樹脂組成物よりなり、厚さが
0.3〜３mmである耐熱性電気絶縁板。1 (A) A mixture of terephthalic acid or its functional derivative and isophthalic acid or its functional derivative (however, the molar ratio of terephthalic acid group to isophthalic acid group is 1:9 to 9:1), and dihydric phenol or its functional derivative 70 to 5% by weight of aromatic polyester copolymer obtained from (B) polyamide 30 to 95%
% by weight, and the thickness is
Heat-resistant electrical insulation board with a thickness of 0.3 to 3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7249079A JPS55163707A (en) | 1979-06-08 | 1979-06-08 | Heat resistant electric insulating plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7249079A JPS55163707A (en) | 1979-06-08 | 1979-06-08 | Heat resistant electric insulating plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55163707A JPS55163707A (en) | 1980-12-20 |
| JPS6254213B2 true JPS6254213B2 (en) | 1987-11-13 |
Family
ID=13490808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7249079A Granted JPS55163707A (en) | 1979-06-08 | 1979-06-08 | Heat resistant electric insulating plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55163707A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04372647A (en) * | 1991-06-20 | 1992-12-25 | Teijin Ltd | Resin composition |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4851095A (en) * | 1971-10-29 | 1973-07-18 | ||
| JPS5139796A (en) * | 1974-10-02 | 1976-04-02 | Unitika Ltd | DENKIZETSU ENHOHO |
| JPS5156948A (en) * | 1974-11-13 | 1976-05-19 | Sumitomo Chemical Co | RIREEKABAAYOSOZAI |
-
1979
- 1979-06-08 JP JP7249079A patent/JPS55163707A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4851095A (en) * | 1971-10-29 | 1973-07-18 | ||
| JPS5139796A (en) * | 1974-10-02 | 1976-04-02 | Unitika Ltd | DENKIZETSU ENHOHO |
| JPS5156948A (en) * | 1974-11-13 | 1976-05-19 | Sumitomo Chemical Co | RIREEKABAAYOSOZAI |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55163707A (en) | 1980-12-20 |
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