JPS6252947U - - Google Patents
Info
- Publication number
- JPS6252947U JPS6252947U JP1985145562U JP14556285U JPS6252947U JP S6252947 U JPS6252947 U JP S6252947U JP 1985145562 U JP1985145562 U JP 1985145562U JP 14556285 U JP14556285 U JP 14556285U JP S6252947 U JPS6252947 U JP S6252947U
- Authority
- JP
- Japan
- Prior art keywords
- abutting portion
- semiconductor device
- element mounting
- lead frame
- substantially perpendicular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985145562U JPS6252947U (https=) | 1985-09-24 | 1985-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985145562U JPS6252947U (https=) | 1985-09-24 | 1985-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6252947U true JPS6252947U (https=) | 1987-04-02 |
Family
ID=31057217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985145562U Pending JPS6252947U (https=) | 1985-09-24 | 1985-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6252947U (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104294A (ja) * | 1992-09-17 | 1994-04-15 | Nec Corp | リードフレーム |
| JP2019016658A (ja) * | 2017-07-05 | 2019-01-31 | 三菱電機株式会社 | 光モジュールおよび光モジュールの製造方法 |
-
1985
- 1985-09-24 JP JP1985145562U patent/JPS6252947U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104294A (ja) * | 1992-09-17 | 1994-04-15 | Nec Corp | リードフレーム |
| JP2019016658A (ja) * | 2017-07-05 | 2019-01-31 | 三菱電機株式会社 | 光モジュールおよび光モジュールの製造方法 |
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