JPS6251743U - - Google Patents

Info

Publication number
JPS6251743U
JPS6251743U JP1985143305U JP14330585U JPS6251743U JP S6251743 U JPS6251743 U JP S6251743U JP 1985143305 U JP1985143305 U JP 1985143305U JP 14330585 U JP14330585 U JP 14330585U JP S6251743 U JPS6251743 U JP S6251743U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit
semiconductor integrated
ground
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985143305U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0419807Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985143305U priority Critical patent/JPH0419807Y2/ja
Publication of JPS6251743U publication Critical patent/JPS6251743U/ja
Application granted granted Critical
Publication of JPH0419807Y2 publication Critical patent/JPH0419807Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5449Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
JP1985143305U 1985-09-18 1985-09-18 Expired JPH0419807Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985143305U JPH0419807Y2 (https=) 1985-09-18 1985-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985143305U JPH0419807Y2 (https=) 1985-09-18 1985-09-18

Publications (2)

Publication Number Publication Date
JPS6251743U true JPS6251743U (https=) 1987-03-31
JPH0419807Y2 JPH0419807Y2 (https=) 1992-05-06

Family

ID=31052862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985143305U Expired JPH0419807Y2 (https=) 1985-09-18 1985-09-18

Country Status (1)

Country Link
JP (1) JPH0419807Y2 (https=)

Also Published As

Publication number Publication date
JPH0419807Y2 (https=) 1992-05-06

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