JPS6250487A - Laser light projector of laser assist chemical etching method - Google Patents

Abstract

PURPOSE:To provide the titled device which can efficiently execute three-dimensional etching, is simple in construction and is inexpensive by providing a working fluid injection nozzle coaxially with a projecting part formed by connecting an optical system to the top end of an optical fiber for laser transmission coaxially with said part. CONSTITUTION:The laser light from the projecting part 8 formed by connecting the optical system 7 consisting of lenses 12, 13, etc., to the tolp end of the 1st optical fiber 6 of a laser light projector 1 is focused and irradiated on the part 3 to be processed of a work 2 making motion such as rotation; at the same time, the nozzle 18 is provided to the outside of the part 8 coaxially therewith to inject the working fluid 19, by which laser assist chemical etching is executed. The lenses 12, 13 of the above-mentioned optical system 7 are built into a frame 11 and are provided movably in the axial direction, by which the focal positions are made adjustable according to the distance from the part 3 to be processed. The characteristic pumping light from the part 3 is detectedat the top end 21 of the 2nd optical fiber 15 and the condition of the part 3 is inline monitored, by which the above-mentioned etching is most adequately controlled.

Description

Detailed Description of the Invention (a) Object of the Invention [Field of Industrial Application] The present invention relates to a light projecting section U of a laser used in a laser-assisted chemical etching method.

As one of the processing techniques for workpiece materials, laser-assisted chemical etching (tascrasist chem) is recently developed, in which the chemical etching effect of a processing liquid is promoted by laser light (1) to perform cutting, hole forming, and groove processing.
ical etching) method is attracting attention.

[Prior Art] As shown in FIG. 3, in the laser-assisted chemical etching method, a workpiece 101 is immersed in a processing liquid 102, and a laser such as an Ar+ laser or a YAG laser from a laser light source 103 is irradiated with a mirror beam. After the light is reflected by a lens 104 to change the optical path, the light is focused on a part of the workpiece 101 to be processed by a lens 105.

The laser beam focused on the part to be machined of the workpiece 101 thermally excites the part to be machined, promoting the chemical etching action of the machining liquid 102, and thereby promoting the machining of the workpiece 101.

According to this method, highly efficient cutting, drilling, and grooving can be performed on alumina/titanium carbide ceramics by the thermal excitation of argon ions and YAG laser light focused in the processing fluid.

[Problems to be Solved by the Invention] However, according to this conventional laser-assisted chemical etching method, the above method is fine when the workpiece is a flat plate and is processed from one direction, but it is complicated. Machining of a certain shape may require rotating the workpiece in a machining fluid.

However, introducing a three-dimensional drive mechanism such as rotation into the machining fluid makes the structure of the device extremely complicated and increases the cost. Furthermore, as a method for in-line monitoring of the machining status of the workpiece, it is effective to separate the light excited from the workpiece. As the depth increases over time, the light emission situation changes, making it difficult to receive and monitor the light externally. Furthermore, since the workpiece is machined while being immersed in the machining fluid, it becomes necessary to replace the machining fluid due to deterioration, which causes a decrease in work efficiency, and a solution to these problems is desired. .

This invention was made in view of the above-mentioned circumstances, and enables highly efficient machining without the need to introduce a two-dimensional drive mechanism such as rotation into the machining fluid, and therefore allows the structure of the device to be reduced. It is possible to reduce the price by placing it in a cylinder, and it is easy to monitor the machining status in-line.
It is an object of the present invention to provide a light projecting device for use in a laser-assisted chemical etching method that does not require interruption of work due to replacement of processing fluid due to deterioration of the fluid.

(b) Structure of the Invention [Means for Solving the Problem] In response to this object, the laser-assisted chemical etching method of the present invention provides an optical projection device for attaching an optical beam to the tip of an optical fiber for laser transmission. The apparatus is characterized by having a light projecting section connected to the system, and a machining liquid spray nozzle coaxially disposed outside the light projecting section.

Hereinafter, details of the present invention will be explained with reference to the drawings showing one embodiment.

In FIG. 1, reference numeral 1 denotes a laser projecting device according to an embodiment of the present invention. A laser is emitted and machining fluid is injected. The workpiece 2 is attached to a jack 5 of a machine tool 4 and rotated. The laser projector 1 includes a first optical fiber 6. This first optical fiber 6 is for transmitting laser light from a laser light source 10.

An optical system 7 is attached to the tip of the first optical fiber 6.

The tip of the first optical fiber 6 and the optical system 7 are connected to the light projecting section 8.
Configure. The optical system 7 includes a frame 11 and two lenses 12.1.
3 and is attached to the tip of the first optical fiber 6. The lens 13 is guided by the frame 11 and can be displaced in the direction of the axis 14 of the light projector 8.

A second optical fiber 15 is disposed coaxially with the light projecting section 8 on the outside of the light projecting section 8 . The second optical fiber 15 functions as a light-receiving optical fiber, and transmits light emitted from or reflected from the processed portion 3 of the workpiece 2 to the optical chromator 16. Monochromator 16 outputs to recorder 17.

In the light projection unit 8, a cylindrical nozzle 18 is coaxially disposed outside the second optical fiber 15.

The tip 21 of the nozzle 18 is tapered.

This nozzle 18 is for injecting a machining liquid 19 into the part 3 to be machined. The nozzle 18 communicates with a machining liquid tank 22 through a vibrator 20. A liquid receiving pan 23 is disposed directly below the workpiece portion 3 of the workpiece 2.

[Operation] When processing the workpiece 2 using the laser projector 1 configured as described above, the tip of the projector 8 is positioned facing the workpiece 3, and the laser beam is emitted from the laser light source 10. generate light. The generated laser light is transmitted through the first optical fiber 6 and reaches the light projection section 8, and is focused on the part to be processed 3 by the optical system 7 to thermally excite the part to be processed 3. On the other hand, the machining fluid in the machining fluid tank 22 is guided to the nozzle 18 and is injected from the nozzle 18 into the workpiece portion 3 . The injected machining fluid chemically etches the part 3 to be machined.

On the other hand, the characteristic excitation light emitted from the processed part 3 is received by the tip 24 of the second optical fiber 15,
The light is transmitted through the second optical fiber 15 and input to the monochromator 16 for measurement.

(C) Effects of the Invention According to the laser projection device of the present invention, the workpiece is not immersed in the machining liquid, and only the workpiece part 3 is wetted by the machining liquid 19 spouted from the nozzle 18, so that machining is possible. Even when it is necessary to apply three-dimensional rotation to a complex workpiece,
There is no need to dispose a drive device in the machining fluid, and the structure of the device can be simplified. Moreover, since the light projecting section 8 is provided at the tip of the flexible coaxial cable, the light projecting section 8 can be positioned at an optimal position sufficiently close to the workpiece part 3, so that processing and its monitoring can be performed optimally. It can be carried out.

There is no need to immerse the entire workpiece in the machining liquid, and only the part to be processed needs to be wetted, so less use is required, and there is no need to interrupt machining work by replacing the machining liquid when it becomes contaminated. . Moreover, since the condition of the part to be machined can be detected by the second optical fiber, in-line monitoring is extremely easy and optimal processing is possible. Furthermore, since the first optical fiber, the second optical fiber, and the nozzle are coaxially integrated, the structure of the device can be simplified and the device can be made smaller.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing the usage state of the projecting device of the present invention;
FIG. 2 is an explanatory longitudinal cross-sectional view showing the light projecting device of the present invention, and FIG. 3 is an explanatory view showing the state of conventional laser-assisted chemical etching processing.

Claims (3)

[Claims] (1) It has a light projecting section that is equipped with an optical system connected to the tip of an optical fiber for laser transmission, and a machining fluid injection nozzle coaxially disposed outside the light projecting section. Laser-assisted chemical etching laser projector featuring (2) A laser projector using a laser-assisted chemical etching method according to claim 1, wherein the lens in the optical system is variable in position in the axial direction. (3) A laser-assisted chemical etching method according to claim 1 or 2, characterized in that an optical fiber for receiving light is disposed coaxially outside the optical fiber for laser transmission. Laser projector