JPS6248595A - Production of ink ribbon for thermal transfer recording - Google Patents

Production of ink ribbon for thermal transfer recording

Info

Publication number
JPS6248595A
JPS6248595A JP19012685A JP19012685A JPS6248595A JP S6248595 A JPS6248595 A JP S6248595A JP 19012685 A JP19012685 A JP 19012685A JP 19012685 A JP19012685 A JP 19012685A JP S6248595 A JPS6248595 A JP S6248595A
Authority
JP
Japan
Prior art keywords
ink
holes
film
ink ribbon
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19012685A
Other languages
Japanese (ja)
Inventor
Keita Otsuka
大塚 慶太
Noboru Takada
昇 高田
Kohei Kiyota
航平 清田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP19012685A priority Critical patent/JPS6248595A/en
Publication of JPS6248595A publication Critical patent/JPS6248595A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382Contact thermal transfer or sublimation processes
    • B41M5/38207Contact thermal transfer or sublimation processes characterised by aspects not provided for in groups B41M5/385 - B41M5/395

Abstract

PURPOSE:To obtain an ink ribbon capable of giving a transferred image of high quality, by providing on an insulating base a thin metallic film provided with through-holes in a high density by using a photoresist film as a mask, and filling the through-holes with a heat-fusible ink. CONSTITUTION:Cylindrical photoresist films 12 are provided in a staggered pattern on an insulating base 11 formed of a glass or the like. A metallic film 15 is provided on the base 11 by electroless plating while using the photoresist films 12 as a mask. The entire body is immersed in a photoresist film removing liquid to remove the film 12, and the metallic film 15 thereon is also removed, whereby the thin metallic film 15 is obtained which is provided with a cylindrical through-holes 17. The film 15 is released from the glass base 11 to obtain the base 16 for the ink ribbon. The base 16 having the through-holes 17 is immersed in a heat-fusible ink contained in a container to fill the holes 17 with an ink 18. Since the through-holes 17 are provided in a high density, print dots formed by ink droplets can be obtained in the state of a high resolution, and a transferred image of high quality can be obtained.

Description

【発明の詳細な説明】 〔概要〕 金属薄板に所定のピッチで所定のパターンに貫通孔を設
け、この貫通孔に熱溶融性インクを充填し、この熱熔融
性インクにサーマルヘッドを押圧して、記録紙に溶融し
たインクを転写するインクリボンの製造方法であって、
絶縁性基板上に所定のパターンのホトレジスト膜を形成
後、このホトレジスト膜をマスクとして電解、或いは無
電解法により導電性被膜を形成後、このホトレジスト膜
を除去した後、絶縁性基板より導電性被膜を剥離し、こ
のホトレジスト膜の除去領域で形成された開口部に熱溶
融性インクを充填して、インクの充填された貫通孔を高
密度に有するインクリボンの製造方法。
[Detailed Description of the Invention] [Summary] Through-holes are formed in a thin metal plate in a predetermined pattern at a predetermined pitch, the through-holes are filled with hot-melt ink, and a thermal head is pressed against the hot-melt ink. , a method for manufacturing an ink ribbon for transferring molten ink to recording paper, the method comprising:
After forming a photoresist film in a predetermined pattern on an insulating substrate, a conductive film is formed by electrolytic or electroless method using this photoresist film as a mask, and after removing this photoresist film, the conductive film is removed from the insulating substrate. A method for manufacturing an ink ribbon having through holes filled with ink at a high density by peeling off the photoresist film and filling the openings formed in the removed area of the photoresist film with hot melt ink.

〔産業上の利用分野〕[Industrial application field]

本発明は熱転写記録用のインクリボンの製造方法に係り
、特に金属薄板の貫通孔に熱熔融性インクを充填し、こ
のインクにサーマルヘッドを押圧して溶融したインクを
記録紙に転写する方式に用いるインクリボンに於いて、
前記インクの先議された貫通孔を高密度に得られるよう
にしたインクリボンの製造方法に関する。
The present invention relates to a method of manufacturing an ink ribbon for thermal transfer recording, and in particular to a method of filling a through hole in a thin metal plate with heat-melting ink, pressing a thermal head against the ink, and transferring the melted ink onto recording paper. In the ink ribbon used,
The present invention relates to a method of manufacturing an ink ribbon in which the above-mentioned ink through-holes can be formed at a high density.

コンデンサ紙、或いはポリエステル樹脂のような基材上
にインク層を設け、基材側より印字情報に基づいて選択
的に加熱されたサーマルヘッドを押圧してインク層側に
設けた記録紙に溶融したインクを転写記録する熱転写記
録方法は、装置の構造が小型で簡単で、印字の際に騒音
を発生しないので事務所等の静かな環境を有する場所で
小型のプリンタとして用いられている。
An ink layer is placed on a base material such as capacitor paper or polyester resin, and a thermal head selectively heated based on the printed information is pressed from the base material side to melt the ink onto the recording paper provided on the ink layer side. Thermal transfer recording method, in which ink is transferred and recorded, has a small and simple device structure and does not generate noise during printing, so it is used as a small printer in a quiet environment such as an office.

然し、このような熱転写記録に用いるインクリボンは基
材を介してサーマルヘッドを押圧するため、サーマルヘ
ッドの熱がインクに伝達し難く、そのため転写効率が悪
い欠点がある。
However, since the ink ribbon used for such thermal transfer recording presses the thermal head through the base material, it is difficult for the heat of the thermal head to be transferred to the ink, resulting in poor transfer efficiency.

そこで基材やインク層の厚さを薄くしてサーマルヘッド
の熱がインク層に伝達し易くしようと試みたが、インク
層を基材上に薄く塗布するのは技術的に困難で、また基
材の厚さを薄くすると機械的強度が低下する問題がある
Therefore, attempts were made to reduce the thickness of the base material and ink layer to make it easier for the heat from the thermal head to transfer to the ink layer, but it was technically difficult to apply a thin ink layer on the base material, and When the thickness of the material is reduced, there is a problem in that the mechanical strength decreases.

そのため、ステンレス板等の耐熱性の金属薄板に貫通孔
を設け、この貫通孔内に熱溶融性インクを充填して、こ
のインクに直接レーザ光等を照射して溶融したインクを
記録紙に転写記録するような、熱転写記録用媒体が特公
昭59−36879号にて開示されている。
Therefore, a through hole is formed in a heat-resistant thin metal plate such as a stainless steel plate, heat-melting ink is filled into the through hole, and the ink is directly irradiated with a laser beam, etc., and the melted ink is transferred to recording paper. A thermal transfer recording medium for recording is disclosed in Japanese Patent Publication No. 59-36879.

〔従来の技術〕[Conventional technology]

このようなインクリボンの構造について第10図の平面
図、並びに第10図をx−x ’線に沿って切断した第
11図の断面図を用いて説明する。
The structure of such an ink ribbon will be explained using the plan view of FIG. 10 and the cross-sectional view of FIG. 11, which is obtained by cutting FIG. 10 along the line xx'.

図示するように厚さが20μm程度のステンレス製の金
属薄板1には、直径が35μm程度でピ・ノチが65μ
−程度の貫通孔2が千鳥状に多数段けられ、この貫通孔
2内にはパラフィンワックスのような熱溶融性ワックス
と、染料よりなる熱溶融性インク3が充填されている。
As shown in the figure, a thin metal plate 1 made of stainless steel with a thickness of about 20 μm has a diameter of about 35 μm and a pitch of 65 μm.
A large number of through-holes 2 of about 100 to 100 mm are arranged in a staggered manner, and the through-holes 2 are filled with heat-melting ink 3 made of a heat-melting wax such as paraffin wax and a dye.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

このようなインクリボンに用いる金属薄板1は、できる
だけ貫通孔を高密度に形成して、この貫通孔内に充填さ
れているインクを溶融してインク粒子を複数個用いて形
成される印字ド・ントの解像度を高め、転写記録される
印字品位の向上を図ることが要求されている。
The thin metal plate 1 used in such an ink ribbon has through-holes formed as densely as possible, and a printing plate formed using a plurality of ink particles by melting the ink filled in the through-holes. There is a need to increase the resolution of prints and improve the quality of transferred and recorded prints.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は上記インクが充填された貫通孔を高密度に配設
したインクリボンの製造方法の提供を目的とする。
An object of the present invention is to provide a method for manufacturing an ink ribbon in which through-holes filled with the ink described above are arranged at a high density.

本発明のインクリボンの製造方法は、第1図より第7図
までに示すように、絶縁性基板11にホトレジス)15
112を所定形状のパターンに形成後、該基板11上に
前記ホトレジスト膜12をマスクとして金属膜15を電
解、或いは無電解メッキ法により形成後、前記ホトレジ
スト膜12を除去し、このホトレジスト膜12の除去に
より形成された貫通孔17を有する金属膜15を絶縁性
基板11より剥離し、前記金属膜15の貫通孔エフに熱
溶融性インク18を充填する。
As shown in FIGS. 1 to 7, the method for manufacturing an ink ribbon of the present invention includes a photoresist 15 on an insulating substrate 11.
112 into a predetermined pattern, a metal film 15 is formed on the substrate 11 by electrolytic or electroless plating using the photoresist film 12 as a mask, and then the photoresist film 12 is removed. The metal film 15 having the through holes 17 formed by the removal is peeled off from the insulating substrate 11, and the through holes F of the metal film 15 are filled with heat-fusible ink 18.

〔作用〕[Effect]

本発明のインクリボンの製造方法は、ガラスのような絶
縁性基板11上にホトレジスト膜12をマスクとして電
解、或いは無電解メッキ法により高密度に形成された貫
通孔17を有する金属薄膜15を形成して、この貫通孔
17に熱溶融性インク18を充填することで、解像度の
高い印字ドツトが得られるようにし、高品位の転写像が
得られるようなインクリボンを得るようにする。
The ink ribbon manufacturing method of the present invention involves forming a metal thin film 15 having through holes 17 formed at high density on an insulating substrate 11 such as glass by electrolytic or electroless plating using a photoresist film 12 as a mask. By filling this through hole 17 with heat-melting ink 18, printed dots with high resolution can be obtained, and an ink ribbon capable of obtaining a high-quality transferred image can be obtained.

〔実施例〕〔Example〕

以下、図面を用いて本発明の一実施例につき詳細に説明
する。
Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.

本発明のインクリボンの製造方法は、第1図に示すよう
に、ガラスのような絶縁性基板11上に千鳥状に直径が
30μ−程度の円筒状のホトレジスト111112をホ
トリソグラフィ法を用いて形成する。
As shown in FIG. 1, the ink ribbon manufacturing method of the present invention involves forming cylindrical photoresists 111112 with a diameter of about 30 μm in a staggered pattern on an insulating substrate 11 such as glass using a photolithography method. do.

次いで第2図に示すようにこの基板11を硫酸ニッケル
を主成分とし、次亜燐酸ソーダ等の還元剤等を含む無電
解ニッケルメッキ液13を収容した容器14内に浸漬し
、第3図に示すように基板11に無電解メッキにより、
厚さが20μm程度のニッケル(Ni)の金属膜15を
前記ホトレジスト膜12をマスクとして被着形成する。
Next, as shown in FIG. 2, this substrate 11 was immersed in a container 14 containing an electroless nickel plating solution 13 containing nickel sulfate as a main component and a reducing agent such as sodium hypophosphite. As shown, by electroless plating on the substrate 11,
A metal film 15 of nickel (Ni) having a thickness of about 20 μm is deposited using the photoresist film 12 as a mask.

次いで第4図に示すようにこの金属膜15を被着した基
板11をホトレジスト膜除去液内に浸漬して前記マスク
として用いたホトレジスト膜12を除去するとともにそ
の上の金属膜15を除去する。
Next, as shown in FIG. 4, the substrate 11 covered with the metal film 15 is immersed in a photoresist film removing solution to remove the photoresist film 12 used as the mask and the metal film 15 thereon.

このようにしてホトレジスト膜12が除去され、その上
の金属膜15が除去されることで、直径が30μm程度
の円筒状の貫通孔17が形成され、厚さが20μm程度
の金属薄膜15が得られる。
By removing the photoresist film 12 and the metal film 15 thereon in this way, a cylindrical through hole 17 with a diameter of about 30 μm is formed, and a metal thin film 15 with a thickness of about 20 μm is obtained. It will be done.

更に第5図に示すようにこの金属膜15をガラス基板1
1より顕微鏡等を見ながら、カミソリの刃のように端部
が薄く形成されている工具を用いて剥離し、貫通孔17
を有しNi金属の薄膜15よりなるインクリボンの基材
16を形成する。
Furthermore, as shown in FIG.
From Step 1, while looking at a microscope etc., use a tool with a thin end like a razor blade to peel it off and make the through hole 17.
An ink ribbon base material 16 made of a Ni metal thin film 15 is formed.

更に第6図に示すように基材16の貫通孔17内に熱溶
融性インク18を充填してインクリボン19を形成する
Furthermore, as shown in FIG. 6, the through holes 17 of the base material 16 are filled with heat-melting ink 18 to form an ink ribbon 19.

この熱溶融性インク18を充填する方法は、例えばこの
貫通孔17を有する基材16をパラフィンワックスや、
カルナウバワックス等の熱溶融性ワックスとカヤセント
ブランクKR(日本北東社製)のような染料とからなる
液体状の熱溶融性インクが収容されている容器内に浸漬
させ、毛細管現象によってこの貫通孔17の内部にイン
ク18を充填する。
A method of filling the heat-melting ink 18 is, for example, by filling the base material 16 having the through holes 17 with paraffin wax,
It is immersed in a container containing a liquid thermofusible ink consisting of a thermofusible wax such as carnauba wax and a dye such as Kayasent Blank KR (manufactured by Nippon Tohoku Co., Ltd.), and this penetration is caused by capillary action. The inside of the hole 17 is filled with ink 18 .

この他の実施例として、第7図に示すように前記したホ
トレジスト膜12を形成した基板ll上に予め蒸着、ま
たはスパッタ法を用いてNi膜15を全面に被着加工し
、このNt膜15を被着した基板11と白金よりなる電
極21を、硫酸ニッケルのような電解液22に浸漬して
、電極21と基板11間に直流電圧を印加して電解メッ
キ法により前記した基材16を形成するようにしても良
い。
As another example, as shown in FIG. 7, a Ni film 15 is deposited on the entire surface of the substrate 11 on which the photoresist film 12 described above is formed by vapor deposition or sputtering in advance, and this Nt film 15 The substrate 11 coated with platinum and the electrode 21 made of platinum are immersed in an electrolytic solution 22 such as nickel sulfate, and a DC voltage is applied between the electrode 21 and the substrate 11 to form the base material 16 described above by electrolytic plating. It may also be formed.

このようにすれば、貫通孔17が高密度に形成された基
材16が得られるので、この貫通孔17内に充填された
インク18を溶融して形成されたインク粒子により形成
される印字ドツトが高解像度の状態で得られ、高品位の
転写像が得られる。
In this way, the base material 16 in which the through holes 17 are formed with high density can be obtained, so that the printed dots formed by the ink particles formed by melting the ink 18 filled in the through holes 17 can be obtained. can be obtained with high resolution, and a high-quality transferred image can be obtained.

このようにして形成したインクリボン19を第8図に示
すようなプラテン31に設置された記録紙32に接触す
るようにして設置し、インクリボン19にサーマルヘッ
ド33を前記したプラテン31を用いて押圧し、このサ
ーマルヘッド33を矢印A方向に沿って移動し、サーマ
ルヘッド33を用いてインクリボン19の貫通孔17の
インク1日を溶融して記録紙32に浸透転写する。
The ink ribbon 19 thus formed was placed in contact with the recording paper 32 placed on a platen 31 as shown in FIG. The thermal head 33 is moved along the direction of the arrow A, and the ink in the through hole 17 of the ink ribbon 19 is melted and transferred to the recording paper 32 using the thermal head 33 .

このようにすれば、第9図に示すように・インクリボン
19の点線で示す領域のインクリボン19A内のインク
が溶融し、この溶融したインク粒子を組み合わせて印字
ドツトを形成し、この印字ドツトを複数個集めて文字等
や図形等の転写像を形成する。
In this way, as shown in FIG. 9, the ink in the ink ribbon 19A in the area indicated by the dotted line of the ink ribbon 19 is melted, and the melted ink particles are combined to form a printed dot, and this printed dot is A plurality of images are collected to form a transferred image of characters, figures, etc.

尚、上記金属薄板の厚さは10−100μmの範囲で、
貫通孔の直径は10〜100μmの範囲であれば充分実
用でき、貫通孔に充填するインクの形成材料としては、
パラフィンワックスのような熱溶融性ワックスの他にエ
チレン・酢酸ビニル共重合体の熱可塑性樹脂を用いても
良く、また熱熔融性ワックスと熱可塑性樹脂を混合して
も良い。また発色剤として染料の他に顔料を用いても良
い。
In addition, the thickness of the metal thin plate is in the range of 10-100 μm,
If the diameter of the through hole is in the range of 10 to 100 μm, it is sufficient for practical use, and the material for forming the ink to be filled in the through hole is as follows:
In addition to a hot-melt wax such as paraffin wax, a thermoplastic resin such as an ethylene/vinyl acetate copolymer may be used, or a hot-melt wax and a thermoplastic resin may be mixed. In addition to dyes, pigments may also be used as color formers.

〔発明の効果〕〔Effect of the invention〕

このようにすれば、インクリボン19を形成する基材1
6の貫通孔17が高密度に形成できるので、このような
インクリボンを用いれば、高解像度の印字品位の良好な
転写像が得られる効果がある。
In this way, the base material 1 forming the ink ribbon 19
Since the through holes 17 of 6 can be formed with high density, using such an ink ribbon has the effect of obtaining a transferred image with high resolution and good printing quality.

【図面の簡単な説明】[Brief explanation of drawings]

第1図より第6図までは本発明のインクリボンの製造方
法の工程を示す断面図、 第7図は本発明のインクリボンの製造方法の他の実施例
に用いる装置の模式図、 第8図は本発明の方法により形成したインクリボンを転
写装置に用いた際の模式図、 第9図は本発明の方法により形成したインクリボンの転
写状態を示す平面図、 第1θ図はインクリボンの構造を示す平面図、第11図
は第10図のx−x ’線に沿った断面図である。 図に於いて、 11は基板、12はホトレジスト膜、13は無電解メッ
キ液、14は容器、15は金属膜、16は基材、17は
貫通孔、18はインク、19はインクリボン、2】は電
極、22は電解液、31はプラテン、32は記録紙、3
3はサーマルヘッド、Aはサーマルヘッドの移動方向を
示す矢印である。 半46eiqj五にAすJ巧−Uしン゛、z漬影戸く工
l莞υゴ第 1 図 $発明め方承t<、?tS党爲71更の形へ“工事1刀
第2図 胴和小7沼て計rs桓Rり伜〜W1画図@ 3 図 第 4 図 Aモダ3eqの声ヲ迭y%け$4≧Δ氏斤乏J’JKr
tx*iQσ@ 5 図 第 6 図 45廻呵めあヲにの位の突方ヒ例ufイ兵弐′ロ第7図 1ミ勇ト日月司方夕ん2Jり形F\゛しn斡7グ虎シ9
す乏y發、、朋・TでBり第 8 趨 第 9 図
1 to 6 are cross-sectional views showing the steps of the ink ribbon manufacturing method of the present invention; FIG. 7 is a schematic diagram of an apparatus used in another embodiment of the ink ribbon manufacturing method of the present invention; The figure is a schematic diagram when an ink ribbon formed by the method of the present invention is used in a transfer device. Figure 9 is a plan view showing the transfer state of the ink ribbon formed by the method of the present invention. Figure 1θ is a diagram of the ink ribbon formed by the method of the present invention. A plan view showing the structure, and FIG. 11 is a sectional view taken along the line xx' in FIG. 10. In the figure, 11 is a substrate, 12 is a photoresist film, 13 is an electroless plating solution, 14 is a container, 15 is a metal film, 16 is a base material, 17 is a through hole, 18 is an ink, 19 is an ink ribbon, 2 ] is an electrode, 22 is an electrolytic solution, 31 is a platen, 32 is a recording paper, 3
3 is a thermal head, and A is an arrow indicating the direction of movement of the thermal head. Half 46 eqj 5 A J skill-U Shin゛, z dipping shadow door work 1 莞υgo 1st Figure $ Invention method <,? tS party control 71 further shape "Construction 1 sword 2 Dowa elementary school 7 swamp plan rs kan R Ryu ~ W1 drawing @ 3 Figure 4 Figure A moda 3 eq's voice is ignored y% ke $ 4 ≧ Δ Mr. J'JKr
tx*iQσ@ 5 Figure 6 Figure 45 An example of how to move around Meawo Ni斡7gu tiger shi9
Supo y author,, Tomo/T de Bri No. 8 Trend No. 9

Claims (1)

【特許請求の範囲】[Claims] 絶縁性基板(11)上にホトレジスト膜(12)を所定
形状のパターンに形成後、該基板(11)上に前記ホト
レジスト膜(12)をマスクとして金属膜(15)を電
解、或いは無電解メッキ法により形成後、前記ホトレジ
スト膜(12)を除去し、該ホトレジスト膜(12)の
除去により形成された貫通孔(17)を有する金属膜(
15)を絶縁性基板(11)より剥離し、前記金属膜(
15)の貫通孔(17)に熱溶融性インク(18)を充
填することを特徴とする熱転写記録用インクリボンの製
造方法。
After forming a photoresist film (12) in a predetermined pattern on an insulating substrate (11), a metal film (15) is electrolytically or electrolessly plated on the substrate (11) using the photoresist film (12) as a mask. After the formation by the method, the photoresist film (12) is removed, and a metal film (
15) is peeled off from the insulating substrate (11), and the metal film (
15) A method for producing an ink ribbon for thermal transfer recording, comprising filling the through holes (17) with a heat-melting ink (18).
JP19012685A 1985-08-28 1985-08-28 Production of ink ribbon for thermal transfer recording Pending JPS6248595A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19012685A JPS6248595A (en) 1985-08-28 1985-08-28 Production of ink ribbon for thermal transfer recording

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19012685A JPS6248595A (en) 1985-08-28 1985-08-28 Production of ink ribbon for thermal transfer recording

Publications (1)

Publication Number Publication Date
JPS6248595A true JPS6248595A (en) 1987-03-03

Family

ID=16252824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19012685A Pending JPS6248595A (en) 1985-08-28 1985-08-28 Production of ink ribbon for thermal transfer recording

Country Status (1)

Country Link
JP (1) JPS6248595A (en)

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