JPS6245834B2 - - Google Patents

Description

[Detailed description of the invention]

The present invention relates to a marking method for semiconductor devices, and more particularly to a marking method that can perform highly reliable marking regardless of the sealing method or the type of sealing resin. Semiconductor devices are shipped with the product name, manufacturing company name, etc. marked on the surface of the package, but resin-sealed semiconductor devices in particular have the disadvantage that marking is difficult. The reason for this is that a release agent or the like is attached to the surface of the package of a resin-sealed semiconductor device, and as a result, the marking ink does not adhere to the base and is easily repelled, peeled off, or scratched. Epoxy resin compositions, silicone resin compositions, etc. are used as resins for semiconductor encapsulation, but the above-mentioned problems associated with marking are particularly problematic in the case of epoxy resin compositions. It's summery. To deal with this problem, conventional methods have been used such as pre-treating semiconductor device packages by cleaning them with an organic solvent such as trichlorethylene or boiling an organic solvent, and then marking them. However, cleaning with an organic solvent, especially cleaning with a boiling organic solvent, is not yet satisfactory, although it is certainly more effective than when no cleaning is performed. In other words, the range of resins for which the improvement effect is recognized is limited, and even for the same epoxy resin, it is presumed that this is due to the difference in the mold release agent used, but a certain brand of sealing resin Although it is effective for encapsulating resins of other brands, it is not effective for other brands of encapsulating resins, so the scope of its application is quite limited. Furthermore, even for resins that have been recognized to have improved effects, they are affected by contamination of molds and various processes prior to the marking process, resulting in inconsistent effects and poor stability, and even under the best conditions, they are insufficient. Satisfactory adhesive strength was often not achieved. SUMMARY OF THE INVENTION An object of the present invention is to provide a highly reliable marking method that eliminates the drawbacks of conventional marking methods, particularly its pretreatment methods, and is capable of applying stable markings with high adhesive strength to a wide range of semiconductor device packages. It is in. The present inventors have discovered that such highly reliable marking can be achieved by using a silane coupling agent, and have completed the present invention. That is, the present invention uses a silane coupling agent of 0.01
A halogenated hydrocarbon or aromatic hydrocarbon solution containing ~5% by weight is heated to 60 to 200°C, a semiconductor device package is brought into contact with the heated solution, the package is dried, and then marking is performed. This is a marking method for semiconductor devices characterized by the following. The silane coupling agent used in the present invention refers to a hydrolyzable group that is directly bonded to a silicon atom (for example, an alkoxy group such as a methoxy group or an ethoxy group; an acyloxy group such as an acetoxy group; or a halogen atom such as chlorine). It is an organosilicon compound having at least one organic group having 2 to 3 functional groups such as an amino group, a mercapto group, a glycidoxy group, a methacryloxy group, a ureido group, an epoxy group, and a vinyl group. Specific examples include γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-ureidopropyltriethoxysilane. , N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane,
Examples include vinyltriacetoxysilane, and derivatives thereof. Among these, silane coupling agents with amino groups have shown superior effects, especially N-(β-aminoethyl)
-γ-aminopropyltrialkoxysilane is preferred. The halogenated hydrocarbons and aromatic hydrocarbons used in the present invention preferably have a boiling point of about 60°C to 200°C. If the boiling point is too low, good results will not be obtained. Furthermore, if the temperature is higher than 200°C, it takes a long time to dry and the workability is poor. Specific examples include trichlorethylene, tetrachlorethylene, chloroform, carbon tetrachloride, 1,1,2-trichloroethane, 1,1,2,2-tetrachloroethane, ethylene bromide, benzene, toluene, xylene, etc. Among them, trichlorethylene, tetrachlorethylene, toluene, xylene, etc. are suitable for industrial use because they are easily available. The above-mentioned silane coupling agent is dissolved in the above-mentioned halogenated hydrocarbon or aromatic hydrocarbon solvent to prepare a treatment liquid. In this case, the silane coupling agent has a concentration of 0.01 to 5% by weight, preferably 0.05 to 1% by weight. Use. If the amount is less than 0.01% by weight, it is difficult to obtain the effect of adding the silane coupling agent, and if it is added in excess of 5% by weight, stains remain on the surface of the package, which tends to spoil the appearance of the package. When the semiconductor device package is brought into contact with a solution of halogenated hydrocarbon or aromatic hydrocarbon containing a silane coupling agent, the temperature of the solution is between 60 and 60°C.
It needs to be kept at 200℃. By contacting with such a heated solution, the effects of the present invention can be obtained for the first time, and marking with high adhesive strength and reliability can be performed without damaging the appearance. If the temperature of the solution is less than 60°C, a marking with high adhesive strength cannot be obtained, and if it exceeds 200°C, the resin-sealed semiconductor device becomes susceptible to damage. In the present invention, there are no particular restrictions on the method of bringing the package of the semiconductor device into contact with the heated solution, such as immersing the package in the solution, dropping or spraying the solution onto the package, or applying the solution using a roll or brush. Any suitable method is possible. To dry the processing solution, air drying, centrifugation,
Methods such as air blowing may be used, or drying may be accelerated by exposing to high temperatures;
Drying at a temperature of about 120 to 180°C, more preferably about 120 to 180°C, provides better results because the baking process of the silane coupling agent to the package surface proceeds at the same time. After performing the pretreatment as described above, marking is performed using marking ink as is normally done. Marking can be done by printing, stamping, or other methods. Examples of the marking ink used include thermosetting inks, ultraviolet curable inks, room temperature curing inks, and room temperature drying inks. Among these inks, thermosetting inks and ultraviolet curable inks have excellent strength and solvent resistance after curing, so
Particularly preferred. These inks are readily available from, for example, Markem Ecotech. The marking method of the present invention is superior to conventional methods in the following points. In other words, it is possible to provide markings with strong adhesion and high reliability. Regardless of the type or brand of the sealing resin, marking can be performed effectively, the marking ink blends well with the package surface, and beautiful markings with high adhesive strength can be applied. It is not affected by the manufacturing process of semiconductor devices and can always provide stable and highly reliable marking. The effects of the present invention are particularly remarkable in the case of resin-sealed semiconductor devices, but are also effective in can-sealed semiconductor devices. EXAMPLES The present invention will be specifically explained below with reference to Examples. Examples 1 to 3 Semiconductor devices sealed with EME155F semiconductor sealing resin (epoxy resin) manufactured by Sumitomo Bakelite Co., Ltd. were after-cured at 180° C. for 8 hours and used as samples for evaluation. N ₄ (β-aminoethyl)-γ-aminopropyltrimethoxysilane (A) γ-aminopropyltriethoxysilane
(B), and γ-glycidoxypropyltrimethoxysilane
(C) (A) and (C) were each dissolved in trichlorethylene, and (B) was dissolved in toluene to prepare a 0.2% by weight solution. (Hereinafter referred to as processing liquids A, B, and C) First, heat the containers containing processing liquids A, B, and C to boil them (the temperature is approximately 87°C for A and C).
The resin-sealed semiconductor device to be processed was immersed therein for 5 minutes. Thereafter, the semiconductor devices were taken out and air-dried to give Examples 1, 2, and 3, respectively. Next, the semiconductor devices to be processed were immersed in containers containing processing solutions A, B, and C at room temperature for 5 minutes, and then the semiconductor devices were taken out and air-dried. did. Furthermore, two containers containing trichlorethylene (hereinafter referred to as trichlene) containing no silane coupling agent were prepared, one was heated to boiling, and the other was kept at room temperature. After the semiconductor devices to be processed were immersed in each and treated for 5 minutes, the semiconductor devices were taken out and air-dried, which are referred to as Conventional Examples 1 and 2. These processed semiconductor devices and a semiconductor device that was not processed at all (Conventional Example 3) were used as test samples, and marked with a rubber stamp using Markem ink #7224 (thermosetting ink), and the ink was cured. Heat in the oven at 160℃ for 10 minutes. The marking samples obtained as described above were subjected to a cellophane tape test and a pencil hardness test to examine the adhesive strength of the ink.

【table】

[Table] Examples 4 to 7 γ-ureidopropyltrimethoxysilane
(D) and γ-methacryloxypropyltrimethoxysilane (E) were each dissolved in trichlene to prepare a 0.2% by weight solution. (hereinafter referred to as processing liquids D and E) Heat the containers containing processing liquids A, C, D, and E to boiling temperature (approximately 87°C), and place semiconductors sealed with the same resin as in Example 1 in the containers. The device was soaked for 5 minutes. After that, the semiconductor device was taken out and placed in an oven at 120°C and heated for 5 minutes to dry it.
Examples 4, 5, 6, and 7 were used, respectively. Next, Comparative Example 4 was prepared in the same manner using trichlene containing no silane coupling agent. In addition, processing liquid A,
Semiconductor devices immersed in C, D, and E for 5 minutes at room temperature
They were placed in an oven at 120° C. and heat-treated for 5 minutes to dry them to obtain Comparative Examples 5, 6, 7, and 8, respectively. As in Examples 1 to 3, marking was performed using ink #7224, and after curing the ink by heating it at 160°C for 10 minutes, a cellophane tape test and a pencil hardness test were performed. The results are shown in Table 2. Ta.

[Table] Furthermore, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane was dissolved in water and ethyl alcohol to create a 0.2% by weight aqueous solution and an alcoholic solution (hereinafter referred to as treatment solutions F and G, respectively). ). In addition, γ-glycidoxypropylmethoxysilane was dissolved in water and isopropyl alcohol to prepare a 0.2% by weight aqueous solution and an isopropanol solution (hereinafter referred to as treatment solution H, respectively).
It is written as I. ). Heat and boil treatment solutions A, C, F, G, H, and I (temperature: approximately 87°C for A and C, approximately 87°C for F and H).
The same resin-sealed semiconductor device as in Example 1 was immersed therein for 10 minutes at 100°C (G: about 78°C, I: about 82°C). Thereafter, the semiconductor devices were taken out and dried by heating in an oven at 150° C. for 3 minutes to obtain Examples 8 and 9 and Comparative Examples 9, 10, 11, and 12, respectively. Next, the processing solutions F, G, H, and I were kept at room temperature, and the resin-sealed semiconductor device was immersed therein for 10 minutes. After that, the semiconductor device was taken out and heat treated in an oven at 150°C for 3 minutes.
14, 15, 16. Same as Example 1 Ink #7224
The ink was marked using a 160°C heating for 10 minutes to cure, and then a cellophane tape test and a pencil hardness test were performed. The results are shown in Table 3.

【table】

Claims (1)

[Claims] 1 A halogenated hydrocarbon solution or an aromatic hydrocarbon solution containing 0.01 to 5% by weight of a silane coupling agent is heated to 60 to 200°C, and a semiconductor device package is brought into contact with the heated solution. 1. A method for marking a semiconductor device, comprising: drying the package, and then marking the package. 2. The marking method according to claim 1, wherein the package is dried at a temperature of 100 to 200°C.