JPS6244441U - - Google Patents
Info
- Publication number
- JPS6244441U JPS6244441U JP13674585U JP13674585U JPS6244441U JP S6244441 U JPS6244441 U JP S6244441U JP 13674585 U JP13674585 U JP 13674585U JP 13674585 U JP13674585 U JP 13674585U JP S6244441 U JPS6244441 U JP S6244441U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- mold
- block
- cavity block
- holding plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000001721 transfer moulding Methods 0.000 description 2
- 229910001240 Maraging steel Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13674585U JPH041734Y2 (enExample) | 1985-09-05 | 1985-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13674585U JPH041734Y2 (enExample) | 1985-09-05 | 1985-09-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6244441U true JPS6244441U (enExample) | 1987-03-17 |
| JPH041734Y2 JPH041734Y2 (enExample) | 1992-01-21 |
Family
ID=31040147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13674585U Expired JPH041734Y2 (enExample) | 1985-09-05 | 1985-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH041734Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6431425A (en) * | 1987-07-27 | 1989-02-01 | Mitsubishi Electric Corp | Resin sealing apparatus for semiconductor device |
-
1985
- 1985-09-05 JP JP13674585U patent/JPH041734Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6431425A (en) * | 1987-07-27 | 1989-02-01 | Mitsubishi Electric Corp | Resin sealing apparatus for semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH041734Y2 (enExample) | 1992-01-21 |