JPS6243578A - Clip type ic probe - Google Patents

Clip type ic probe

Info

Publication number
JPS6243578A
JPS6243578A JP60181804A JP18180485A JPS6243578A JP S6243578 A JPS6243578 A JP S6243578A JP 60181804 A JP60181804 A JP 60181804A JP 18180485 A JP18180485 A JP 18180485A JP S6243578 A JPS6243578 A JP S6243578A
Authority
JP
Japan
Prior art keywords
probe
pin
clip
capacitor
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60181804A
Other languages
Japanese (ja)
Inventor
Mitsuhiro Waki
脇 光弘
Koji Ogawa
孝治 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Information Technology Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Communication Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Communication Systems Inc filed Critical Hitachi Ltd
Priority to JP60181804A priority Critical patent/JPS6243578A/en
Publication of JPS6243578A publication Critical patent/JPS6243578A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

PURPOSE:To enable the use free from package parts carried by sticking a contact part of an IC probe pin out of a holder. CONSTITUTION:An IC probe pin 2 running through a clip 1 forming the body is integrated with an IC pin contact part 3. The IC pin contact part 3 sticks out of the clip 1 as holder and a groove 3a is provided to match a pin 7 of an IC 6. The clip 1 is positioned higher than a capacitor 8 carried on a package 9. A spring 4 grasps the IC 6 so firmly by an elastic action thereof to keep the IC probe on the pin 7. With such an arrangement, the IC probe can be used without being disturbed by a capacitor 8 even when capacitor 8 is mounted close to the IC 6.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明はパッケージ診断に係り、パッケージ搭載部品に
左右されることなく使用できる、クリップ式ICプロー
ブに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to package diagnosis, and relates to a clip-type IC probe that can be used regardless of the components mounted on the package.

〔発明の背景〕[Background of the invention]

従来のクリップ式ICプローブは、例えば米国特許RE
28064号明細書に示されるように、ICピンとの接
触部分に保持体が形成されていたため、パッケージ搭載
部品位置により、クリップ式ICプローブは使用範囲が
制限される問題点があった。
Conventional clip-on IC probes are known, for example, from US Pat.
As shown in the specification of No. 28064, the clip-type IC probe has a problem in that the range of use is limited depending on the position of the package-mounted parts because a holder is formed at the part that contacts the IC pin.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、パッケージ搭載部品に左右されず使用
できる。クリップ式ICプローブを提供することにある
The object of the present invention is that it can be used regardless of the components mounted on the package. An object of the present invention is to provide a clip-on IC probe.

〔発明の概要〕[Summary of the invention]

本発明の特徴としては、ICプローブピンの接触部分を
、保持体より突出させた点にある。
A feature of the present invention is that the contact portion of the IC probe pin is made to protrude from the holder.

この保持体より突出することによって、ICプローブピ
ンは、むき出しの形状となり、クリップ式ICグローブ
を使用の際は、ICプローブピンの厚さのみである、よ
ってパッケージ搭載部品位置に左右されることなく使用
できる。
By protruding from this holder, the IC probe pin becomes exposed, and when using a clip-on IC glove, the thickness is only the IC probe pin, so it is not affected by the position of the package mounted components. Can be used.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の一実施例を図面により説明する。第1図
は本発明の斜視図、第2図は同じく接触ピンのみの斜視
図、第5図は同じく使用状態を示す斜視図。第1図ない
し第2図、第3図をこおいて、本体を形成するクリップ
1の内部を通るICプローブピン2は、ICピン接触部
3と一体化されている。ICビン接触部3は、IC6の
ピン7と合うように溝3aがあり、クリツプ1が、パッ
ケージ9に搭載されているコンデンサ8より、高い位置
にある。スプリング4は、クリップ式ICプローブがI
C6のビン7より外れないように、IC6を挟みこむ弾
性作用がある。
An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of the present invention, FIG. 2 is a perspective view of only the contact pin, and FIG. 5 is a perspective view of the present invention in use. 1, 2, and 3, the IC probe pin 2 passing through the inside of the clip 1 forming the main body is integrated with the IC pin contact portion 3. The IC bottle contact portion 3 has a groove 3a to fit with the pin 7 of the IC 6, and the clip 1 is located at a higher position than the capacitor 8 mounted on the package 9. The spring 4 is attached to the clip-type IC probe.
It has an elastic action to sandwich the IC6 so that it does not come off the bottle 7 of the C6.

第5図に示すようにIC6に近接して、コンデンサ8が
搭載されていても、コンデンサ8に阻害されることなく
、クリップ式ICプローブが使用できる。また第2図に
示すように、ICビン接触部3の形状を、先端部に突起
物3bをつけることにより、接触を良くしてもよい。
As shown in FIG. 5, even if a capacitor 8 is mounted close to the IC 6, the clip-type IC probe can be used without being hindered by the capacitor 8. Further, as shown in FIG. 2, the shape of the IC bottle contact portion 3 may be modified to improve contact by providing a protrusion 3b at the tip.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、パッケージ搭載部品位置に左右されず
に、クリップ式ICプローブを使用することができる。
According to the present invention, the clip-type IC probe can be used regardless of the position of the packaged components.

高密度部品実装パッケージにおいて、本発明は効果があ
る。
The present invention is effective in high-density component mounting packages.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の一実施例の斜視図、第2図は、本発
明の接触ビンのみの斜視図、第5図は、本発明の使用状
態を示す斜視図である。 符号の説明 1・・・クリップ    2・・・ICプローブビン3
・・・ICビン接触部 4・・・スプリング5・・・ク
リップ支点  6・・・IC7・・・ICビン    
8・・・コンデンサ9・・・パッケージ   5a・・
・溝3b・・・突起物
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a perspective view of only the contact bottle of the present invention, and FIG. 5 is a perspective view showing the state of use of the present invention. Explanation of symbols 1...Clip 2...IC probe bin 3
...IC bottle contact part 4...Spring 5...Clip fulcrum 6...IC7...IC bottle
8...Capacitor 9...Package 5a...
・Groove 3b...protrusion

Claims (1)

【特許請求の範囲】[Claims] 1、ICプローブピンと、これを保持する保持体におい
て、ICプローブピンのICピンとの接触部分のみを、
保持体より突出させたことを特徴とするクリップ式IC
プローブ。
1. In the IC probe pin and the holder that holds it, only the contact part of the IC probe pin with the IC pin,
A clip-type IC characterized by protruding from a holding body
probe.
JP60181804A 1985-08-21 1985-08-21 Clip type ic probe Pending JPS6243578A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60181804A JPS6243578A (en) 1985-08-21 1985-08-21 Clip type ic probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60181804A JPS6243578A (en) 1985-08-21 1985-08-21 Clip type ic probe

Publications (1)

Publication Number Publication Date
JPS6243578A true JPS6243578A (en) 1987-02-25

Family

ID=16107136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60181804A Pending JPS6243578A (en) 1985-08-21 1985-08-21 Clip type ic probe

Country Status (1)

Country Link
JP (1) JPS6243578A (en)

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