JPS6243054A - Vacuum equipment - Google Patents

Abstract

PURPOSE:To prevent a cooling medium from leaking or such and obtain stable cooling, by burying heat conductors such as heat pipes into mechanical parts arranged inside a vacuum system and taking them outside the vacuum system to perform heat exchange in a heat exchanger. CONSTITUTION:The following procedure is for a cooling mechanical part neces sary to cool, which is arranged inside a vacuum system of a vacuum equipment, such as a resolving aperture for improving a separation rate of ion beams in ion implantation equipment. That is, a plural number of heat pipes 18 are buried into the resolving aperture unit 17a, with their one-sided ends made to pass through an outer frame 19 partitioning the inside and outside of the vacuum system and to be coupled with a block 21 in a heat exchanger 20. And, the heat pipes 18 are cooled by circulating cooling water through spiral pipes 22 in the heat exchanger 20. Hence, because the heat of the mechanical parts is taken outside the vacuum system and cooled, a cooling medium can be prevented from leaking or such, with easy maintenance available.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a vacuum device, and particularly to cooling i#R.

(Prior Art) Many of the various mechanical parts that make up a vacuum apparatus need to be cooled for their respective purposes. Hereinafter, an ion implantation apparatus used for manufacturing semiconductor devices will be explained as an example.

Ion implanters have many mechanical parts that require cooling. The vacuum system includes the ion source that generates ions, the structure of the ion source, the beam guide that prevents unnecessary ion beam damage that occurs when selectively separating the ion beam, and the ion beam. These include a resilping aperture to improve separation, a Faraday to measure the ion beam as a current, and a wafer cooling mechanism to prevent damage to the resist patterned on the wafer used for selective ion implantation.

FIG. 3 is a diagram showing the structure of a conventional glue solping aperture, in which (A) is a front view, (B) is a side view, and (C) is a sectional view of the main part. In this example, a bent aluminum pipe 2 is embedded in a glue solping aperture body 1 made of aluminum. Both ends of this pipe 2 pass through an outer frame 5 that partitions the inside of the vacuum system and the outside of the vacuum system, are led out to the outside of the vacuum system, and are connected to a polyethylene tube 4 via a tube joint 3. , cooling water is flowed into the pipe 2 via this tube 4.

A coating 6 is applied to the inner wall of the pipe 2 to prevent corrosion. Further, an O-ring 7 is provided at the outer frame penetrating portion of the pipe 2 for the purpose of maintaining the vacuum inside the vacuum system.

Since the role of the ripple aperture is to separate and shape the ion beam, a portion of the ion beam is irradiated onto the ripple aperture body 1. As a result, the revolving aperture main body 1 generates heat, but the revolving aperture main body 1 is cooled by the cooling water flowing through the pipe 2.

(Problems to be Solved by the Invention) However, the 01 component of the above configuration example cannot solve the problem of water accumulation. In the configuration example above, coating 6 is applied as a corrosion prevention measure, but ironically, corrosion occurs on pipe 2.
It starts from between and coating 6, and coating 6 can be easily penetrated. Corrosion then progresses and holes form in the pipe 2. Once water leaks inside the vacuum system, the situation becomes serious. The vacuum equipment, including the vacuum pump, will need to be disassembled and repaired. - Once the variable vacuum is broken, the more vacuum equipment requires a high degree of vacuum, the longer it will take to return to the original degree of vacuum. What is even more troublesome is water leakage from Bishihole. Water leaks from pinholes are difficult to find and fill. In addition, in the ion implantation apparatus taken as an example in this explanation, there are auat parts such as the ion source to which high voltage is applied, so corrosion may be promoted due to the battery effect.

The cooling method using cooling water also has the problem that the inside of the cooling water pipe becomes clogged and the cooling water stops flowing. Possible causes of clogging include corrosion, foreign matter contained in the cooling water, and coagulation of alkaline components dissolved in/in the cooling water. 8 belonging to the vacuum system! If the cooling water piping of a component becomes clogged, it may be necessary to break the vacuum and replace these mechanical components. Conventional technology sometimes uses pure water or Freon (a commercial name for fluorine compounds) as a cooling medium to prevent clogging. However, when using pure water, a new pure water generator, heat exchanger, and water pump are required, and when using Freon, a new Freon tank, a Freon pump, and a new Freon pump are required. Work is required.

In any case, in the conventional technology, since the cooling medium is introduced into the vacuum system, it is impossible to prevent the cooling medium from leaking into the vacuum system. Prior art techniques have been unsatisfactory due to the extensive damage that can be done to vacuum equipment when cooling medium leaks into the vacuum system.

The present invention eliminates the problem of cooling medium leakage and clogging inside the vacuum system of the vacuum apparatus described above, and provides an excellent operating rate in which mechanical parts that require cooling are stably cooled. The purpose is to provide vacuum equipment.

(Means for Solving the Problems) In the present invention, the heat of the mechanical parts that require cooling is extracted to the outside of the vacuum system by a heat conductor, and the heat is cooled by a cooling medium outside the vacuum system.

(Function) In this way, the cooling medium is kept outside the vacuum system.

(Embodiment) An embodiment of the present invention will be described below with reference to the drawings. One embodiment is a case where the present invention is applied to a solping aperture of an ion implanter.

1 and 2 show one embodiment thereof, and FIG. 2 is a schematic diagram of the entire ion implantation apparatus. In addition, Fig. 1 is a diagram showing the solping aperture part of the beam (A
) is a front view, (B) is a side view, and (C) is a sectional view of the main part.

As shown in FIG. 2, the ion implantation apparatus includes an ion source 11
2, an analysis section 12 and a processing section 13. The insides of these are connected, and gas is discharged by a plurality of vacuum pumps 14 to maintain a high vacuum.

The ion source 11 generates, for example, phosphorus ions and boron ions, and the analyzer 12 generates only P+ ions necessary for processing from among the generated ions such as P, P, PH1°PH2+, etc. It's time to choose.

The processing section 13 performs a process of irradiating the wafer with the ion beam selected by the analysis section 12. This processing section 13 is provided with a disk 15 that is driven to rotate intermittently, and a plurality of wafers 16 are held on this disk 15. Further, the processing section 13 is provided with a resilving aperture 17 that separates and shapes the ion beam.

As shown in detail in FIG. 1, this resilling aperture 17 has two heat pipes 18 embedded in the resilling aperture body 17a.

One end of the heat pipe 18 passes through an outer frame 19 that partitions the inside of the vacuum system and the outside of the vacuum system, and is drawn out to the outside of the vacuum system. One end of the heat pipe 18 is connected to a heat exchanger 20 outside the vacuum system. This heat exchanger 20 is constructed by forming a spiral passageway 22 in a block 21 made of a good heat conductor, and is further constructed so that -i of the heat pipe 18 is embedded in the block 21. There is. Also, the tube #! A polyethylene tube 24 is connected to both ends of the tube 22 via a male connector-type tube joint 23, and cooling water is allowed to flow into the pipe line 22 through the J-sub 24.

In such a configuration, the heat generated in the resilping aperture body 17a is extracted from the inside of the vacuum system to the outside of the vacuum system by the heat pipe 18.

Then, it will be cooled by cooling water in the heat exchanger 20 outside the vacuum system.

Note that an O'J song 5 is used in the outer frame penetrating portion of the heat pipe 18 in order to maintain the degree of vacuum inside the vacuum system.

Further, in the above configuration, the heat pipe 18 is used as the heat conductor in consideration of efficiency, but a metal rod or the like may be used as the heat conductor if the purpose is sufficiently achieved. Further, although cooling water is used as the cooling medium, a gas such as cooling air may also be used.

Further, in the above embodiment, the present invention is applied to a resilving aperture, but in the same way, the disk 15
It is also possible to perform cooling. In that case, it is preferable to extend one end of the heat conductor to the outside of the vacuum system through the center axis 15a of the disk 15.

Furthermore, the present invention can be applied to similar devices other than ion implantation devices.

(Effects of the Invention) As described above in detail, according to the present invention, the heat of @components that require cooling is extracted from the inside of the vacuum system to the outside of the vacuum system, and the heat is cooled by a cooling medium outside the vacuum system. By doing so, it is possible to create a vacuum device in which the cooling medium does not leak into the vacuum system. Also, since there is no need to install the piping for flowing the cooling medium inside the vacuum system, it is expected that even if the piping becomes clogged, it can be repaired without breaking the vacuum.

[Brief explanation of the drawing]

(Drawings) Figures 1 and 2 are diagrams showing one embodiment of the vacuum apparatus of the present invention, and Figure 2 is a schematic diagram of the entire ion implantation apparatus.
The figure shows the resilping aperture part (A
) is a front view, (B) is a side view, (C1 is a sectional view of the main part,
FIG. 3 is a diagram of a resilving aperture portion in a conventional ion implantation apparatus, in which (A) is a front view, (B) is a side view, and (FC) is a sectional view of the main part. 17 Resilping aperture, 17a Repulping aperture body, 18 Heat pipe, 19 Outer frame, 20 Heat exchanger, 21 Block, 22 Pipe line, 23
Tube fitting, 24 tubes.

Claims (1)

[Scope of Claims] 1. (a) In a vacuum device having mechanical parts that require cooling inside the vacuum system, (b) Heat embedded in the mechanical parts and drawn out at one end to the outside of the vacuum system. (c) a heat exchanger connected to the one end of the heat conductor and provided outside the vacuum system to perform heat exchange between the supplied cooling medium and the heat conductor. A vacuum device. 2. The vacuum device according to claim 1, wherein the thermal conductor is a heat pipe.