JPS624129U - - Google Patents
Info
- Publication number
- JPS624129U JPS624129U JP9449285U JP9449285U JPS624129U JP S624129 U JPS624129 U JP S624129U JP 9449285 U JP9449285 U JP 9449285U JP 9449285 U JP9449285 U JP 9449285U JP S624129 U JPS624129 U JP S624129U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- external lead
- chip mounting
- resin
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9449285U JPH0351977Y2 (US06312121-20011106-C00033.png) | 1985-06-24 | 1985-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9449285U JPH0351977Y2 (US06312121-20011106-C00033.png) | 1985-06-24 | 1985-06-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS624129U true JPS624129U (US06312121-20011106-C00033.png) | 1987-01-12 |
| JPH0351977Y2 JPH0351977Y2 (US06312121-20011106-C00033.png) | 1991-11-08 |
Family
ID=30653056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9449285U Expired JPH0351977Y2 (US06312121-20011106-C00033.png) | 1985-06-24 | 1985-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351977Y2 (US06312121-20011106-C00033.png) |
-
1985
- 1985-06-24 JP JP9449285U patent/JPH0351977Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0351977Y2 (US06312121-20011106-C00033.png) | 1991-11-08 |
