JPS624040B2 - - Google Patents
Info
- Publication number
- JPS624040B2 JPS624040B2 JP9484580A JP9484580A JPS624040B2 JP S624040 B2 JPS624040 B2 JP S624040B2 JP 9484580 A JP9484580 A JP 9484580A JP 9484580 A JP9484580 A JP 9484580A JP S624040 B2 JPS624040 B2 JP S624040B2
- Authority
- JP
- Japan
- Prior art keywords
- gasket
- edge
- adhesive sheet
- diaphragm
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000000123 paper Substances 0.000 description 6
- 239000011093 chipboard Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 238000003915 air pollution Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007591 painting process Methods 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
- H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
- H04R7/22—Clamping rim of diaphragm or cone against seating
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Description
【発明の詳細な説明】
本発明は、スピーカ用振動板へのガスケツト合
着方法に係り、特に、スピーカ用振動板のエツジ
にガスケツトを合着させる場合に、正確かつ迅速
に合着させる方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for attaching a gasket to a speaker diaphragm, and particularly relates to a method for accurately and quickly attaching a gasket to the edge of a speaker diaphragm. It is something.
従来、スピーカ用振動板のエツジにガスケツト
を合着させる方法としては、合成ゴム系の有機溶
剤型の接着剤をエツジおよびガスケツトの表面に
筆塗りで塗布して、エツジとガスケツトとを接合
し、自然乾燥または乾燥装置による強制乾燥後、
エツジとガスケツトとに加熱圧着装置により熱と
圧力とを加えて、両者間を合着させる方法があつ
た。 Conventionally, the method of bonding a gasket to the edge of a speaker diaphragm is to apply a synthetic rubber-based organic solvent adhesive to the edge and the surface of the gasket with a brush to bond the edge and gasket. After natural drying or forced drying using a drying device,
There is a method of applying heat and pressure to the edge and gasket using a heat-pressing device to bond them together.
しかしながら、従来のスピーカ用振動板へのガ
スケツト合着方法にあつては、第１に、溶剤型の
接着剤を使用するため、塗布後の糸引き現象が発
生しやすく、硬化するまでに長時間を要し、かつ
塗布量管理や臭気、空気汚染、火気厳禁等の安全
衛生管理上、厳格な注意を要する、第２に、厳格
な塗布量管理を行なう場合には定量塗布装置が、
また、硬化時間短縮化を行なう場合には乾燥装置
や冷却装置がそれぞれ必要になり、設備および費
用が増大化する、第３に、筆塗り作業のため、塗
布量の過多または過少が発生し、過多の場合には
振動板の能率低下の原因となり、過少の場合には
合着面の剥離が発生してビビリ等の原因となる、
等々の欠点があつた。 However, in the conventional method of bonding gaskets to speaker diaphragms, firstly, a solvent-based adhesive is used, which tends to cause stringing after application, and takes a long time to harden. In addition, strict precautions are required in terms of safety and health management such as control of application amount, odor, air pollution, and strict prohibition of fire.Secondly, when performing strict control of application amount, quantitative application equipment is
In addition, when shortening the curing time, a drying device and a cooling device are required, which increases the equipment and cost. Thirdly, because of the brush painting process, the amount of application may be too much or too little. If there is too much, it will cause a decrease in the efficiency of the diaphragm, and if there is too little, the bonding surface will peel off, causing chatter, etc.
There were other shortcomings.
本発明は前述した従来の課題に鑑み為されたも
のであり、その目的は、塗布量管理や安全衛生管
理および硬化必要時間が省略でき、かつ、確実、
強固に合着できるスピーカ用振動板へのガスケツ
ト合着方法を提供するにある。 The present invention has been made in view of the above-mentioned conventional problems, and its purpose is to omit application amount management, safety and health management, and necessary curing time, and to ensure that
To provide a method for bonding a gasket to a speaker diaphragm that can be firmly bonded.
上記目的を達成するために、本発明は、非溶剤
型の接着シートをガスケツト上に貼着し、この接
着シートをして振動板のエツジにガスケツトを合
着させるようにしたことを特徴とする。 In order to achieve the above object, the present invention is characterized in that a non-solvent adhesive sheet is pasted onto the gasket, and the gasket is bonded to the edge of the diaphragm using this adhesive sheet. .
以下、図面に基づいて本発明の好適な実施例を
説明する。 Hereinafter, preferred embodiments of the present invention will be described based on the drawings.
本発明の一実施例にかかるスピーカ用振動板へ
のガスケツト合着方法は、概むね、第１図〜第３
図に示す工程によつて構成されている。 A method for attaching a gasket to a speaker diaphragm according to an embodiment of the present invention is generally shown in FIGS. 1 to 3.
It is constructed by the steps shown in the figure.
まず、第１図に示すように、ガスケツト台紙と
しての大判のチツプボール紙１２の一平面上に接
着シート１４を剥離紙１６を介在させて、加熱ロ
ール１８により適当な温度の熱と圧力とを加えな
がら、両者を同期送りして、連続的に貼り合せて
いく。この接着シート１４は、例えば、ポリオレ
フイン樹脂と合成ゴムとを主成分としてシート状
に構成されたものであり、適当な熱と圧力との付
加の下で、この接着シート１４に接合した部材
（第１図においては、チツプボール紙１２である
が、第３図においては、振動板のエツジであ
る。）に強固に付着する性質を有するものであ
る。 First, as shown in FIG. 1, an adhesive sheet 14 is placed on one surface of a large chipboard 12 serving as a gasket mount, with a release paper 16 interposed therebetween, and heat and pressure at an appropriate temperature are applied using a heating roll 18. At the same time, both are fed synchronously and pasted together continuously. This adhesive sheet 14 is formed into a sheet shape mainly composed of, for example, polyolefin resin and synthetic rubber, and the members (second parts) bonded to this adhesive sheet 14 are bonded to this adhesive sheet 14 under the application of appropriate heat and pressure. In FIG. 1, this is chipboard paper 12, but in FIG. 3, it is the edge of the diaphragm.
続いて、接着シート１４をチツプボール紙１２
上に貼着させることを可能にするために、加熱ロ
ール１８と接着シート１４との間に介在された剥
離紙１６を接着シート１４上から剥離する。 Subsequently, the adhesive sheet 14 is attached to the chipboard paper 12.
The release paper 16 interposed between the heating roll 18 and the adhesive sheet 14 is peeled off from the adhesive sheet 14 in order to enable the adhesive sheet 14 to be pasted thereon.
次に、第２図に示すように、接着シート１４を
貼着したチツプボール紙１２を、打ち抜き型２０
により、リング形状に打ち抜き、所望のガスケツ
ト２２を成形する。このガスケツト２２は、スピ
ーカ用振動板のエツジとほぼ同一のリング形状に
成形する。 Next, as shown in FIG.
The gasket 22 is punched out into a ring shape to form the desired gasket 22. This gasket 22 is formed into a ring shape that is almost the same as the edge of the speaker diaphragm.
ちなみに、前記剥離紙の接着シート１４上から
の剥離は、このガスケツト２２の成形工程後、各
ガスケツト２２ごとに行なうようにしてもよい。 Incidentally, the release paper may be removed from the adhesive sheet 14 for each gasket 22 after the gasket 22 is formed.
その後、第３図に示すように、加熱圧着装置２
４を使用して、ガスケツト２２をスピーカ用振動
板２６のエツジ２８の端面に接着シート１４をも
つて合着させる。すなわち、加熱圧着装置２４
は、スピーカ用振動板２６を伏せた状態で支持す
るとともに、この振動板２６のエツジ２８の下面
をガスケツト２２を介在した状態で受ける受圧面
を備えた下型３０と、この下型３０に対して接離
自在であり、前記振動板２６のエツジ２８の上面
をガスケツト２２を介在した状態で加圧する加圧
面を備えた上型３２と、この上型３２を所望の圧
力で圧下させるロツド３４と、下型３０および上
型３２にそれぞれ外装されてそれらを所望の温度
に加熱するバンドヒータ３６，３８とを備えてい
る。 Thereafter, as shown in FIG.
4, the gasket 22 is attached to the end surface of the edge 28 of the speaker diaphragm 26 using the adhesive sheet 14. That is, the heat compression bonding device 24
A lower mold 30 is provided with a pressure receiving surface that supports the speaker diaphragm 26 in a face down state and receives the lower surface of the edge 28 of the diaphragm 26 with a gasket 22 interposed therebetween; an upper mold 32 that can be freely moved toward and away from the diaphragm 26 and has a pressure surface that pressurizes the upper surface of the edge 28 of the diaphragm 26 with the gasket 22 interposed; and a rod 34 that presses down the upper mold 32 with a desired pressure. , band heaters 36 and 38 are provided on the lower mold 30 and the upper mold 32, respectively, and heat them to a desired temperature.
そして、下型２の受圧面上にガスケツト２２を
接着シート１４を上向きにして載置し、振動板２
６を伏せた状態で下型２に支持させ、そのエツジ
２８下面を接着シート１４に接合させる。続い
て、他のガスケツト２２を接着シート１４を下向
きにしてエツジ２８上面に載置する。その後、上
型３２を圧下させて、上型３２の加圧面と下型３
０の受圧面との間で、上下のガスケツト２２，２
２とエツジ２８とに圧力を加えるとともに、バン
ドヒータ３６，３８とで所定の温度に加熱する。
この加熱と加圧とによつて、ガスケツト２２，２
２の接着シート１４，１４とが付着力を発揮し、
上下のガスケツト２２，２２をエツジ２８の上下
面に合着させる。このとき、合着は数秒間という
短時間の加圧と加熱により完遂される。ちなみ
に、ガスケツト２２は、場合によつて、上下一方
のみで足りることもある。 Then, the gasket 22 is placed on the pressure receiving surface of the lower mold 2 with the adhesive sheet 14 facing upward, and the diaphragm 2 is
6 is supported by the lower mold 2 in a face down state, and the lower surface of the edge 28 is joined to the adhesive sheet 14. Subsequently, another gasket 22 is placed on the upper surface of the edge 28 with the adhesive sheet 14 facing downward. After that, the upper mold 32 is pressed down, and the pressure surface of the upper mold 32 and the lower mold 3
0, the upper and lower gaskets 22, 2
2 and edge 28, and are heated to a predetermined temperature using band heaters 36 and 38.
By this heating and pressurization, the gaskets 22, 2
The adhesive sheets 14, 14 of No. 2 exhibit adhesive force,
The upper and lower gaskets 22, 22 are attached to the upper and lower surfaces of the edge 28. At this time, the bonding is completed by applying pressure and heating for a short period of several seconds. Incidentally, depending on the case, only one of the upper and lower gaskets may be sufficient.
以上説明するように、本発明によれば、非溶剤
型の接着シートによつて振動板のエツジにガスケ
ツトを合着させるものとしたので、接着剤の糸引
き現象が発生しないし、硬化するまでの時間が不
要であり、また、塗布量の管理も必要でないか
ら、塗布量の過多、過少による不具合が発生する
こともなく、さらに、安全衛生管理等が不要であ
り、かつ、強制乾燥装置およびそれに伴う冷却装
置等の設備が省略化でき、しかも、合着の品質が
一定化するとともに、その合着状態が確実強固で
あるという効果を得ることができる。 As explained above, according to the present invention, since the gasket is bonded to the edge of the diaphragm using a non-solvent adhesive sheet, the stringing phenomenon of the adhesive does not occur, and until it hardens. Since there is no need for time for drying, and there is no need to control the amount of application, there is no problem caused by over- or under-applying.Furthermore, there is no need for safety and health management, and there is no need for forced drying equipment or The accompanying equipment such as a cooling device can be omitted, and the quality of bonding can be made constant, and the bonded state can be ensured and strong.
第１図〜第３図は本発明の一実施例による各工
程を示すもので、第１図は第１工程の斜視図、第
２図は第２工程の斜視図、第３図は第３工程の一
部切断正面図である。各図中同一部材には同一符
号を付し、１２はチツプボール紙、１４は接着シ
ート、１６は剥離紙、１８は加熱ロール、２０は
打ち抜き型、２２はガスケツト、２４は加熱圧着
装置、２６はスピーカ用振動板、２８はエツジで
ある。
1 to 3 show each process according to an embodiment of the present invention. FIG. 1 is a perspective view of the first step, FIG. 2 is a perspective view of the second step, and FIG. 3 is a perspective view of the third step. It is a partially cutaway front view of the process. In each figure, the same members are given the same reference numerals, 12 is chipboard, 14 is an adhesive sheet, 16 is release paper, 18 is a heating roll, 20 is a punching die, 22 is a gasket, 24 is a heat-press bonding device, and 26 is a heating roll. The speaker diaphragm 28 is an edge.
Claims (1)
シートをガスケツト台紙上に剥離紙を介し熱と圧
力を加えて貼着させる第１工程と、この第１工程
を経たガスケツト台紙をスピーカ用振動板のエツ
ジとほぼ等しいリング形状に打ち抜いてガスケツ
トを形成する第２工程と、このガスケツトをスピ
ーカ用振動板のエツジ上に前記接着シートを接触
して接合させるとともに、これらガスケツトとエ
ツジとに熱と圧力とを加えて前記接着シートをし
てガスケツトをエツジ上に合着させる第３工程
と、を備えたことを特徴とするスピーカ用振動板
へのガスケツト合着方法。1 A first step in which a sheet to be attached to an arbitrary bonding member is attached to a gasket mount via a release paper by applying heat and pressure under heat and pressure, and a gasket mount that has gone through this first step is used for speaker use. A second step is to form a gasket by punching it into a ring shape that is approximately the same as the edge of the diaphragm, and the gasket is bonded to the edge of the speaker diaphragm by contacting the adhesive sheet, and the gasket and the edges are heated. A method for bonding a gasket to a speaker diaphragm, comprising: a third step of bonding the gasket onto the edge by applying pressure and applying the adhesive sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9484580A JPS5720094A (en) | 1980-07-11 | 1980-07-11 | Cohering method for gasket to diaphragm for speaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9484580A JPS5720094A (en) | 1980-07-11 | 1980-07-11 | Cohering method for gasket to diaphragm for speaker |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5720094A JPS5720094A (en) | 1982-02-02 |
| JPS624040B2 true JPS624040B2 (en) | 1987-01-28 |
Family
ID=14121366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9484580A Granted JPS5720094A (en) | 1980-07-11 | 1980-07-11 | Cohering method for gasket to diaphragm for speaker |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5720094A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000155876A (en) | 1998-11-20 | 2000-06-06 | Nec Corp | Burglarproof device |
| JP2006270844A (en) * | 2005-03-25 | 2006-10-05 | Yamaha Corp | Diapharagm for loudspeakers, method for manufacturing the same loudspeaker unit, and loudspeaker device |
| KR102256411B1 (en) * | 2019-01-03 | 2021-05-27 | 주식회사 이엠텍 | Waterproof speaker |
-
1980
- 1980-07-11 JP JP9484580A patent/JPS5720094A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5720094A (en) | 1982-02-02 |
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