JPS6240377Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an improved installation structure for heating planar heating wires installed on ceilings, walls, floors, etc.

Conventionally, when embedding a heating element in a ceiling, floor, etc., it is preferable to finish the embedding material thin and smooth, and some have used planar heating wires.

By the way, in this case, the stripes are folded and laid at the end of the ceiling or board, but it is impossible to avoid overlapping of the forward and backward stripes at the folded portion.

If the filaments overlap, the amount of heating will be twice as much as in other parts, forming hot spots, which have the disadvantage of shortening the life of the filaments due to overheating.

In addition, there were also drawbacks such as local overheating of floors, ceilings, etc., resulting in the formation of localized hot areas, and discoloration and deterioration when plastic materials were placed on the surface.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned drawbacks of the prior art and provide a stable heating structure.

That is, the gist of the present invention is that it is constructed by folding and laying planar heating wires, and inserting a heat dissipation member made of a material with high thermal conductivity into the folded and overlapping portion of the wires. It has a structure in which planar heating wires are installed.

Next, the structure of the present invention will be further explained with reference to the accompanying drawings. FIG. 1 shows an embodiment of a planar heating wire, in which 1 is a strip resistor, and on its outer periphery, An insulating coating 2 and a protective coating 3 are provided, and if necessary, an adhesive layer 4 is provided on one side to facilitate the installation work.

When laying such a wire 5, it is impossible to lay it by bending it while drawing an arc like a conventional heater wire with a round cross section.
As shown in the figure, the cable is laid while being folded back at the end.

However, in this case, there is always an overlapping portion of the filaments 5 at this folded portion, which has the disadvantage of increasing the amount of heat.

FIG. 4 shows an embodiment that solves this conventional drawback, in which a heat dissipating member 6 is inserted into the folded overlapping portion of the filament 5.

In this embodiment, the heat dissipation member 6 also functions as a mounting bracket and is attached to the ceiling, floor, or wall.

The material for the heat dissipation member 6 is preferably copper, which has high thermal conductivity, but other metals or hard plastics with good thermal conductivity may also be used.

The shape of the heat dissipating member 6 is not limited to the continuous plate shown in FIG. 4, but various shapes shown in FIGS. 5 to 9 are possible, but the area of the heat dissipating member 6 is It is preferable that the area be at least twice the area of the folded overlapping portion of the strips 6, so that twice the amount of heat generated is dispersed over twice the area.

In the structure of this embodiment constructed in this manner, the planar heating wire can be easily attached, and local overheating can be prevented due to the presence of the heat dissipation member.

In the present invention, the heat dissipation member does not necessarily need to be inserted into the folded overlapping part of the planar heating wires, but may be provided in contact with the vicinity of the overlapping part to improve the flow of heat in the overlapping part. The present invention is not to be construed as being limited by the embodiments described above.

As explained above, according to the present invention, it is possible to provide a stable, thin and smooth planar heating wire installation structure without hot spots, and its practical value is extremely high. There is something.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional explanatory diagram showing one embodiment of the planar heating wire used in the present invention, FIGS. 2 and 3 are explanatory diagrams showing two examples of conventional laying structures, and FIG. Explanatory diagrams showing one embodiment of the structure of the present invention, FIGS.
FIG. 9 is an explanatory diagram showing an embodiment of the heat dissipation member used in the present invention. 1... Strip resistor, 2... Insulating coating, 3...
Protective coating, 4...Adhesive layer, 5... Planar heating strip, 6... Heat dissipation member.

Claims (1)

[Scope of utility model registration request] A planar heating wire characterized in that it is constructed by folding and laying a planar heating wire, and inserting a heat dissipating member made of a material with high thermal conductivity into the folded and overlapping portion of the wire. Laying structure.