JPS6237931U - - Google Patents
Info
- Publication number
- JPS6237931U JPS6237931U JP13057785U JP13057785U JPS6237931U JP S6237931 U JPS6237931 U JP S6237931U JP 13057785 U JP13057785 U JP 13057785U JP 13057785 U JP13057785 U JP 13057785U JP S6237931 U JPS6237931 U JP S6237931U
- Authority
- JP
- Japan
- Prior art keywords
- camera
- half mirror
- wire bonding
- light
- illumination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005286 illumination Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Description
第１図はこの考案の一実施例の正面図、第２図
はこの実施例の照明装置の要部拡大図、第３図は
この実施例による２値化されたターゲツトパター
ン図、第４図ａは従来のワイヤボンド装置の正面
図、同図ｂはその側面図、第５図はその照明装置
の要部拡大図、第６図はその２値化されたターゲ
ツトパターン図である。
２…半導体装置、４…ターゲツト位置識別装置
のカメラ、７ｂ…鏡面ボンデング電極、８…照明
灯、９…ハーフミラー、１０…垂直光照明装置。
なお、図中、同一符号はそれぞれ同一、または相
当部分を示す。
Fig. 1 is a front view of an embodiment of this invention, Fig. 2 is an enlarged view of the main parts of the illumination device of this embodiment, Fig. 3 is a diagram of a binarized target pattern according to this embodiment, and Fig. 4. FIG. 5A is a front view of a conventional wire bonding device, FIG. 5B is a side view thereof, FIG. 5 is an enlarged view of the main part of the lighting device, and FIG. 2...Semiconductor device, 4...Camera of target position identification device, 7b...Mirror bonding electrode, 8...Illumination lamp, 9...Half mirror, 10...Vertical light illumination device.
In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ンデングを行うよう構成されているワイヤボンド
装置において、照明灯と、上記カメラの光軸上に
配設されているハーフミラーとで構成され、当該
照明灯から投射された光の一部分を当該ハーフミ
ラーで反射して上記ターゲツト面に垂直に照射し
、その反射光を上記ハーフミラーをとおして上記
カメラに入射させる垂直光照明装置を備えたこと
を特徴とするワイヤボンド装置。 A wire bonding device that is configured to perform wire bonding by recognizing the position of a target with a camera, is composed of an illumination light and a half mirror disposed on the optical axis of the camera, and the illumination light The camera is characterized by comprising a vertical light illumination device that reflects a portion of the light projected from the half mirror on the half mirror, irradiates it perpendicularly to the target surface, and makes the reflected light enter the camera through the half mirror. wire bonding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13057785U JPS6237931U (en) | 1985-08-26 | 1985-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13057785U JPS6237931U (en) | 1985-08-26 | 1985-08-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6237931U true JPS6237931U (en) | 1987-03-06 |
Family
ID=31028207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13057785U Pending JPS6237931U (en) | 1985-08-26 | 1985-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6237931U (en) |
-
1985
- 1985-08-26 JP JP13057785U patent/JPS6237931U/ja active Pending