JPS6237894U - - Google Patents
Info
- Publication number
- JPS6237894U JPS6237894U JP1985130240U JP13024085U JPS6237894U JP S6237894 U JPS6237894 U JP S6237894U JP 1985130240 U JP1985130240 U JP 1985130240U JP 13024085 U JP13024085 U JP 13024085U JP S6237894 U JPS6237894 U JP S6237894U
- Authority
- JP
- Japan
- Prior art keywords
- contactor
- printed board
- insulator
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connecting Device With Holders (AREA)
Description
補正 昭60.12.9 図面の簡単な説明を次のように補正する。Correction 1986.12.9 The brief description of the drawing has been amended as follows.
【図面の簡単な説明】
第1図乃至第2図は本考案の実施例を示し、第
1図は斜視図、第2図は縦断面図である。第3図
乃至第4図は従来例を示し、第3図は斜視図、第
4図は縦断面図である。
1:接触子、2:絶縁体、3:接触子貫挿部、
4:橋絡部、5:IC、9:凹部、10:凸部。BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 and 2 show an embodiment of the present invention, with FIG. 1 being a perspective view and FIG. 2 being a longitudinal sectional view. 3 and 4 show a conventional example, with FIG. 3 being a perspective view and FIG. 4 being a longitudinal sectional view. 1: Contact, 2: Insulator, 3: Contact insertion part,
4: Bridge portion, 5: IC, 9: Concave portion, 10: Convex portion.
Claims (1)
子を差し込んで接続する接触子と、前記接触子の
端子挿入口をその一面に位置させ他面に接触子の
プリント板接続脚を突出させるようにして接触子
を対向して貫挿させた略枠形の絶縁体と、前記絶
縁体の接触子貫挿部相互間を一体につなぐ橋絡部
の外面側に凹設した接続状態のICを抜去用の工
具挿入凹部と前記凹部プリント板側に、プリント
板に当接する凸部とからなるICソケツト。 (2) 絶縁体裏面より凸部が突出した実用新案登
録請求の範囲第1項記載のICソケツト。[Claims for Utility Model Registration] (1) A contactor into which a terminal of an electrical device such as a DIP type IC is inserted and connected, and a terminal insertion opening of the contactor is located on one side and the contactor is placed on the other side. A substantially frame-shaped insulator through which the contacts are inserted facing each other with the printed board connection legs protruding, and a bridge portion that integrally connects the contact insertion portions of the insulator, on the outer surface side thereof. An IC socket consisting of a recessed tool insertion recess for removing a connected IC, and a protrusion on the printed board side of the recess that abuts against the printed board. (2) The IC socket according to claim 1 of the utility model registration claim, in which the convex portion protrudes from the back surface of the insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985130240U JPS6237894U (en) | 1985-08-27 | 1985-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985130240U JPS6237894U (en) | 1985-08-27 | 1985-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6237894U true JPS6237894U (en) | 1987-03-06 |
Family
ID=31027548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985130240U Pending JPS6237894U (en) | 1985-08-27 | 1985-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6237894U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016197120A (en) * | 2007-06-22 | 2016-11-24 | クウォリタウ・インコーポレーテッドQualitau Incorporated | High temperature ceramic socket configured to test packaged semiconductor devices |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5830529B2 (en) * | 1979-08-03 | 1983-06-29 | 赤武エンジニアリング株式会社 | Automatic quantitative liquid supply method |
-
1985
- 1985-08-27 JP JP1985130240U patent/JPS6237894U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5830529B2 (en) * | 1979-08-03 | 1983-06-29 | 赤武エンジニアリング株式会社 | Automatic quantitative liquid supply method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016197120A (en) * | 2007-06-22 | 2016-11-24 | クウォリタウ・インコーポレーテッドQualitau Incorporated | High temperature ceramic socket configured to test packaged semiconductor devices |
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