JPS6237894U - - Google Patents
Info
- Publication number
- JPS6237894U JPS6237894U JP13024085U JP13024085U JPS6237894U JP S6237894 U JPS6237894 U JP S6237894U JP 13024085 U JP13024085 U JP 13024085U JP 13024085 U JP13024085 U JP 13024085U JP S6237894 U JPS6237894 U JP S6237894U
- Authority
- JP
- Japan
- Prior art keywords
- contactor
- printed board
- insulator
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 4
Landscapes
- Connecting Device With Holders (AREA)
Description
補正 昭６０．１２．９ 図面の簡単な説明を次のように補正する。Correction 1986.12.9 The brief description of the drawing has been amended as follows.
【図面の簡単な説明】
第１図乃至第２図は本考案の実施例を示し、第
１図は斜視図、第２図は縦断面図である。第３図
乃至第４図は従来例を示し、第３図は斜視図、第
４図は縦断面図である。
１：接触子、２：絶縁体、３：接触子貫挿部、
４：橋絡部、５：ＩＣ、９：凹部、１０：凸部。BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 and 2 show an embodiment of the present invention, with FIG. 1 being a perspective view and FIG. 2 being a longitudinal sectional view. 3 and 4 show a conventional example, with FIG. 3 being a perspective view and FIG. 4 being a longitudinal sectional view. 1: Contact, 2: Insulator, 3: Contact insertion part,
4: Bridge portion, 5: IC, 9: Concave portion, 10: Convex portion.
Claims (1)
子を差し込んで接続する接触子と、前記接触子の
端子挿入口をその一面に位置させ他面に接触子の
プリント板接続脚を突出させるようにして接触子
を対向して貫挿させた略枠形の絶縁体と、前記絶
縁体の接触子貫挿部相互間を一体につなぐ橋絡部
の外面側に凹設した接続状態のＩＣを抜去用の工
具挿入凹部と前記凹部プリント板側に、プリント
板に当接する凸部とからなるＩＣソケツト。 (2) 絶縁体裏面より凸部が突出した実用新案登
録請求の範囲第１項記載のＩＣソケツト。[Claims for Utility Model Registration] (1) A contactor into which a terminal of an electrical device such as a DIP type IC is inserted and connected, and a terminal insertion opening of the contactor is located on one side and the contactor is placed on the other side. A substantially frame-shaped insulator through which the contacts are inserted facing each other with the printed board connection legs protruding, and a bridge portion that integrally connects the contact insertion portions of the insulator, on the outer surface side thereof. An IC socket consisting of a recessed tool insertion recess for removing a connected IC, and a protrusion on the printed board side of the recess that abuts against the printed board. (2) The IC socket according to claim 1 of the utility model registration claim, in which the convex portion protrudes from the back surface of the insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13024085U JPS6237894U (en) | 1985-08-27 | 1985-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13024085U JPS6237894U (en) | 1985-08-27 | 1985-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6237894U true JPS6237894U (en) | 1987-03-06 |
Family
ID=31027548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13024085U Pending JPS6237894U (en) | 1985-08-27 | 1985-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6237894U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016197120A (en) * | 2007-06-22 | 2016-11-24 | クウォリタウ・インコーポレーテッドＱｕａｌｉｔａｕ Ｉｎｃｏｒｐｏｒａｔｅｄ | High-temperature ceramic socket configured to test packaged semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5830529B2 (en) * | 1979-08-03 | 1983-06-29 | 赤武エンジニアリング株式会社 | Automatic quantitative liquid supply method |
-
1985
- 1985-08-27 JP JP13024085U patent/JPS6237894U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5830529B2 (en) * | 1979-08-03 | 1983-06-29 | 赤武エンジニアリング株式会社 | Automatic quantitative liquid supply method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016197120A (en) * | 2007-06-22 | 2016-11-24 | クウォリタウ・インコーポレーテッドＱｕａｌｉｔａｕ Ｉｎｃｏｒｐｏｒａｔｅｄ | High-temperature ceramic socket configured to test packaged semiconductor device |
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