JPS6236550U - - Google Patents
Info
- Publication number
- JPS6236550U JPS6236550U JP1985128647U JP12864785U JPS6236550U JP S6236550 U JPS6236550 U JP S6236550U JP 1985128647 U JP1985128647 U JP 1985128647U JP 12864785 U JP12864785 U JP 12864785U JP S6236550 U JPS6236550 U JP S6236550U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- view
- irregularities
- semiconductor element
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/50—
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- H10W72/07551—
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- H10W72/533—
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- H10W72/5363—
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- H10W72/543—
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- H10W72/551—
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- H10W72/555—
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- H10W74/00—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985128647U JPS6236550U (oth) | 1985-08-22 | 1985-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985128647U JPS6236550U (oth) | 1985-08-22 | 1985-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6236550U true JPS6236550U (oth) | 1987-03-04 |
Family
ID=31024509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985128647U Pending JPS6236550U (oth) | 1985-08-22 | 1985-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6236550U (oth) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03151648A (ja) * | 1989-11-08 | 1991-06-27 | Toshiba Corp | ボンディングワイヤ及びこれを有する半導体装置 |
| US6849930B2 (en) | 2000-08-31 | 2005-02-01 | Nec Corporation | Semiconductor device with uneven metal plate to improve adhesion to molding compound |
-
1985
- 1985-08-22 JP JP1985128647U patent/JPS6236550U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03151648A (ja) * | 1989-11-08 | 1991-06-27 | Toshiba Corp | ボンディングワイヤ及びこれを有する半導体装置 |
| US6849930B2 (en) | 2000-08-31 | 2005-02-01 | Nec Corporation | Semiconductor device with uneven metal plate to improve adhesion to molding compound |