JPS6236538U - - Google Patents
Info
- Publication number
- JPS6236538U JPS6236538U JP12690285U JP12690285U JPS6236538U JP S6236538 U JPS6236538 U JP S6236538U JP 12690285 U JP12690285 U JP 12690285U JP 12690285 U JP12690285 U JP 12690285U JP S6236538 U JPS6236538 U JP S6236538U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- performs
- centering
- positioning device
- coarse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 description 1
Description
第１図は本考案の実施例に係るウエハ位置決め
装置の平面図、第２図は第１図の実施例の縦断面
図、第３図はウエハとＶ字形押え治具の配置関係
を示す治具の斜視図、第４図はオリエンテーシヨ
ン・フラツト部が１つのウエハに対するセンタリ
ングの配置を示すウエハおよび治具の平面図、第
５図および第６図は２つのオリエンテーシヨン・
フラツト部をもつウエハに対するセンタリング時
のウエハ、治具の配置状態を示す平面図である。
１……Ｖ字形押え治具、２……ウエハ、３，３
′……オリエンテーシヨン・フラツト部、４〜７
……Ｖ字形押え治具とウエハとの接点部、８……
治具中心軸、１０……隙間、１１……多点押え接
点部、１２……取付板、１３……ボルト、１４…
…ウエハ置載台、１５……検出センサ、１６……
Ｖ字形押え治具のウエハ押え面。
FIG. 1 is a plan view of a wafer positioning device according to an embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of the embodiment of FIG. 1, and FIG. 3 is a jig showing the arrangement relationship between a wafer and a V-shaped holding jig. FIG. 4 is a plan view of the wafer and jig showing the centering arrangement for a wafer with one orientation flat; FIGS.
FIG. 3 is a plan view showing the arrangement of a wafer and a jig during centering of a wafer having a flat portion. 1...V-shaped holding jig, 2...Wafer, 3,3
'... Orientation flat section, 4-7
...Contact part between V-shaped holding jig and wafer, 8...
Jig center axis, 10... Gap, 11... Multi-point presser contact part, 12... Mounting plate, 13... Bolt, 14...
...Wafer mounting table, 15...Detection sensor, 16...
Wafer holding surface of V-shaped holding jig.
Claims (1)
しを行う粗位置出し機構と精度の良い中心出しを
行う高精度位置出し機構とを有し、はじめに粗い
精度でウエハの中心出しを行い、ウエハの上下位
置を変更して、高精度の中心出しを行うことを特
徴とするウエハの位置決め装置。 It has a coarse positioning mechanism that performs rough centering and a high-precision positioning mechanism that performs accurate centering that are combined vertically with each other.First, the wafer is centered with coarse accuracy, and then the vertical position of the wafer is determined. A wafer positioning device that performs highly accurate centering by changing the wafer positioning device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12690285U JPS6236538U (en) | 1985-08-20 | 1985-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12690285U JPS6236538U (en) | 1985-08-20 | 1985-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6236538U true JPS6236538U (en) | 1987-03-04 |
Family
ID=31021142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12690285U Pending JPS6236538U (en) | 1985-08-20 | 1985-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6236538U (en) |
-
1985
- 1985-08-20 JP JP12690285U patent/JPS6236538U/ja active Pending
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