JPS6234008U - - Google Patents
Info
- Publication number
- JPS6234008U JPS6234008U JP12554985U JP12554985U JPS6234008U JP S6234008 U JPS6234008 U JP S6234008U JP 12554985 U JP12554985 U JP 12554985U JP 12554985 U JP12554985 U JP 12554985U JP S6234008 U JPS6234008 U JP S6234008U
- Authority
- JP
- Japan
- Prior art keywords
- piping
- concrete slab
- groove
- supply
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000008187 granular material Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000009428 plumbing Methods 0.000 description 1
Landscapes
- Domestic Plumbing Installations (AREA)
Description
第1図は、高層集合住宅における水廻り部位の
平面概略図、第2図は、第1図におけるX―X線
矢視断面図、第3図a,bは、従来の配管構造を
説明する断面概略図である。
1……高層集合住宅、11……コンクリートス
ラブ、12……配管溝、2……板材、A……水廻
り部位、B……水廻り部位、C……廊下、P,P
……給・排水管、W……粉・粒体。
Figure 1 is a schematic plan view of the water supply area in a high-rise apartment complex, Figure 2 is a sectional view taken along the line X--X in Figure 1, and Figures 3a and b illustrate the conventional piping structure. It is a cross-sectional schematic diagram. 1...High-rise apartment complex, 11...Concrete slab, 12...Plumbing groove, 2...Plate material, A...Water area, B...Water area, C...Corridor, P, P
...Supply/drainage pipes, W...Powder/granules.
Claims (1)
位間に給・排水管を配設するものにおいて、各水
廻り部位のコンクリートスラブと廊下、居室等の
コンクリートスラブを連通させた状態で配管溝を
設け、該配管溝内に給・排水管を配設し、該給・
排水管周囲に粉・粒体を充填するとともに配管溝
上部を板材により覆つたことを特徴とするコンク
リートスラブ内の配管構造。 In cases where supply/drainage pipes are installed between two or more water-related areas on both sides of a hallway, living room, etc., the piping is carried out with the concrete slab of each water-related area communicating with the concrete slab of the hallway, living room, etc. A groove is provided, and a supply/drainage pipe is installed within the piping groove.
A piping structure inside a concrete slab characterized by filling the area around the drainage pipe with powder or granules and covering the upper part of the piping groove with a board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12554985U JPS6234008U (en) | 1985-08-16 | 1985-08-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12554985U JPS6234008U (en) | 1985-08-16 | 1985-08-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6234008U true JPS6234008U (en) | 1987-02-28 |
Family
ID=31018540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12554985U Pending JPS6234008U (en) | 1985-08-16 | 1985-08-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6234008U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11789482B2 (en) | 2021-03-26 | 2023-10-17 | Samsung Electronics Co., Ltd. | Bandgap reference circuit including resistivity temperature coefficient cancellation circuit, and oscillator circuit including the bandgap reference circuit |
-
1985
- 1985-08-16 JP JP12554985U patent/JPS6234008U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11789482B2 (en) | 2021-03-26 | 2023-10-17 | Samsung Electronics Co., Ltd. | Bandgap reference circuit including resistivity temperature coefficient cancellation circuit, and oscillator circuit including the bandgap reference circuit |