JPS6230354U - - Google Patents
Info
- Publication number
- JPS6230354U JPS6230354U JP12074485U JP12074485U JPS6230354U JP S6230354 U JPS6230354 U JP S6230354U JP 12074485 U JP12074485 U JP 12074485U JP 12074485 U JP12074485 U JP 12074485U JP S6230354 U JPS6230354 U JP S6230354U
- Authority
- JP
- Japan
- Prior art keywords
- cooling body
- box
- semiconductor
- underfloor
- vehicle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Description
第１図は本考案の実施例の車両の床下箱収納半
導体スタツクの概要構造を示す断面図、第２図は
第１図の半導体スタツクの詳細を示す部分断面図
、第３図および第４図は従来の床下箱収納半導体
スタツクの部分断面図である。
１ａ，１ｂ：平形半導体素子、２：締付金具、
３：床下箱、４：冷却体、５：つなぎ導体、６：
風胴、７：外側冷却体、８：取付板、９：カバー
、１０：パツキング、１１：絶縁シート。
FIG. 1 is a cross-sectional view showing the general structure of a semiconductor stack stored in an underfloor box of a vehicle according to an embodiment of the present invention, FIG. 2 is a partial cross-sectional view showing details of the semiconductor stack shown in FIG. 1, and FIGS. 3 and 4. 1 is a partial cross-sectional view of a conventional semiconductor stack housed in an underfloor box. 1a, 1b: flat semiconductor element, 2: tightening fittings,
3: Underfloor box, 4: Cooling body, 5: Connecting conductor, 6:
Wind barrel, 7: Outer cooling body, 8: Mounting plate, 9: Cover, 10: Packing, 11: Insulating sheet.
Claims (1)
いて、前記床下箱に車両走行風を導入する風胴を
設けるとともに冷却体を風胴に密着または風胴内
に臨ませ、前記冷却体と、前記床下箱外方にその
表面を露出させる外側冷却体との間に半導体素子
を少くとも２個積重ねてなる半導体スタツクを密
着状態で介挿したことを特徴とする車両の床下箱
収納半導体装置。 (2) 実用新案登録請求の範囲第１項記載の半導
体装置において、外側冷却体が締付金具により床
下箱の一部または冷却体に固定されている半導体
装置。[Scope of Claim for Utility Model Registration] (1) In a semiconductor device stored in an underfloor box of a vehicle, a wind barrel is provided in the underfloor box for introducing vehicle running wind, and a cooling body is placed in close contact with the wind barrel or inside the wind barrel. A semiconductor stack formed by stacking at least two semiconductor devices is interposed in close contact between the cooling body and an outer cooling body whose surface is exposed to the outside of the underfloor box. Semiconductor equipment stored in a box under the floor of a vehicle. (2) Utility Model Registration The semiconductor device according to claim 1, in which the outer cooling body is fixed to a part of the underfloor box or the cooling body with a fastening fitting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12074485U JPS6230354U (en) | 1985-08-06 | 1985-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12074485U JPS6230354U (en) | 1985-08-06 | 1985-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6230354U true JPS6230354U (en) | 1987-02-24 |
Family
ID=31009348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12074485U Pending JPS6230354U (en) | 1985-08-06 | 1985-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6230354U (en) |
-
1985
- 1985-08-06 JP JP12074485U patent/JPS6230354U/ja active Pending
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