JPS62296986A - Compound laser beam machine - Google Patents

Abstract

PURPOSE:To machine a work at the proper position by moving a camera at the prescibed position with respect to the work and observing an actual state of the work to perform the subsequent machining. CONSTITUTION:The work W is mounted on a fixed table 101 and held by a clamping device CLP. On the other hand, rails RR and RL are provided along the X direction in figure on the top of both ends of the table 101 and a portal mobile frame 125 extending over these rails is provided. A head supporting body 127 which is movable in the Y direction in figure along the rails is provided to the frame 125 and a machining head 125 is fitted to the supporting body 127 and the light reflection type camera 105 is provided to its one side. Since the work surface is observed using the camera 105 and the subsequent machining can be performed at the proper position, finished accuracy is especially improved.

Description

[Detailed description of the invention] 3. Detailed description of the invention [Industrial application field] The present invention relates to a combined sea 11 processing machine.

[Prior Art] Generally, in a sheet metal alignment line that is composed of, for example, an NC turret punch press and a laser processing machine, NC
When a workpiece output from a turret punch press is hit into a laser processing machine, errors occur due to re-gripping when the workpiece is fixedly placed on the worktable.

The design error of the workpiece affects the machining accuracy of the Sea 11 machining machine.

Furthermore, even in a combined processing machine where a press processing means and a laser processing means are combined into one machine, the press processing position may be distorted due to the influence of the workpiece itself being distorted by the press processing. A deviation may occur between the laser processing position and the laser processing position.

Therefore, if the actual state of the workpiece is recognized before machining, and then the predetermined machining is performed, accurate machining will be possible.

[Object of the Invention] This invention was made in view of such conventional problems, and it is possible to perform machining with good M degree by performing subsequent machining after observing the actual state of the workpiece. The purpose of the present invention is to provide a compound laser processing machine that can perform the following tasks.

[Summary of the Invention] In order to achieve the above object, the present invention provides a laser processing machine including a work table on which a work is placed, a laser processing head that irradiates the work with a laser beam, the work table and the processing. a relative moving means for moving the head relatively; a camera and a press member attached to the attachment member of the processing head with a predetermined offlet relative to the processing head; and a press member attached to the workpiece directly below the camera; a reference mark positioning means for positioning a designated reference mark; and a processing means for processing an appropriate position of the workpiece based on a planar position or a planar orientation of the reference mark imaged by the camera.

The system is equipped with the following functions, and the model is processed after observing the actual state of the workpiece.

[Embodiments of the Invention] Hereinafter, embodiments of the present invention will be described as embodiments related to correction methods (FIGS. 1 to 8, FIGS. 14 and 15), and embodiments of cameras (FIGS. 9 to 13). ) and an example of application to a laser processing machine (FIGS. 16 to 23).

1 and 2 show an embodiment of the present invention, in which a workpiece shape recognition device 3 is installed for a laser processing machine 1.
is installed.

The laser processing machine 1 is installed together with, for example, an NG stub punch press, and constitutes a silver-gold composite line.

The workpiece shape recognition device 3 includes a camera 5 installed in the laser processing machine 1 as an image capturing means, an image processing device 7,
An image reproducing terminal 9 is provided, and the image processing device 7 is connected to a control roller 11 of the laser processing machine 1.

The camera 5 is further attached with a shutter 13 and a lamp 15. Further, the work table 17 of the laser processing machine 1 is provided with an image capture hole 19, and the light from the lamp 15 is set to reach the camera 5 through the image capture hole 19.

The operation of the workpiece shape recognition device having the above configuration will be explained next.

As shown in Fig. 3, when the workpiece W is installed on the work table 17 of the laser processing machine 1 in a state shifted from the normal position as shown in Fig. 3(a), the rotation angle θ is requires the modification shown in Figure (b),
Corrections in the X-axis and Y-axis directions are required as shown in FIGS.

The correction values n for θ, X, and Y are shown in Figures 4 to 6.
According to the procedure shown in the figure. Laser processing is performed on the work table 17 of the machine 1: The work W placed Q has a standard machined hole △1 for table installation in advance. The workpiece 17 is moved and positioned so that one of the two reference holes A2, J3, is located directly below the camera 5. (Steps 21 and 22> This small controller 11 issues an image capture command for the table installation reference hole A1. (Step 23
) Through this image capturing command, the image processing device 7 turns on the lamp 15, closes the shutter 13, and sets the W iff
An image of hole A1 is captured by camera 5. When the image capture is completed, the shutter 13 is closed, the lamp 15 is turned off, and then the hypocenter coordinates (XI', V1-) are calculated, and after the calculation, the reference hole A1 image capture completion signal is sent to the controllers 1 to 511. It shines against. (Step 24-
26) Next, the work table 17 is moved so that the table installation reference machined hole A2 is directly below the camera 5, and after the positioning is completed, an image capture command for the reference hole A2 is issued to the image processing device 7.

(Steps 27-29) On the image processing device 7 side, in response to the above image capture command, the lamp 15 is turned on, the shutter 13 is opened, and image capture of the reference hole A2 is started b1. After this image capture is completed, the shutter 13 is opened, the lamp 15 is turned off, and then the center of gravity coordinates (X2-
, V2-) is calculated. After the 81 calculation of the center of gravity coordinates of the processing reference hole A2 is completed, a reference hole A2 image capture completion signal is issued to the controller 11. (Steps 30-32> Subsequently, in the image processing device 7, the machining reference hole AI of the actual workpiece W obtained by the above processing is processed.

Coordinates of the center of gravity of A2 (XI-, V2-), (X2').

y2'), the regular center of gravity coordinates (XI, "/1), (X2.V
2) and calculate correction values Δθ, ΔX, and ΔY. (
Step 33) Calculation of this correction value is as follows.

△θ-COS"1 (Δ/B) A= (X2-x + ) (X2--x + -
)+<V2-V+ >(V2'-V+ -)B=J[
((xz XI)'+1V2-V+)')・((X2
−−XI −)′+(V2′−V+ −)′)]]Δ
X=X+--x ΔY=”/j ′-'/1 For the correction values obtained in this way, 〇, ΔX, and ΔY,
Feedback is provided to the controller 11 of the laser processing machine 1. In response to this correction value data, the controller 11 can apply corrections to the positioning of the work table 17 of the laser processing machine.

In the above embodiment, the correction values are sent online to the controller 11, but the correction values Δθ, ΔX are sent from the image processing device 7 to the image reproduction terminal 9.
, ΔY can be output and displayed, and the operator can input correction values to the controller 11 by looking at the displayed data.

In this way, in the silver-gold composite line, when the installation position of the workpiece automatically sent to the laser processing machine 1 deviates from the normal state, the workpiece shape recognition device 3 determines the actual installation position of the workpiece W. The positional deviation of the workpiece W can be detected and given as a correction value to the controller 11 of the laser processing machine 1, and during laser processing, the processing position of the workpiece W is corrected based on the correction value to perform accurate laser processing.

Note that the above-mentioned machining reference hole Δ1 of the work W. Using A2, or separately forming a reference hole for machining judgment in the workpiece W,
The shape of the machining reference hole is captured by the camera 5, and compared with the area of the regular machining determination reference hole stored in the storage means in the learning mode, to determine whether the product is machined successfully or poorly. This process shape determination procedure will be explained based on FIGS. 7 and 8.

In the learning mode, the regular area S of the reference hole for machining determination is stored in advance.

When the laser machining of the workpiece W is completed, the reference hole S' for machining judgment formed on the workpiece W is positioned directly below the camera 5, and the command to capture the image of the reference hole for machining judgment is used to recognize the workpiece shape. Issued to device 3. (Step 41.
42> In the image processor 11 device 7, the lamp 15 is turned on, the shutter 13 is opened, and the camera 5 captures an image of the reference hole S' for processing determination. After this image capturing is completed, the shutter 13 is closed and the lamp 15 is turned off. (Step 43) After this, the reference hole S for processing judgment
- is calculated and compared with the surface v4S of the regular machining determination reference hole stored during the learning mode. (Steps 44, 45> Here, if (S-8'') exceeds the allowable error range, it is assumed that the processed product is defective, and an alarm is issued to notify the operator.

By collecting an image of the machining reference hole formed on the workpiece W in this way and calculating its area, it is possible to determine whether the area of the actual machining reference hole is within a certain tolerance range with respect to the regular area. Accordingly, it is possible to determine whether the product is good or bad.

In the above embodiment, a case has been described in which the camera 5 is fixed to the laser processing machine 1 and the work table 17 is moved, but the camera may be configured so that it can be moved to a desired position with respect to the work. is also possible, and furthermore,
These application examples, which can also be applied to objects in which both move and position at the same time, will be described in detail in FIG. 16 and subsequent figures.

In the above embodiment, the correction value is calculated by comparing the regular shape data of the machining reference surface of the workpiece with the actual shape data, so the correction value is used to calculate the positional deviation of the machining reference surface of the workpiece. It is possible to process a workpiece while making corrections, and it has the advantage that it can be used to realize accurate processing even if a positional shift occurs in the installation of the workpiece.

Next, the camera will be explained in detail.

Referring to FIGS. 9 to 11, the camera 5 is appropriately mounted on the frame F of the laser processing machine 1 and covered by a cover 47. As shown in FIGS.

More specifically, a bracket 49 having a T-shaped cross section is attached to the side surface of the frame F.
In addition, an L-shaped support bracket 51 comprising a horizontal part 51)-1 and a vertical part 51V is connected to a plurality of draw bolts 53.
and is adjustable via push bolts 55. The camera 5 is directly attached to the vertical portion 51V of the support bracket 51.

In order to prevent external light from acting as a disturbance on the light receiving section 5R at the lower end of the camera 5,
A storage cylinder 57 surrounding the workpiece W is provided at a position close to the camera 5.
7 is provided with a temporary holding device 59 for pressing and fixing.

More specifically, a small air cylinder 61 is vertically provided at a side position of the camera 5, and a piston rod 6 is provided on the air cylinder 61 so as to be movable up and down.
A presser pad 65 is attached to the lower end of 3. Further, the protection tube 57 is integrally attached to the piston rod 63 via a connecting member 67. The lower end of the protection tube 57 is always located at a higher position than the lower end of the presser pad 65.

Both upper and lower ends of the air cylinder 61 are supported by brackets 69, and each bracket 69 is attached to the frame F to a support member 61 having an appropriate configuration according to the attachment number. In order to restrict the rotation of the piston rod 63 and the like, a guide bar 73 is attached to the connector 67, which passes through the lower bracket 69 vertically for 1 h.

With the above configuration, by operating the air cylinder 61 to lower the piston rod 63, the work W is pressed and fixed onto the work table 17 by the presser pad 65, and the protection cylinder 57 is lowered integrally, and the lower end The part is brought into close proximity to the workpiece W. Therefore, when the camera 5 captures an image of the reference hole of the workpiece W, the workpiece W does not move, and external light can be prevented from acting as a disturbance.

The cover 47 is attached to the camera 5 and the temporary holding device 59.
It is configured in an appropriate shape so as to cover etc., and is fixed to the frame F in an appropriate manner. This cover 47 is located at a portion facing the light receiving portion 5R of the lower end of the camera 5, the lower end of the protective tube 57, etc. An ivy 13 is provided. This Shit7 ivy 13 is made up of two open leaves in a roughly oval shape.
It consists of plates 13A and 13B, and each opening/closing plate 13A
, 13 [3 is pivoted to the cover 47 via a hinge pin. Although detailed illustrations are omitted, a torsion spring is provided in the hinge bin portion to bias each opening/closing plate 13A, 13B in the direction of closing. Therefore, each of the opening/closing plates 13A, 13B is normally closed with the respective tips thereof pressed together.

Opening/closing plate 13A, 13t31 for J3 in the shutter 13 above
7) Opening and closing are performed by the action of the air cylinder 61. That is, as described above, when the piston rod 63 of the air cylinder 61 is lowered, the presser pad 65 comes into contact with the opening/closing plates 13A, 13B and opens, and then the protection tube 57 moves against the opening/closing plates 13A.

13B is further opened. The above piston rod 6
3 is returned to the upper limit, the opening and closing of each of the opening and closing plates 13A and 13B by the protection cylinder 57 and the presser pad 65 is released, and each of the opening and closing plates 13A and 13B is returned to the normal closed state by the action of the torsion spring.

Referring to FIGS. 12 and 13, the lamp 15 placed below the camera 5 is removably attached to a socket 75.
Base plate 77 attached to part of the frame of IA1
I put it on. This base plate 77 has a lamp 1
A cylinder cover 79 surrounding the socket 75 and the socket 75 is fixed upright, and a lid member 81 is provided on the upper part of the cylinder cover 79 so as to be openable and closable.

More specifically, an inverted U-shaped hinge bracket 83 is integrally attached to one side of the lid member 81, and both legs of the hinge bracket 83 are horizontally and rotatably attached to the upper part of the tube cover 79. It is appropriately fixedly supported at both ends of a freely supported hinge bin 85. One end of the hinge bin 85 is connected to an output shaft 97 of a rotary actuator 89 via a coupling 87. The rotary actuator 89 is supported by the cylinder cover 79 via a bracket 93. An air nozzle 97 is connected to the upper part of the hinge bracket 83 via a suitable fitting 95.
is installed. This air nozzle 97 is for ejecting an air jet to clean the reference machining hole h3 of the work W, and its tip is directed toward the image attachment hole 19 provided in the work table 17.

With the above configuration, when an image of the reference machined hole of the workpiece W is captured by the camera 5, an air jet can be injected from the air nozzle 97 to clean the reference machined hole of the workpiece W, thereby reducing the influence of deposits. can be excluded.

Next, by operating the rotary actuator 87, the lid member 81 can be opened, and irradiation by the lamp 15 becomes possible. Furthermore, when irradiation is not required 11Y, the lamp 15 can be protected from being opened by operating the rotary actuator 87 in reverse to close the lid member 81.

Various application examples will be described below with reference to FIGS. 14 to 23.

First, FIGS. 14 and 15 show an example of an application of correction.

As shown in FIG. 14, let us consider a case where punch holes pH are formed in the workpiece W using a punch press or the like to the turret 1 for each of a plurality of products M1 to M6, and the broken line portion LH is laser-processed.

In this case, if the punch hole P11 is formed using the previously created NC machining data, and then the laser hole LH is formed, there is a risk that a large misalignment will occur between the two holes PH and Ll-(. be.

Here, when forming the laser hole LH, if the punch hole is imaged in advance with the camera 5 shown in FIG. 1, and a predetermined correction is performed during laser processing using the method shown in FIGS. 1 to 8, For each product M1 to M6, the punch holes PH and the laser holes LH can be aligned.

In particular, the effect is remarkable in a multi-tasking machine that can perform press working and laser processing at the same time as described in FIG. 19.

That is, FIG. 15 shows a processing method for such a gate processing machine.

In step 1501, a punch hole PH of the unit product Mi is created by the press, and in step 1502, the camera 5
An image of the punch hole P l-1 is taken by.

Next, in step 1503, the processed shape of the sea 11 (L
I-1>, the laser processing NC data is corrected. Here, upon laser processing, instead of correcting previously created data, new NC data may be created based on the punch hole PH position that has been formed.

In step 1504, the medium-sized product Mi is subjected to laser processing, and then, in step 1501, the next product is processed.

According to the examples shown in FIGS. 14 and 15, it is possible to eliminate relative errors caused by changing the grip of the workpiece W, etc.

Note that the number of punched holes PH captured by the camera 5 does not necessarily have to be plural as shown in this example, and the relative relationship between the laser holes PH and punched holes PH as a product shape can be appropriately determined. As long as it is possible to do so, it may be a single circle, a single point, or a curved shape such as an angle.

Further, the punch hole PH as the pre-processing does not necessarily have to be a punch hole, and any mark that serves as a reference for performing the subsequent laser processing L1-1 may be used as long as it can be imaged by the camera 5.

Next, when applying the image processing device to a machine, one of the things that needs to be considered is the relative movement method.

That is, the laser processing machine performs processing by relative movement between the workpiece W and the laser processing head, and depending on the method, the internal structure of the camera 5, the mounting structure of the camera 5, the correction method, etc. are different. It is something.

Therefore, the relative movement methods can be classified into the following three types based on the classification number.

(I) A method in which the laser processing head is fixed and the workpiece W moves on the XY plane.

(II) Contrary to <I), the workpiece W is fixed and the laser processing head moves on the XY plane.

(I[[) A method in which the laser processing head and workpiece W move independently in orthogonal directions.

Hereinafter, examples will be described for each of these movement methods in which RF is applied to compound machines.

The laser processing machine 99 shown in FIG. 16 has a processing head (not shown) fixed in the same way as the laser processing machine shown in FIG. It is of type. However, in the sear processing machine 99 shown in this example, the table 101 is supported by the movable floors TX and Y that are located below the table 101, and the lower surface of the workpiece W is not moved! In the 7I area, there is at least one floor surface TX or TY on the lower surface.
It becomes a mode.

In such a laser processing machine 99, 1, a work W
It is difficult to leak a lamp 15 as shown in FIG. 2 onto the underside of the lamp.

Therefore, in this example, a camera 105 is provided on the gate-shaped frame 103 that supports the processing head, and the camera 5 is of a light reflection type. In the figure, reference numeral LB indicates a laser beam, reference numeral 107 indicates a base, and reference numerals 109 and 111 indicate a reflecting mirror and a condensing lens.

The mounting position of the camera 105 on the portal frame 103 is preferably on the side of the processing head or in a position close to the head. This is because, in general, in this type of laser processing machine, each position of the workpiece W can be made to correspond to the processing head by moving the movable bed TX and the table Y. This is because if the positions are close, it is possible to image a predetermined position on the entire upper surface of the workpiece W.

In addition, if the camera 105 cannot be installed in a position close to the processing head due to equipment reasons, the camera 105 can be moved at least in the Y direction in the figure on the portal frame 103 or a frame installed in parallel with this. It is recommended that it be installed in

The image No. 13 of the camera 105 is taken into the image processing device 7 as shown in FIG.
In addition to positional corrections, corrections for each product as shown in FIGS. 14 and 15 are also performed.

In this example, the camera is a light reflection type camera, but in special cases where the table 101 can be provided with a lamp 15, it is also possible to use a light transmission type camera. be.

The radar processing machine 113 not shown in FIG. 17 is an example of a fixed-head type machine similar to that shown in FIG. 16. however,
The sear machining machine 113 shown in this example is a composite type in which a punch is disposed with a sear head and a predetermined offset.

The workpiece W is held by a clamp device CI-P. The clamp device CLP is attached to a carriage 115 that is movable in the X direction. Ki17 Ritsuji 115
is attached to the edge of a table 111 that is movable in the Y direction. Therefore, the workpiece W is clamped by the clamping device CL Pt
, :J, can be held and moved freely on the XY plane.

On the other hand, a support 117 is attached to the rear end of the base 107, and a beam 119 extends from this branch 117 toward the top surface of the table 101, and a predetermined offlet is attached to the front end of the beam 119. Rate processing head, punch 121
, a camera 105 is attached. A die (f in the drawing) is provided at a position of the base 107 facing the punch 121. Also, TC to punch 121 as appropriate.
(automatic tool changer) is installed.

This example can be considered as an example in which the composite lines shown in FIG. 1 are combined into one, and punching and laser processing are performed with one machine.

For example, when considering processing the workpiece W as shown in FIG. 14, first, the punch 12 is
In step 1, the punch hole PI-1 is clearly marked, and then the punch hole PH is imaged with the camera 105, and the product shape LH is processed with a laser while making predetermined corrections.

Also in the laser processing machine 113 shown in this example, it is possible to completely align the processing positions of the punch and the laser, and highly accurate product processing is possible.

18 and 19 do not show a workpiece-fixed laser processing machine 123.

In the figure, a work W is placed on a fixed table 101 and is gripped by a clamp device CLP.

On the other hand, rails RR and RL are provided on the upper surface of both ends of the table 101 along the X direction, and a gate-shaped moving frame 125 is provided that straddles the rails RR and RL. The frame 125 is provided with a head support 127 movable in the Y direction along a rail, and a processing head 129 is attached to the support 127. A light reflecting camera 105 is provided on one side of the processing head 129.

The laser processing machine 123 shown in this example performs the correction shown in FIG. 5 and the processing shown in FIGS. 14 and 15, similarly to the laser processing machine 99 shown in FIG. 16. It is something that can be done.

Note that in this example, a reflective camera 105 is used, but instead of this camera 105, a light transmissive camera 5 may be used. However, in this case, it is necessary to predetermine the expected imaging position of the workpiece W and to provide the lamp 15 on the lower surface of the workpiece. The imaging schedule may be plural, for example, near the four corners of the workpiece W. In this case, the camera 5 may be moved by assigning an address to the i-image position and specifying the address in J3S11.

The laser processing machine 131 shown in FIG. 20 is an example in which when the workpiece W is moved in the X direction, the laser processing head 129 is moved in the YIN1 direction.

As shown in the figure, the workpiece W is held by a clamp device CLP and is movable in the X direction. Further, a support 117 is provided on the side surface of the base 107, and a beam 11 is attached to this support 117.
9 is provided, and a laser processing head 129 (the internal structure is omitted) is provided on the side surface of this beam 119 and is movable in the Y direction. The processing head 129 of the sea 11 is movable by a ball screw (not shown) mounted on the side surface of the beam.

In this example, the camera 105 is provided on the side surface of the laser processing head 129 and is capable of capturing an image of any planar position of the workpiece W.

Therefore, even with the camera 105 shown in this example, it is possible to perform the correction shown in FIG. 5, and also to perform post-processing using the laser 11 in accordance with the pre-processing, as shown in FIG. It is.

Note that the camera 105 is connected to the laser processing head 12 of the beam 119.
9 could be attached to the reflective surface so as to be movable in the Y direction, but this would cause an error between the processing position and the silver image position.
In order to avoid this problem, it is preferable to provide the laser processing head 129 in a fixed manner.

In addition, if the purpose is to take an image only at a fixed position of the table 101 and perform the correction as shown in FIG. It is also possible to provide a lamp 15 at fQI. In this case, as in the previous example, a plurality of lamps 15 may be provided.

Examples of the turret type are shown in FIGS. 21 to 23.

FIG. 21 shows an example in which laser processing and imaging can be performed on a workpiece W that is moved in the X and Y directions on the table 101 with the tip of the beam 119 in a fixed position.

In order to perform laser processing and imaging at a predetermined position on the table 101, in this example, the laser processing head 129 and the camera 105 are placed concentrically on the turret 137 suspended from the beam 119 via the shaft 135. They are placed at intervals.

The laser beam LB is passed along the processing axis and is arranged so as to be incident on the upper surface of the processing head 129 from the upper surface of the processing head when the processing head 129 comes to the processing position.

In this example, by rotating the turret 137, the processing surface can be visualized at the laser processing position.
Enables imaging of all machining surfaces.

Incidentally, if the camera 105 is later attached to a conventional laser processing machine, there is a limit to the movement range of the work W and the processing head 129, and the camera 105 may not be able to cover the entire area of the work W. obtain.

Therefore, in this example, it is possible to image the entire area of the workpiece, and it is possible to perform the correction or processing shown in FIGS. 5 to 14 and 15.

FIG. 22 shows the laser processing machine shown in FIG. 21 combined with a press function.

At the laser processing position 139 shown in this example, a plurality of punches 121 are arranged concentrically around the shaft 135, and it is possible to perform punching operations in conjunction with laser processing. or,
In this example, unlike the one shown in FIG. 21, an example is shown in which the optical path of the laser beam to the laser beam head 129 is changed.

In this example as well, by appropriately rotating the turret 137, it is possible to bring the punch 121, the laser machining head 129, and the camera 105 into the same machining area. As a reference, it is possible to perform laser processing and vice versa.

FIG. 23 shows a modification of the laser processing position shown in FIGS. 21 and 22. In this example, the turret 1
Only the punch 121 is attached to 37, and the laser processing head 129 and camera 105 are attached to the side surface of the beam 119.

In this example, laser processing and imaging can be performed with the turret 137 rotated away from the illustrated position, laser processing can be performed with the punch processing position as a reference as in the previous example, and vice versa. Furthermore, it is possible to perform punch processing based on the laser processing position.

[Effects of the Invention] As described above, according to the composite laser processing machine according to the present invention, the workpiece can be observed using a camera and the processing to be performed can be performed at the appropriate position, so the finishing accuracy is significantly improved. improves.

[Brief explanation of drawings]

Fig. 1 is a system configuration diagram of an embodiment of the present invention, Fig. 2 is a perspective view showing the camera installation state of the above embodiment, Fig. 3 is a schematic diagram showing the correction value calculation method of the above embodiment, and Fig. 4 FIG. 5 is an explanatory diagram of the operation of the above embodiment, FIG. 6 is a flowchart illustrating the operation of the above embodiment,
FIG. 7 is an operation explanatory diagram showing another operation of the above embodiment;
The figure shows flow 1 of the operation of the above example. - It is. Figure 9 is a front view showing the mounting state of the camera with the cover as a cross section, Figure 10 is a plan view of Figure 9 viewed from above, and Figure 11.
The figure is a left side view of FIG. 9 when viewed from the left side. FIG. 12 is an enlarged view of the portion indicated by the arrow X■ in FIG. 9, with a portion thereof in cross section. FIG. 13 is a sectional view taken along line XIII-XI in FIG. 12. Figure 14 is a plan view showing the machining situation of the workpiece, Figure 15 is a flow diagram showing the machining method.
7 is a perspective view showing an example of a workpiece moving type laser processing position, FIG. 18 is a front view showing an example of a processing head moving type laser processing machine, and FIG. 19 is a plan view thereof.
Figure 0 is a perspective view showing an example of a type of laser processing machine in which the workpiece and row 11 processing head move together, Figure 21, Figure 2
Both FIG. 2 and FIG. 23 are perspective views partially showing an example of a laser processing machine having a turret. 1.99, 113, 123, 131, 133, 139.
141...Laser processing machine 5.105...Camera 7...Image processing device W...Work agent Patent attorney Yasuo Miyoshi x〉-CI':1 Castle Tsuki W Figure 4 Figure 5 Figure 11 Figure 14 Figure 15

Claims (1)

[Claims] A work table on which a work is placed, a laser processing head that irradiates the work with a laser beam, a relative moving means for relatively moving the work table and the processing head, and a mounting member for the processing head, a camera and a press member attached with a predetermined offset with respect to the processing head; a reference mark positioning means for positioning a reference mark provided on the work directly below the camera; and the reference imaged by the camera. A compound laser processing machine comprising processing means for processing the workpiece at an appropriate position based on the planar position or planar orientation of the mark.