JPS62296532A - Stage for semiconductor wafer prober - Google Patents

Abstract

PURPOSE:To easily measure the pressure sensitivity characteristic of a semiconductor pressure sensor by positioning chips formed on a semiconductor wafer at the suction holes on a stage using marks, and evacuating in a vacuum the cavity in the stage for a semiconductor wafer prober. CONSTITUTION:When measuring, for example, the pressure sensitivity of a semiconductor pressure sensor, a silicon wafer 2 formed with a circuit and a diaphragm 3 is placed on a stage surface 1a. A circuit formed on the wafer 2 is positioned at marks 7 to position the diaphragm 3 at holes 4 on the state placed corresponding to the diaphragm 3. Then, the rear surface of the diaphragm 3 is evacuated in a vacuum from an inserting port 6 through the cavity 5 to apply a pressure to the surface of the diaphragm 5. Thus, the pressure sensitivity characteristic of the sensor can be readily measured.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a stage for a semiconductor wafer prober that measures the characteristics of each chip formed on a semiconductor strip, and in particular to a semiconductor pressure sensor. The present invention relates to a stage for a semiconductor wafer prober used to measure the pressure sensitivity characteristics of a semiconductor wafer prober.

[Conventional technology] In the case of semiconductor pressure sensors, it is necessary to measure the pressure sensitivity characteristics of each chip formed on a silicon wafer, and in order to measure the pressure sensitivity characteristics of conventional chips, it is necessary to separate each chip from the silicon wafer. However, after assembling it into the stem, measurements were taken. FIG. 3 shows a conventional method, and is a sectional view showing a structure for measuring the pressure sensitivity characteristics of each chip. The measurement procedure is as follows. That is, a chip 31 separated from a silicon wafer is hermetically bonded to a perforated glass 32 that is used for the purpose of relieving thermal stress and has a hole for introducing pressure, and an adhesive 3 is attached to a perforated stem 33.
4 to make an airtight seal. Next, the external terminal 35 of the holed stem 33 is bonded from the chip 31 using an Au wire or an M wire 36 . Next, the ported cap 37 is hermetically sealed to the perforated stem 33. Finally, pressure was applied from the boat 38 and pressure sensitivity characteristics were measured.

[Problem to be solved by the invention J] In the measurement of pressure sensitivity characteristics using the above-mentioned conventional technique, the chip 31 is separated from the silicon wafer, and the holed stem 33 is separated from the silicon wafer.
Since pressure is applied and measured after the wafer is assembled, the process from the completion of the wafer process to the measurement of pressure sensitivity characteristics requires a lot of troublesome work and a long time. Zara had the drawback of assembling chips with poor characteristics.

SUMMARY OF THE INVENTION An object of the present invention is to provide a stage for a hollow semiconductor two-bar prober that measures the pressure of a semiconductor pressure sensor in a two-bar state.

[Means for Solving the Problems] The present invention includes a mechanism for vacuuming a cavity formed in a bar prober stage body from the outside, and a semiconductor bar to be measured mounted on the stage surface of the stage body. A suction hole is opened correspondingly to each chip on the top and communicates with the cavity, and a mark is provided on the stage surface of the stage body for positioning each chip on the semiconductor wafer to be measured and the suction hole. A stage for a semiconductor wafer prober, characterized in that it has the following features:

[Function] The stage for a semiconductor wafer prober of the present invention aligns each chip formed on a semiconductor wafer with a suction hole on the stage using a mark, and vacuums the inside of the cavity inside the stage for a semiconductor wafer prober. By doing so, a negative pressure is generated on the back side of each chip, and the pressure sensitivity characteristics of the semiconductor pressure sensor are measured using the state in which pressure is applied to the front surface of each chip.

[Example] Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of a stage for a wafer prober showing an embodiment of the present invention. In the figure, a stage body 1 for a wafer prober has a cavity 5 formed therein, and a stage surface 1a on which a silicon wafer 2 is mounted.
have. The stage surface 1a is provided with a plurality of suction holes 4 communicating with the cavity 5 and opening corresponding to the diaphragm portion 3 of the silicon wafer 2. The cavity 5 is connected to a vacuum source 8 via a pipe entry 6 .

FIG. 2 is a plan view of the stage surface 1a shown in FIG. 1. In the figure, 7 is a mark for positioning the diaphragm portion 3 and the suction hole 4.

In the embodiment, for example, when measuring the pressure sensitivity of a semiconductor pressure sensor, the silicon wafer 2 on which the circuit and diaphragm 3 are formed is mounted on the stage surface 1a, and the circuit formed on the silicon bar 2 and the mark 7 are placed on the stage surface 1a. By positioning U, the diaphragm part 3 is aligned with the suction hole 4 on the stage, which is arranged to correspond to the diaphragm part 3. Next, by vacuum suctioning the back surface of the diaphragm section 3 through the cavity 5 through the insertion port 6, pressure is applied to the surface of the diaphragm section 3, so that the pressure sensitivity characteristics of the semiconductor pressure sensor can be easily measured. However, the mark 7 shown here is just one example, and it is sufficient that the diaphragm part 3 and the suction hole 4 can be aligned, and the present invention is not limited to this.

[Advantageous Effects of the Invention 1] As described above, according to the present invention, the pressure sensitivity characteristics of a semiconductor pressure sensor can be measured in an I-bar state without separating semiconductor wafers into chips and assembling them into a stem. Further, the diaphragm portion on the back surface of the semiconductor tube and the suction hole on the stage surface can be easily aligned. Furthermore, the time required from completion of circuit formation and diaphragm formation on the silicon wafer to measurement of pressure sensitivity characteristics can be shortened, the number of steps can be simplified, and chips with poor characteristics can be detected in one wafer stage.

[Brief explanation of drawings]

Fig. 1 is a cross-sectional view of the structure of the stage for a semiconductor wafer prober of the present invention, Fig. 2 is a plan view of the stage surface, and Fig. 3 is a cross-sectional view of the structure when measuring the pressure sensitivity characteristics of each chip using the conventional method. be.

Claims (1)

[Claims] (1) A mechanism that vacuums a cavity formed inside the stage body for a wafer prober from the outside, and an opening corresponding to each chip on the semiconductor wafer to be measured mounted on the stage surface of the stage body, and A stage for a semiconductor wafer prober, comprising a suction hole that communicates with the suction hole, and a mark provided on the stage surface of the main body for positioning the suction hole and each chip on the semiconductor wafer to be measured.