JPS62295305A - Electromagnetic shielding construction of cable - Google Patents
Electromagnetic shielding construction of cableInfo
- Publication number
- JPS62295305A JPS62295305A JP13847286A JP13847286A JPS62295305A JP S62295305 A JPS62295305 A JP S62295305A JP 13847286 A JP13847286 A JP 13847286A JP 13847286 A JP13847286 A JP 13847286A JP S62295305 A JPS62295305 A JP S62295305A
- Authority
- JP
- Japan
- Prior art keywords
- nonwoven fabric
- metal
- cable
- thickness
- electromagnetic shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010276 construction Methods 0.000 title 1
- 239000004745 nonwoven fabric Substances 0.000 claims description 23
- 238000007747 plating Methods 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 239000000835 fiber Substances 0.000 claims description 10
- 229920000620 organic polymer Polymers 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 2
- 239000004744 fabric Substances 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 241001523558 Hyale Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Communication Cables (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔産業上の利用分野〕
本発明は、ケーブルの電１１ｔｉシールド構造に関する
。Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to an electrical 11ti shielding structure for a cable.
周知の通りケーブルには電Ｓｉｔ障害（以下ＥＭＩとい
う）を防止するためにシールドが施され、これを通常Ｅ
ＭＩシールドと称している。As is well known, cables are shielded to prevent electrical interference (hereinafter referred to as EMI), and this is usually
It is called MI Shield.
このＥＭＩシールド法として従来ＮＬｆｔ性金屈繁金属
常銅搗組をケーブルのコアー上に被覆する方法が知られ
ている。この金属編組は可ｌ）性が良いという利点があ
るため最も良く用いられているシールド方法であるが、
編組密度が低い場合２００ＭＢ２を越える高周波側では
シールド特性が低下するという難点がある。また逆に編
組密度を高くすると高周波側でのシールド特性は低下し
ないが、可撓性が低下するという問題が生じる。このた
め可撓性を必要とするケーブルでは編＆Ｉ密度が５０％
程度のものが通常使用され、該密度を高くしてもせいぜ
い８０％が限界となっている。As a conventional EMI shielding method, a method is known in which the core of the cable is coated with NLft-type Kinkeshigekinzokujodokogumi. This metal braid is the most commonly used shielding method because it has the advantage of good flexibility.
If the braid density is low, there is a problem that the shielding characteristics deteriorate at high frequencies exceeding 200 MB2. On the other hand, if the braid density is increased, the shielding characteristics on the high frequency side will not deteriorate, but there will be a problem that the flexibility will decrease. For this reason, cables that require flexibility have a braid & I density of 50%.
A density of about 80% is usually used, and even if the density is increased, the limit is 80% at most.
また一方ＥＭＩシールド方法の他の方法として、金属メ
ツキクロス通常は銅メツキクロスを使用する方法も開発
さている。しかしながらこの金属メツキクロスを使用す
る方法では低周波側通常２００ＭＩＩｚではシールド効
果が低下することが欠点としてあげられる。On the other hand, as another method of EMI shielding, a method using a metal plating cloth, usually a copper plating cloth, has also been developed. However, this method of using metal plating cloth has a drawback that the shielding effect is reduced at low frequencies, usually 200 MIIz.
本発明者らは、先に上記金属編紐とメツキクロスを併用
して可撓性並びにシールド特性を向上させる方法を提案
しているが、この方法ではケーブル外径が大となり、製
造工程が煩雑となる問題がある。The present inventors have previously proposed a method of improving flexibility and shielding characteristics by using the metal braided cord and mesh cloth together, but this method requires a large outer diameter of the cable and a complicated manufacturing process. There is a problem.
本発明が解決しようとする問題点は、上記従来のＥＭ＋
シールドの難点を解決することであり、更に詳しくは高
周波側から低周波側に至る広い範囲でシールド特性が低
下せず、且つ可撓性の優れたシールド）１キ造を開発す
ることである。The problem to be solved by the present invention is that the conventional EM+
The goal is to solve the problems with shields, and more specifically, to develop a one-piece shield that does not deteriorate shielding characteristics over a wide range from the high frequency side to the low frequency side and has excellent flexibility.
此の問題点は、メッキ厚さが３μ−以下、表面抵抗が０
．１Ω／口以下で且つその厚みが１５０μ−以下の金属
メッキ不織布をシールド材として使用したことを特徴と
するケーブルの電磁シールド構造により解決される。The problem with this is that the plating thickness is 3μ or less and the surface resistance is 0.
．． The problem is solved by an electromagnetic shielding structure for a cable characterized in that a metal-plated nonwoven fabric having a resistance of 1Ω/hole or less and a thickness of 150μ or less is used as a shielding material.
本発明に於いて使用する金属メッキ不織布としては、メ
ッキ厚は可撓性の点から３μｍ以下であることが必要で
、また不織布の厚みは１５０μ鋼以下であることが必要
である。また表面抵抗がシールド効果の点から０． １
Ω／口以下であることが必要である。この際のメッキ厚
が３μ慣よりも大きくなると可撓性がｔｉなわれる傾向
があり、また不織布の厚みが１５０μ謡よりも厚くなる
と可ＩＱ性が悪くなり且つテーピング時の作業性が劣っ
てくる。メッキすべき金属としてはたとえば銅、ニッケ
ル、白金、金、銀、アルミニウム等の４電性金属を代表
例として例示出来、その他導電性を有する金属が広く使
用出来る。The metal-plated nonwoven fabric used in the present invention needs to have a plating thickness of 3 μm or less from the viewpoint of flexibility, and the thickness of the nonwoven fabric needs to be 150 μm or less. Also, the surface resistance is 0.0 from the viewpoint of shielding effect. 1
It must be less than Ω/mouth. At this time, if the plating thickness is greater than 3 μm, the flexibility tends to deteriorate, and if the thickness of the nonwoven fabric is greater than 150 μm, the flexibility and workability during taping will deteriorate. . Typical examples of metals to be plated include tetraelectric metals such as copper, nickel, platinum, gold, silver, and aluminum, and a wide variety of other conductive metals can be used.
不織布としては、各種合成または天然繊維からなるもの
が使用出来る。As the nonwoven fabric, fabrics made of various synthetic or natural fibers can be used.
金属メツキネ繊布は４電性金属にて不織布全層をメンキ
することにより製造することが出来る。The metal mesh fabric can be manufactured by coating all layers of the nonwoven fabric with a four-electrode metal.
不織布を構成する有機高分子としては、ポリオレフィン
、ポリエステル、ポリアミドあるいはその他の繊維性有
機高分子を用いてよい。メンキされる不織布に含まれる
各有機高分子繊維の太さが過大であったり、あるいは不
織布の繊維密度が過少であったりすると、導電性金属メ
ッキ層の僅かの剥離・脱落でも導電率が低下する可能性
が高いので、本発明に於いては、各有機高分子繊維の太
さは５デニール以下、特に３デニール以下のＩＩ織繊維
あることが好ましく、不織布の繊維密度については、坪
量にしてそれが少なくとも２０ｇ／ｒｄ。As the organic polymer constituting the nonwoven fabric, polyolefin, polyester, polyamide, or other fibrous organic polymers may be used. If the thickness of each organic polymer fiber contained in the nonwoven fabric to be peeled is too large, or if the fiber density of the nonwoven fabric is too low, the conductivity will decrease even if the conductive metal plating layer peels off or falls off even slightly. Therefore, in the present invention, the thickness of each organic polymer fiber is preferably 5 deniers or less, particularly II woven fibers of 3 deniers or less, and the fiber density of the nonwoven fabric is determined based on the basis weight. That is at least 20g/rd.
特に少な（とも３０ ｇ／ｒｄであるものが好適に用い
られる。但し、過度に細繊維であったり坪■が過大であ
ったりすると均一な導電性金属メッキ層の形成が困難で
あるので、有機高分子の太さは０．７〜３デニール、且
つ不織布の坪■が３０〜７０ ｇ／ｒｄＯものが好まし
い、また、不織布の厚さは、可ＩＱ性が損なわれない範
囲においてかなり厚いものであってもよ（、必要なＶＬ
導電度確保される範囲においてかなり薄いものであって
もよいが、好ましくは１０−１３０μ＋１１特に３０〜
９０μｍ程度である。Particularly small amounts (30 g/rd) are preferably used.However, if the fibers are too fine or the area is too large, it will be difficult to form a uniform conductive metal plating layer. It is preferable that the thickness of the polymer is 0.7 to 3 deniers, and the basis weight of the nonwoven fabric is 30 to 70 g/rdO.The thickness of the nonwoven fabric must be quite thick as long as the IQ property is not impaired. Even if there is (, necessary VL
It may be quite thin as long as the conductivity is ensured, but it is preferably 10-130μ+11, especially 30~
It is about 90 μm.
導電性金属メッキ層の厚さが過大であると、可撓性が低
下する傾向にあり、一方その厚さが過少であると必要な
′１５Ｔ、、度が確保されない、必要な導電度は適用場
所により区々であるが、導電性金属メッキ層の厚さは、
０．１〜３μｍ、特に０． ２〜１μｍとすることが好
ましい。If the thickness of the conductive metal plating layer is too thick, the flexibility will tend to decrease, while if the thickness is too small, the required conductivity will not be achieved. Although it varies depending on the location, the thickness of the conductive metal plating layer is
0.1 to 3 μm, especially 0.1 to 3 μm. It is preferable to set it as 2-1 micrometer.
以下に実施例を用いて本発明を具体的に説明する。 The present invention will be specifically described below using Examples.
実施例１
金属メッキ不織布として、大さ１６５デニールのポリエ
チレンテレツクレート繊維からなる坪量６０．Ｏｇ／ｍ
、ｒｇ−さ７９．４ｐｅａ、密度０．７７ｇ／ａｄの不
織布（三木特殊製紙社製の商品名ハイエールＣ６０ＨＲ
）に銅メッキを施したものであって、平均銅メッキ厚さ
０．３９μ請、銅Ｊ−／キ付着！１７．６ ｇ／ｒｄ、
ｒｇさ８４．８，１７１、表面抵抗（不織布縮方向＞
２．７Ｘ１０−”Ω／口、表面抵抗（不織布横方向）４
．６Ｘ１０４Ω／口のもの（輻約２５１１）を第１図に
示す様なコアー構造を有するモデルケーブルの表面に１
／２ラツプで１枚テーピングした。Example 1 A metal-plated nonwoven fabric was made of polyethylene terrestrial fibers with a basis weight of 60. Og/m
, rg-size 79.4pea, density 0.77g/ad non-woven fabric (product name Hyale C60HR manufactured by Miki Tokushu Paper Co., Ltd.)
) with copper plating, the average copper plating thickness is 0.39μ, and the copper J-/ki is attached! 17.6 g/rd,
rg 84.8,171, surface resistance (nonwoven fabric shrinkage direction>
2.7X10-”Ω/mouth, surface resistance (non-woven fabric lateral direction) 4
．． 6 x 104 Ω/mouth (approximately 2511) on the surface of a model cable with a core structure as shown in Figure 1.
/ Taped one piece with 2 laps.
但し第１図中（１）は発泡ポリエチレンであり、（２）
は銅導体を示す、銅導体の直径は２．Ｑｍａ、コアーの
直径（３）は５．６ｍ厘である。However, (1) in Figure 1 is foamed polyethylene, and (2)
indicates a copper conductor, and the diameter of the copper conductor is 2. Qma, the core diameter (3) is 5.6 m.
このモデルケーブルの特性を吸収クランプ法に依り測定
した。このクランプ法は第３図に示す回路構成で、ケー
ブル試料１ｍで測定した。測定周波数は０〜１００１０
０Ｏである。但し第３図中（４）はダミー抵抗、（５）
は供試ケーブル、（６）は補助フェライトリング、（７
）は電流変成器、（８）は吸収ランプ、（９）はフェラ
イトリング、（ｌＯ）はり、 Ｍ、（１１）はＴ、Ｇで
ある。The characteristics of this model cable were measured using the absorption clamp method. This clamp method was performed using a 1 m cable sample using the circuit configuration shown in FIG. Measurement frequency is 0~10010
It is 0O. However, (4) in Figure 3 is a dummy resistor, (5)
is the test cable, (6) is the auxiliary ferrite ring, (7 is
) is a current transformer, (8) is an absorption lamp, (9) is a ferrite ring, (1O) is a beam, M, and (11) are T and G.
但しり、Ｍ、Ｔ、Ｇはクケダ理研工業ｔ１１社製モデル
ＴＲ４１７２を、吸収クランプは同社製モデルＫＴ−１
０を使用した。However, M, T, and G are model TR4172 manufactured by Kukeda Riken Kogyo T11, and the absorption clamp is model KT-1 manufactured by that company.
0 was used.
この結果を第２図に示す、また可撓性を手で判断した所
、充分に優れたものであった。The results are shown in FIG. 2, and the flexibility was judged by hand and was found to be sufficiently excellent.
比較例１
ポリエステル長繊維の手織を基布とした銅メツキクロス
（幅約２５１１）を実施例１と同様にモデルケーブルに
テーピングした。使用した銅メツキクロスの物性は、次
の通りである。Comparative Example 1 A copper plating cloth (width approximately 2,511 mm) whose base fabric was hand-woven from polyester long fibers was taped to a model cable in the same manner as in Example 1. The physical properties of the copper plating cloth used are as follows.
クロスメッキの厚さ９８μｍ
金属付着量１４．８ｇ／ｎ（
メッキの厚さ約０．１５μｍ
シールド特性は、実施例１と同様に測定し、その結果を
第２図に示している。Thickness of cross plating: 98 μm Amount of metal deposited: 14.8 g/n (thickness of plating: approximately 0.15 μm) Shielding characteristics were measured in the same manner as in Example 1, and the results are shown in FIG.
比較例２
第１図のモデルケーブル上に［［Ｉ密度７５％の銅編組
を被覆し、試料とした。Comparative Example 2 A copper braid having a [[I density of 75%] was coated on the model cable shown in FIG. 1 to prepare a sample.
そのシールド特性は、実施例１と同様に測定しその結果
を第２図に示している。The shielding characteristics were measured in the same manner as in Example 1, and the results are shown in FIG.
実施例２
錫メツキ軟銅撚線導体の上に難燃性ポリ塩化ビニル絶縁
層を有する外径１．０２ｍｍの絶縁Ｎ、線を多数本フラ
ット状に並列した（従ってテープ状を呈する）フラット
ケーブルの片面に実施例１において用いたメッキ不織布
をアクリル系接着剤を用いて接着だ。Example 2 A flat cable with an insulation N having an outer diameter of 1.02 mm and a flame-retardant polyvinyl chloride insulating layer on a tin-plated annealed copper stranded wire conductor, and a large number of wires arranged in a flat shape (therefore exhibiting a tape shape). The plated nonwoven fabric used in Example 1 was adhered to one side using an acrylic adhesive.
上記実施例から明らかな通り、本発明のものは高周波側
から低周波側に至る広い間で、シールド特性は殆ど変化
なく、安定した優れた特性を発揮している。また可撓性
はいずれも優れたものである。As is clear from the above examples, the shielding characteristics of the present invention hardly change over a wide range from the high frequency side to the low frequency side, and exhibit stable and excellent characteristics. Furthermore, both have excellent flexibility.
第１図はモデルケーブルのコアー構造を示し、第２図は
シールド特性と周波数との関係を示すグラフである。第
３図はクランプ法の回路構成を示す図面である。
（１） ・・・・発泡ポリエチレン
（２）・・・・銅導体
（３）・・・・コアーの直径
（４）・・・・ダミー抵抗
（５）・・・・供試ケーブル
（６）・・・・補助フェライトリング
（７）・・・・ｉ？を流変成器
（８）・・・・吸収ランプ
（９）・・・・フェライトリング
（１０）・・・・Ｌ、 Ｍ
（１１） ・・・・Ｔ、 Ｇ
（以上）
特許出願人 大日日本電線株式会社
■三咬否入 間１−１２FIG. 1 shows the core structure of the model cable, and FIG. 2 is a graph showing the relationship between shielding characteristics and frequency. FIG. 3 is a drawing showing the circuit configuration of the clamp method. (1) ... Polyethylene foam (2) ... Copper conductor (3) ... Core diameter (4) ... Dummy resistor (5) ... Test cable (6) ...Auxiliary ferrite ring (7)...i? Flow transformer (8)...Absorption lamp (9)...Ferrite ring (10)...L, M (11)...T, G (and above) Patent applicant Dainichi Nippon Electric Cable Co., Ltd. ■Mikite-no-iri between 1-12
Claims (5)
口以下で且つその厚みが１５０μｍ以下の金属メッキ不
織布をシールド材として使用したことを特徴とするケー
ブルの電磁シールド構造。(1) Plating thickness is 3μm or less, surface resistance is 0.1Ω/
An electromagnetic shielding structure for a cable, characterized in that a metal-plated nonwoven fabric having a thickness of 150 μm or less and having a thickness of 150 μm or less is used as a shielding material.
て金属メッキ不織布を被覆して成ることを特徴とする特
許請求の範囲第１項に記載の電磁シールド構造。(2) The electromagnetic shielding structure according to claim 1, characterized in that the insulated wire core and/or the sheath are coated with a metal-plated nonwoven fabric via an adhesive layer.
なくとも片面に粘着層を介して金属メッキ不織布を縦添
え被覆してなることを特徴とする特許請求の範囲第１項
または第２項に記載の電磁シールド構造。(3) A metal-plated nonwoven fabric is coated vertically on at least one side of a flat insulated wire core and/or sheath with an adhesive layer interposed therebetween. Electromagnetic shielding structure described in .
る不織布を湿式法により金属メッキしたものであること
を特徴とする特許請求の範囲第１項乃至第３項のいずれ
かに記載の電磁シールド構造。(4) The electromagnetic shield according to any one of claims 1 to 3, wherein the metal-plated nonwoven fabric is a nonwoven fabric made of organic polymer fibers that is metal-plated by a wet method. structure.
ことを特徴とする特許請求の範囲第１項乃至第３項のい
ずれかに記載の電磁シールド構造。(5) The electromagnetic shielding structure according to any one of claims 1 to 3, wherein the metal of the metal-plated nonwoven fabric is copper or nickel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13847286A JPS62295305A (en) | 1986-06-13 | 1986-06-13 | Electromagnetic shielding construction of cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13847286A JPS62295305A (en) | 1986-06-13 | 1986-06-13 | Electromagnetic shielding construction of cable |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62295305A true JPS62295305A (en) | 1987-12-22 |
Family
ID=15222855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13847286A Pending JPS62295305A (en) | 1986-06-13 | 1986-06-13 | Electromagnetic shielding construction of cable |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62295305A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014017173A (en) * | 2012-07-10 | 2014-01-30 | Asahi Kasei Fibers Corp | Noise depression cable |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58154105A (en) * | 1982-03-08 | 1983-09-13 | 上村工業株式会社 | Conductive material |
-
1986
- 1986-06-13 JP JP13847286A patent/JPS62295305A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58154105A (en) * | 1982-03-08 | 1983-09-13 | 上村工業株式会社 | Conductive material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014017173A (en) * | 2012-07-10 | 2014-01-30 | Asahi Kasei Fibers Corp | Noise depression cable |
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