JPS6228729U - - Google Patents
Info
- Publication number
- JPS6228729U JPS6228729U JP11977485U JP11977485U JPS6228729U JP S6228729 U JPS6228729 U JP S6228729U JP 11977485 U JP11977485 U JP 11977485U JP 11977485 U JP11977485 U JP 11977485U JP S6228729 U JPS6228729 U JP S6228729U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- resin
- integrally molded
- hanging part
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Rigid Containers With Two Or More Constituent Elements (AREA)
- Cartons (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11977485U JPS6228729U (ko) | 1985-08-02 | 1985-08-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11977485U JPS6228729U (ko) | 1985-08-02 | 1985-08-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6228729U true JPS6228729U (ko) | 1987-02-21 |
Family
ID=31007458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11977485U Pending JPS6228729U (ko) | 1985-08-02 | 1985-08-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6228729U (ko) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60119773A (ja) * | 1983-12-01 | 1985-06-27 | Mitsubishi Electric Corp | 半導体集積回路の製造方法 |
-
1985
- 1985-08-02 JP JP11977485U patent/JPS6228729U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60119773A (ja) * | 1983-12-01 | 1985-06-27 | Mitsubishi Electric Corp | 半導体集積回路の製造方法 |
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