JPS62270616A - One-pack epoxy resin composition - Google Patents
One-pack epoxy resin compositionInfo
- Publication number
- JPS62270616A JPS62270616A JP11181286A JP11181286A JPS62270616A JP S62270616 A JPS62270616 A JP S62270616A JP 11181286 A JP11181286 A JP 11181286A JP 11181286 A JP11181286 A JP 11181286A JP S62270616 A JPS62270616 A JP S62270616A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- latent
- anhydride
- carboxylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 36
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 36
- 239000000203 mixture Substances 0.000 title claims abstract description 22
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 150000001875 compounds Chemical class 0.000 claims abstract description 10
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 claims abstract description 10
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 238000002156 mixing Methods 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 239000003208 petroleum Substances 0.000 abstract description 3
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 abstract description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 abstract description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 abstract description 2
- 229940014800 succinic anhydride Drugs 0.000 abstract description 2
- 239000011342 resin composition Substances 0.000 abstract 2
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910015900 BF3 Inorganic materials 0.000 description 2
- ULDHMXUKGWMISQ-UHFFFAOYSA-N carvone Chemical compound CC(=C)C1CC=C(C)C(=O)C1 ULDHMXUKGWMISQ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- JPSKCQCQZUGWNM-UHFFFAOYSA-N 2,7-Oxepanedione Chemical compound O=C1CCCCC(=O)O1 JPSKCQCQZUGWNM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 239000005973 Carvone Substances 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical group ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- -1 alicyclic carboxylic acids Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
［発明の目的］
（産業上の利用分野）
本発明は、金属との密着性に優れ、安定性のよい一液性
エポキシ樹脂組成物に関する。Detailed Description of the Invention 3. Detailed Description of the Invention [Object of the Invention] (Field of Industrial Application) The present invention relates to a one-component epoxy resin composition that has excellent adhesion to metals and good stability. .
（従来の技術）
エポキシ樹脂は、電気特性、耐湿性および接着性に優れ
、しかもポリエステル樹脂などに比較して硬化時の収縮
が小さいという特性を有するため、電気部品、半導体素
子、集積回路の絶縁封止用等として広く使用されている
。(Prior art) Epoxy resin has excellent electrical properties, moisture resistance, and adhesive properties, and has the property of having less shrinkage during curing compared to polyester resins, etc., so it is used as an insulator for electrical parts, semiconductor elements, and integrated circuits. Widely used for sealing, etc.
エポキシ樹脂の中でも、特にカルボン酸無水物硬化剤を
使用したものは、低粘度で作業性が良いため広く使用さ
れているが、比較的金属に対する密着力或いは接着力に
乏しく、金属ケースと樹脂、金属と金属との界面をこの
エポキシ系樹脂で接着又は封止すると、その金属界面で
剥離が発生するおそれがある。Among epoxy resins, those using carboxylic acid anhydride curing agents are widely used due to their low viscosity and good workability. If the interface between metals is adhered or sealed with this epoxy resin, there is a risk that peeling will occur at the metal interface.
またエポキシ樹脂の一般的な硬化剤として、ほかに、ポ
リアミン類、有機二塩基酸無水物およびフェノール樹脂
が使用されているが、これらの硬化剤はエポキシ樹脂と
混合した場合の可使時間が数分ないし数日と短いため、
エポキシ樹脂と硬化剤とを別々に保管しておき、使用直
前に混合する多液性であり、そのため予備分散−秤吊一
混合一説気の予備作業工程が必要であった。 このよう
な作業性の悪さを改善させたものとして、潜在性硬化剤
として三フッ化はう素のアミン錯体またはジシアンジア
ミドを用いた−液性エポキシ樹脂組酸物がある。 しか
し、三フッ化はう素のアミン錯体は、数ケ月の可使時間
を有し、しかも１２０℃〜１５０℃で速やかに硬化する
利点を持っているが、硬化時にアミンガスを発生しやす
く、このため特に半導体素子を含む電子部品の封止剤と
しては素子を汚染する点から使用できないという欠点が
ある。Polyamines, organic dibasic acid anhydrides, and phenolic resins are also commonly used as curing agents for epoxy resins, but these curing agents have a limited pot life when mixed with epoxy resins. Because it is short, from a minute to a few days,
It is a multi-component product in which the epoxy resin and curing agent are stored separately and mixed immediately before use, which requires a preliminary process of dispersion, weighing, mixing, and blowing. As a method for improving such poor workability, there is a liquid epoxy resin composition using an amine complex of boron trifluoride or dicyandiamide as a latent curing agent. However, amine complexes of boron trifluoride have a pot life of several months and have the advantage of curing rapidly at 120°C to 150°C, but they tend to generate amine gas during curing, and this Therefore, it has the disadvantage that it cannot be used particularly as a sealant for electronic parts including semiconductor elements because it contaminates the elements.
゛また、ジシアンジアミドは単独で使用する場合は１７
０℃以上という高い硬化温度を要するという欠点がある
。゛Also, when dicyandiamide is used alone, 17
It has the disadvantage of requiring a high curing temperature of 0° C. or higher.
（発明が解決しようとする問題点）
本発明は、上記の欠点を解消するためになされたもので
あり、金属との密着性、接着性に優れ、室温付近で優れ
た作業性と潜在性を有し可使時間が長く、かつ １００
〜１５０℃の温度で速やかに硬化できる一液性エポキシ
樹脂組成物を提供しようとするものである。(Problems to be Solved by the Invention) The present invention has been made to eliminate the above-mentioned drawbacks, and has excellent adhesion and adhesion to metals, and excellent workability and potential near room temperature. It has a long pot life and 100
It is an object of the present invention to provide a one-component epoxy resin composition that can be rapidly cured at a temperature of ~150°C.
［発明の構成］
（問題点を解決するための手段と作用）本発明者は、上
記の目的を達成しようと鋭意研究を重ねた結果、ノルボ
ネン環を有する化合物と潜在性ヒドラジン系触媒を用い
るならば、密着性に優れ、可使時間が長いことを見いだ
し本発明を完成したものである。 即ち、本発明は、カ
ルボン酸無水物系硬化剤を含むエポキシ樹脂に、ノルボ
ネン環を有する化合物、及び硬化促進剤として潜在性ヒ
ドラジン系触媒を配合することを特徴とする一液性エポ
キシ樹脂組成物である。 そして潜在性ヒドラジン系触
媒をエポキシ樹１）２１１成物に対して０．５〜ｓ、ｏ
ｉ ｉｔ％配合することが好ましい組成物であ、る。[Structure of the Invention] (Means and Effects for Solving the Problems) As a result of intensive research to achieve the above object, the present inventor has discovered that if a compound having a norbornene ring and a latent hydrazine catalyst are used, For example, they discovered that it has excellent adhesion and a long pot life, and completed the present invention. That is, the present invention provides a one-component epoxy resin composition characterized in that an epoxy resin containing a carboxylic acid anhydride curing agent is blended with a compound having a norbornene ring and a latent hydrazine catalyst as a curing accelerator. It is. Then, a latent hydrazine catalyst was applied to the epoxy resin 1) 211 product at 0.5 to s, o.
It is a composition in which it is preferable to include i it%.
本発明に用いるエポキシ樹脂としては、ビスフェノール
Ａ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、
フェノールノボラック型エポキシ樹脂、クレゾールノボ
ラック型エポキシ樹脂、脂環式エポキシ樹脂、含複素環
エポキシ樹脂、水添ビスフェノールＡ型エポキシ樹脂、
脂肪族系エポキシ樹脂、芳香族、脂肪族もしくは脂環式
のカルボン酸とエピクロルヒドリンとの反応によって得
られるエポキシ樹脂、スピロ環含有エポキシ樹脂等が挙
げられる。 市販品の例としては、シェル化学社製の商
品名“エピコート”８０７，８２７゜８２８．８３４．
１００１．１００４、チバガイギー社製の商品名゛アラ
ルダイト”’ＣＹ−１７５゜１８２．１８３、ダウケミ
カル社製の商品名゛ＤＥＮ” ４３１，４３８、同じく
Ｄ Ｅ Ｒ”３３２、ダイセル化学社製の商品名“セロ
キサイド”２０２１、旭電化工業社製の商品名゛アデカ
レジン”ＥＰ４０８０等がある。 これらのエポキシ樹
脂は単独もしくは２種以上混合して使用する。 エポキ
シ樹脂の硬化剤として用いるカルボンＭ無水物の例とし
ては、無水フタル酸、無水テトラヒドロフタル酸、無水
３．６−ニンドメチレンテトラヒドロフタル酸、無水へ
キサヒドロフタル酸、無水メチルへキナヒドロフタル酸
、無水コハク酸、無水アジピン酸、無水マイレン酸、ビ
Ｏメリット酸二無水物等が挙げられ、これらは単独もし
くは２種以上混合して用いる。The epoxy resin used in the present invention includes bisphenol A epoxy resin, bisphenol F epoxy resin,
Phenol novolac type epoxy resin, cresol novolac type epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, hydrogenated bisphenol A type epoxy resin,
Examples include aliphatic epoxy resins, epoxy resins obtained by reacting aromatic, aliphatic or alicyclic carboxylic acids with epichlorohydrin, and spiro ring-containing epoxy resins. An example of a commercially available product is "Epicoat" 807, 827° 828, 834. manufactured by Shell Chemical Co., Ltd.
1001.1004, Ciba Geigy's product name "Araldite"'CY-175゜182.183, Dow Chemical's product name "DEN" 431,438, also DER"332, Daicel Chemical's product name Examples include "Celoxide" 2021 and Asahi Denka Kogyo Co., Ltd.'s product name "Adeka Resin" EP4080. These epoxy resins may be used alone or in combination of two or more. Examples of Carvone M anhydrides used as curing agents for epoxy resins include phthalic anhydride, tetrahydrophthalic anhydride, 3,6-nindomethylenetetrahydrophthalic anhydride, hexahydrophthalic anhydride, and methylhequinahydrophthalic anhydride. , succinic anhydride, adipic anhydride, maleic anhydride, biomellitic dianhydride, etc., and these may be used alone or in combination of two or more.
本発明に用いるノルボネン環を有する化合物としては、
石油樹脂等があり、石油のＣ６〜Ｃ３留分から得られる
汎用の樹脂である。 具体的な市販品としては、セロキ
サイド４０００ （ダイセル化学社製、商品名）、タッ
キロール１０００（住友化学工業社製、商品名）、フィ
ントン１５００゜１０００．１３００ （日本ゼオン社
製、商品名）等が挙げられ、これらは単独もしくは２種
以上混合して用いる。As the compound having a norbornene ring used in the present invention,
There are petroleum resins, etc., which are general-purpose resins obtained from C6 to C3 fractions of petroleum. Specific commercially available products include Celloxide 4000 (manufactured by Daicel Chemical Co., Ltd., trade name), Takki Roll 1000 (manufactured by Sumitomo Chemical Co., Ltd., trade name), Finton 1500° 1000.1300 (manufactured by Nippon Zeon Co., Ltd., trade name), etc. These can be used alone or in combination of two or more.
本発明に硬化促進剤として用いる潜在性ヒドラジン系触
媒としては、例えば味の素社製、商品名“アミキュア°
′シリーズがあり、品番ＰＮ−２３゜ＭＹ−２４，ＢＡ
ＤＨ，ＣＴＤＨ等が挙げられ、これらは単独もしくは２
秒以上混合して用いる。As the latent hydrazine catalyst used as a curing accelerator in the present invention, for example, Amicure° manufactured by Ajinomoto Co., Ltd.
' series, product number PN-23゜MY-24, BA
DH, CTDH, etc., which may be used alone or in combination
Mix for more than 2 seconds before use.
潜在性ヒドラジン系触媒の配合割合は、カルボン酸無水
物硬化剤を含むエポキシ樹脂組成物に対して０．５〜５
．０重量％配合することが望ましい。The blending ratio of the latent hydrazine catalyst is 0.5 to 5% relative to the epoxy resin composition containing the carboxylic acid anhydride curing agent.
．． It is desirable to blend 0% by weight.
配合割合が０．５重重％未満の場合は、硬化に著しく時
間を要し実用的でなく、また５、０手間％を超えると可
使時間が居くなり、更に硬化組成物の特性が低下し好ま
しくない。 従ってその範囲は上記の通り限定するのが
よい。If the blending ratio is less than 0.5% by weight, curing takes a significant amount of time and is not practical, and if it exceeds 5.0% by weight, the pot life will be shortened and the properties of the cured composition will further deteriorate. I don't like it. Therefore, the range is preferably limited as described above.
本発明の一液性エポキシ樹脂組成物は、前述したカルボ
ン酸無水物を含むエポキシ樹脂、ノルボネン環を有する
化合物、および潜在性ヒドラジン系触媒を混合攪拌均一
化して容易に１ｑられるが、本発明の主旨に反しない限
り、必要に応じて顔料、可塑剤、＠色剤、充填剤、揺変
剤、その他の添加剤等を適宜選択して配合することがで
きる。 こうして得られた組成物は、電気部品、半導体
素子、集積回路等の電気絶縁や封止用として広く使用す
ることができる。The one-component epoxy resin composition of the present invention can be easily prepared by mixing and homogenizing the above-mentioned epoxy resin containing the carboxylic acid anhydride, the compound having a norbornene ring, and the latent hydrazine catalyst by stirring. Pigments, plasticizers, coloring agents, fillers, thixotropic agents, other additives, etc. can be appropriately selected and blended as necessary, as long as they do not contradict the spirit of the invention. The composition thus obtained can be widely used for electrical insulation and sealing of electrical parts, semiconductor elements, integrated circuits, etc.
（実施例）
次に本発明を実施例によって説明するが、本発明はこれ
らの実施例によって限定されるものではない。(Examples) Next, the present invention will be explained by examples, but the present invention is not limited by these examples.
実施例 １
■ポン８２８（シェル化学社製エポキシ樹脂、商品名）
８０Ｑ 、セロキサイド４０００ （ダイセル化学社
製ノルボネン環を有する化合物、商品名）２０ｇ、硬化
剤の無水ヘキサハイドロフタル１ｊ１００１；Ｉ、およ
び硬化促進剤としてＭＹ−２４（味の素社製、商品名）
５ｇを均一に混合攪拌し、−液性エポキシ樹脂組成物を
得た。Example 1 ■Pon 828 (epoxy resin manufactured by Shell Chemical Co., Ltd., trade name)
80Q, 20 g of Celoxide 4000 (a compound having a norbornene ring, manufactured by Daicel Chemical Co., Ltd., trade name), anhydrous hexahydrophthal 1j1001;I as a curing agent, and MY-24 (manufactured by Ajinomoto Co., Ltd., trade name) as a curing accelerator.
5 g were uniformly mixed and stirred to obtain a -liquid epoxy resin composition.
実施例 ２〜３
第１表に示した組成によって、実施例１と同様にしてそ
れぞれ一液性のエポキシ樹脂組成物を得た。Examples 2 to 3 One-component epoxy resin compositions were obtained in the same manner as in Example 1 using the compositions shown in Table 1.
比較例 １〜２
第１表に示した組成によって、実施例１と同様にしてそ
れぞれエポキシ樹脂組成物を得た。Comparative Examples 1-2 Epoxy resin compositions were obtained in the same manner as in Example 1 using the compositions shown in Table 1.
実施例１〜３および比較例１〜２に得られたエポキシ樹
脂組成物についてＪ ｌ５−Ｃ−２１０５に従って、絶
縁特性、密着性および安定性等の試験を行ったので、そ
の結果を第１表に示した。The epoxy resin compositions obtained in Examples 1 to 3 and Comparative Examples 1 to 2 were tested for insulation properties, adhesion, stability, etc. in accordance with J15-C-2105, and the results are shown in Table 1. It was shown to.
いずれも本発明の顕著な効果が認められた。In all cases, the remarkable effects of the present invention were observed.
［発明の効果］
本発明の一液性エポキシ樹脂組成物は、ノルボネン環を
有する化合物、潜在性ヒドラジン系触媒を配合したこと
によって、金属との良好な密着性を有し、室温付近にお
ける良好な作業性と可使時間に優れたちので、電気部品
、半導体素子、ＩＣの電気絶縁ならびに封止用等として
好適なものである。[Effects of the Invention] The one-component epoxy resin composition of the present invention has good adhesion to metals due to the combination of a compound having a norbornene ring and a latent hydrazine catalyst, and has good adhesiveness at around room temperature. Since it has excellent workability and pot life, it is suitable for electrical insulation and sealing of electrical parts, semiconductor elements, and ICs.
Claims (1)
ノルボネン環を有する化合物、及び硬化促進剤として潜
在性ヒドラジン系触媒を配合することを特徴とする一液
性エポキシ樹脂組成物。 ２ 潜在性ヒドラジン系触媒を、エポキシ樹脂組成物に
対して０．５〜５．０重量％配合する特許請求の範囲第
１項記載の一液性エポキシ樹脂組成物。[Claims] 1. An epoxy resin containing a carboxylic acid anhydride curing agent,
A one-component epoxy resin composition comprising a compound having a norbornene ring and a latent hydrazine catalyst as a curing accelerator. 2. The one-component epoxy resin composition according to claim 1, wherein the latent hydrazine catalyst is blended in an amount of 0.5 to 5.0% by weight based on the epoxy resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61111812A JPH0657738B2 (en) | 1986-05-17 | 1986-05-17 | One-part epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61111812A JPH0657738B2 (en) | 1986-05-17 | 1986-05-17 | One-part epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62270616A true JPS62270616A (en) | 1987-11-25 |
| JPH0657738B2 JPH0657738B2 (en) | 1994-08-03 |
Family
ID=14570777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61111812A Expired - Lifetime JPH0657738B2 (en) | 1986-05-17 | 1986-05-17 | One-part epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0657738B2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57137318A (en) * | 1981-02-20 | 1982-08-24 | Ajinomoto Co Inc | One-can type epoxy resin composition |
| JPS6060126A (en) * | 1983-09-13 | 1985-04-06 | Toshiba Corp | Epoxy composition |
| JPS6072954A (en) * | 1983-09-30 | 1985-04-25 | Dainippon Toryo Co Ltd | Long-period rustproof coating composition |
-
1986
- 1986-05-17 JP JP61111812A patent/JPH0657738B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57137318A (en) * | 1981-02-20 | 1982-08-24 | Ajinomoto Co Inc | One-can type epoxy resin composition |
| JPS6060126A (en) * | 1983-09-13 | 1985-04-06 | Toshiba Corp | Epoxy composition |
| JPS6072954A (en) * | 1983-09-30 | 1985-04-25 | Dainippon Toryo Co Ltd | Long-period rustproof coating composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0657738B2 (en) | 1994-08-03 |
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