JPS622703B2 - - Google Patents

Info

Publication number
JPS622703B2
JPS622703B2 JP56064548A JP6454881A JPS622703B2 JP S622703 B2 JPS622703 B2 JP S622703B2 JP 56064548 A JP56064548 A JP 56064548A JP 6454881 A JP6454881 A JP 6454881A JP S622703 B2 JPS622703 B2 JP S622703B2
Authority
JP
Japan
Prior art keywords
thyristor
module
coolant
piping
potential
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56064548A
Other languages
Japanese (ja)
Other versions
JPS57178350A (en
Inventor
Yoshinobu Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6454881A priority Critical patent/JPS57178350A/en
Publication of JPS57178350A publication Critical patent/JPS57178350A/en
Publication of JPS622703B2 publication Critical patent/JPS622703B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)

Description

【発明の詳細な説明】 本発明はサイリスタバルブに係り、特に直列接
続されたサイリスタモジユールが多段に設置され
ている場合に好適な冷却液配管(絶縁も兼ねる)
を備えた液冷式サイリスタバルブに関する。
[Detailed Description of the Invention] The present invention relates to a thyristor valve, and in particular, a coolant pipe (also serving as insulation) suitable for a case where thyristor modules connected in series are installed in multiple stages.
This invention relates to a liquid-cooled thyristor valve.

従来、この種のサイリスタバルブの冷却液配管
は、多段に設置されたサイリスタバルブを構成す
る各サイリスタモジユールのの各段ごとに、地上
から配管を伸ばして布設されている。例えば各段
が複数のサイリスタモジユールの直列接続体から
なり、これが3段積されかつ直列接続されたサイ
リスタバルブの場合、地上から各段のサイリスタ
モジユールに別々に配管を布設する方法である。
この方法では、各段に連らなる配管に印加される
電圧は、各段と接地間の電位差となるので、上段
に布設される配管ほど大きな電圧が印加されるこ
とになる。従つて、上段に布設される配管は、電
気的絶縁長(例えば1kV当り15mm程度)を確保す
る必要があるため、蛇行させる等してその長さ
を、サイリスタモジユールと大地間の距離よりも
相当長くしなければならないという欠点があつ
た。
Conventionally, coolant piping for this type of thyristor valve has been laid by extending from the ground for each stage of each thyristor module constituting a multistage thyristor valve. For example, in the case of a thyristor valve in which each stage is composed of a plurality of thyristor modules connected in series, and these are stacked in three stages and connected in series, the method is to separately install piping from the ground to the thyristor modules in each stage.
In this method, the voltage applied to the pipes connected in each stage is the potential difference between each stage and the ground, so a larger voltage is applied to the pipes installed in the upper stage. Therefore, the piping laid in the upper stage must have an electrical insulation length (for example, about 15 mm per 1 kV), so the length of the pipe should be longer than the distance between the thyristor module and the ground by meandering, etc. The drawback was that it had to be quite long.

本発明の目的は、冷却液配管に印加される電圧
を効率よく分担させることによつて、絶縁信頼性
を維持しつつ構造を簡略化することのできる液冷
式サイリスタバルブを提供することにある。
An object of the present invention is to provide a liquid-cooled thyristor valve whose structure can be simplified while maintaining insulation reliability by efficiently sharing the voltage applied to the coolant piping. .

本発明の特徴は、直列多段に接続された複数個
のサイリスタの接続導体に沿つて、絶縁を兼ねた
冷却液配管を布設し、各サイリスタモジユールへ
の冷却液分岐部を当該モジユール位置に対応して
設け、この各分岐部を当該各モジユールケースと
短頼したところにある。これにより、配管は自と
蛇行した配置となり、従来の前記問題を解決でき
ると共に、サイリスタ主回路電位を冷却液中に均
一分担化することで、局部的に高電圧が印加され
ることがなく、比較的短い配管でもつて絶縁信頼
度の高い液冷式サイリスタバルブを実現したとこ
ろにある。
A feature of the present invention is that cooling liquid piping, which also serves as insulation, is installed along the connection conductors of multiple thyristors connected in series in multiple stages, and the cooling liquid branch to each thyristor module corresponds to the position of the module. Each branch is connected to each module case. As a result, the piping becomes arranged in a meandering manner, which solves the above-mentioned problems of the conventional method, and by uniformly distributing the thyristor main circuit potential to the cooling liquid, high voltage is not locally applied. The result is a liquid-cooled thyristor valve with high insulation reliability even with relatively short piping.

第1図は本実施例の一実施例である。この例で
は、サイリスタモジユール1は9個あり、各段毎
にサイリスタモジユール1を3個直列接続し、さ
らにこれを3段積して各段を直列接続している。
即ち、アノード端子6とカソード端子7間に、9
個のサイリスタモジユールを主回路接続導体8に
よつて直列接続したいるのである。サイリスタモ
ジユール1内には、サイリスタスタツク10やそ
の付属部品11が収納されている。この3段積の
サイリスタバルブの全体は、絶縁支柱2の上方を
上部枠兼均圧板4、下方を下部枠兼均圧板3、両
側を側面均圧板5で構成した枠に固定される。そ
して、上記主回路接続導体8に沿つて冷却液配管
9A,9Bが布設される。9Aは冷却液供給用配
管、9Bは排液用配管である。各サイリスタモジ
ユールは、冷却液配管9Aから冷却液を取入れ、
冷却液配管9Bに排出するように、冷却液配管9
A,9B間に並列接続されている。
FIG. 1 shows an example of this embodiment. In this example, there are nine thyristor modules 1, three thyristor modules 1 are connected in series in each stage, and three thyristor modules 1 are stacked in three stages, and each stage is connected in series.
That is, between the anode terminal 6 and the cathode terminal 7, 9
The thyristor modules are connected in series by the main circuit connection conductor 8. Inside the thyristor module 1, a thyristor stack 10 and its attached parts 11 are housed. The entire three-tiered thyristor valve is fixed to a frame composed of an upper frame/pressure equalizing plate 4 above the insulating column 2, a lower frame/pressure equalizing plate 3 below, and side pressure equalizing plates 5 on both sides. Coolant pipes 9A and 9B are installed along the main circuit connection conductor 8. 9A is a coolant supply pipe, and 9B is a drain pipe. Each thyristor module takes in the coolant from the coolant pipe 9A,
Coolant pipe 9 so as to discharge to coolant pipe 9B.
A and 9B are connected in parallel.

第2図はサイリスタモジユール1内の配管詳細
図を示す。図のように、サイリスタモジユール1
内には、サイリスタスタツク10、アノードリア
クトル11、その他の付属部品(抵抗器など)1
1B,11C、コンデンサ、パルスアンプ及びゲ
ート制御部品が収納される。本図ではこれらの部
品が2回路分収納されている。このモジユール1
は、印加電圧に応じた間隙で、絶縁支柱2に固定
される。この絶縁支柱2は前述のとおり、下部枠
兼均圧板3と、上部枠兼均圧板4により固定され
る。主回路は、2回路中1回路分のアノード端子
6Aからモジユール1のアノードリアクトル11
Aに接続され、サイリスタスタツク10に接続さ
れてから、残りの1回路分のスタツク及びアノー
ドリアクトルに接続されて、接続導体8により次
のモジユールに接続される。この時、サイリスタ
スタツク10間を接続している接続導体8の電位
(モジユールの中間電位)はモジユール1、ケー
ス21と同じになつている。又、アノード端子6
A電位は上部枠兼均圧板と、又、カソード端子7
電位は下部枠兼均圧板及び冷却液配管9A,9B
と、それぞれ同じになつている。
FIG. 2 shows a detailed diagram of the piping inside the thyristor module 1. As shown, thyristor module 1
Inside are a thyristor stack 10, an anode reactor 11, and other accessories (resistors, etc.) 1.
1B, 11C, capacitors, pulse amplifiers, and gate control parts are housed. In this figure, these parts are housed for two circuits. This module 1
are fixed to the insulating column 2 with a gap depending on the applied voltage. As described above, this insulating column 2 is fixed by the lower frame/pressure equalizing plate 3 and the upper frame/pressure equalizing plate 4. The main circuit is connected from the anode terminal 6A of one of the two circuits to the anode reactor 11 of module 1.
A, connected to the thyristor stack 10, then connected to the stack for one remaining circuit and the anode reactor, and then connected to the next module by the connecting conductor 8. At this time, the potential of the connecting conductor 8 connecting between the thyristor stacks 10 (the intermediate potential of the module) is the same as that of the module 1 and the case 21. Also, anode terminal 6
The A potential is connected to the upper frame and pressure equalization plate, and also to the cathode terminal 7.
The potential is lower frame/equalizing plate and coolant piping 9A, 9B
And they are all the same.

サイリスタモジユール1内に収納されているサ
イリスタスタツク10、アノードリアクトル11
Aの主回路の発熱部品、及び付属部品(抵抗器)
11B,11Cの発熱品を冷却する手段は、液冷
式(例えば水冷式)としているが、この冷却液
(水)配管9A,9Bは、第1図の如く、主回路
接続導体8に沿つて布設し、各モジユール1内
は、冷却液(水)配管9A,9Bから冷却液
(水)分岐23を介して絶縁ホース24により各
被冷却体へ通水している。冷却液(水)分岐23
は、モジユールケース21に接続位置25で短絡
されているので、モジユール1の中間電位になつ
ている。従つて本実施例によれば、冷却液(水)
配管9A,9Bの両端に印加される電圧はモジユ
ール1(サイリスタ素子で12個分)間の電圧とな
り、電位分担を均一化できる。また、配管は25
でケース21に接続され、主回路電位となつてい
る。
Thyristor stack 10 and anode reactor 11 housed in thyristor module 1
Heat-generating parts of the main circuit of A and accessory parts (resistors)
The means for cooling the heat-generating components 11B and 11C is a liquid cooling type (for example, water cooling type), and the cooling liquid (water) piping 9A and 9B are installed along the main circuit connecting conductor 8 as shown in FIG. Inside each module 1, water is passed from coolant (water) piping 9A, 9B to each cooled object via an insulated hose 24 via a coolant (water) branch 23. Coolant (water) branch 23
is short-circuited to the module case 21 at the connection position 25, so that it is at the intermediate potential of the module 1. Therefore, according to this embodiment, the cooling liquid (water)
The voltage applied to both ends of the pipes 9A and 9B becomes the voltage between the modules 1 (12 thyristor elements), and the potential sharing can be made uniform. Also, the piping is 25
It is connected to the case 21 at the main circuit potential.

以上のように、本発明によれば、冷却液配管が
主回路接続導体に沿つて配置されているため配管
長を長くでき、このため冷却液配管両端に印加さ
れる電圧は、最大でもモジユール間の電圧以内に
出来るので、局部的に高電圧が印加されないこと
から、絶縁信頼度が向上するし、又、配管形状で
も単純化されるので、サイリスタバルブの構造も
小形簡略化されるという効果がある。
As described above, according to the present invention, since the coolant pipe is arranged along the main circuit connection conductor, the length of the pipe can be increased, and therefore the voltage applied to both ends of the coolant pipe is at most between modules. Since high voltage is not applied locally, insulation reliability is improved, and the piping shape is simplified, which has the effect of simplifying the structure of the thyristor valve. be.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る液冷式サイリスタバルブ
の正面図、第2図は第1図におけるサイリスタモ
ジユールの平面図(一部断面図)である。 1……サイリスタモジユール、2……絶縁支
柱、3……下部枠兼均圧板、4……上部枠兼均圧
板、5……側面均圧板、6……アノード端子、7
……カソード端子、8……主回路接続導体、9
A,9B……冷却液配管、10……サイリスタス
タツク、11……付属部品(抵抗器)、21……
ケース、23……冷却液分岐、24……絶縁ホー
ス、25……電位固定接続(短絡)位置。
FIG. 1 is a front view of a liquid-cooled thyristor valve according to the present invention, and FIG. 2 is a plan view (partially sectional view) of the thyristor module in FIG. 1. 1... Thyristor module, 2... Insulating support column, 3... Lower frame and pressure equalizing plate, 4... Upper frame and pressure equalizing plate, 5... Side pressure equalizing plate, 6... Anode terminal, 7
... Cathode terminal, 8 ... Main circuit connection conductor, 9
A, 9B... Coolant piping, 10... Thyristor stack, 11... Accessory parts (resistor), 21...
Case, 23...Cooling liquid branch, 24...Insulating hose, 25...Potential fixed connection (short circuit) position.

Claims (1)

【特許請求の範囲】[Claims] 1 複数個のサイリスタを接続導体を介して直列
かつ多段に接続し、当該夫々のサイリスタ及びそ
の付属部品から成るモジユールを液体にて冷却す
るサイリスタバルブにおいて、上記接続導体に沿
つて、絶縁を兼ねた冷却液配管を布設し、該冷却
液配管から上記各モジユールへ冷却液を分岐する
冷却液分岐部を当該各モジユール位置に対応して
設け、当該各冷却液分岐部と対応する各モジユー
ルケースとの電位を均しくする短絡手段を各分岐
部毎に接続したことを特徴とする液冷式サイリス
タバルブ。
1. In a thyristor valve in which a plurality of thyristors are connected in series and in multiple stages via connecting conductors, and a module consisting of each thyristor and its attached parts is cooled with liquid, a A coolant pipe is laid, a coolant branch part for branching the coolant from the coolant pipe to each module is provided corresponding to the position of each module, and each module case corresponding to each coolant branch part is provided. A liquid-cooled thyristor valve characterized in that a short circuit means is connected to each branch to equalize the potential of the thyristor valve.
JP6454881A 1981-04-27 1981-04-27 Liquid cooling type thyristor valve Granted JPS57178350A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6454881A JPS57178350A (en) 1981-04-27 1981-04-27 Liquid cooling type thyristor valve

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6454881A JPS57178350A (en) 1981-04-27 1981-04-27 Liquid cooling type thyristor valve

Publications (2)

Publication Number Publication Date
JPS57178350A JPS57178350A (en) 1982-11-02
JPS622703B2 true JPS622703B2 (en) 1987-01-21

Family

ID=13261379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6454881A Granted JPS57178350A (en) 1981-04-27 1981-04-27 Liquid cooling type thyristor valve

Country Status (1)

Country Link
JP (1) JPS57178350A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05171707A (en) * 1991-12-10 1993-07-09 Matsushita Electric Works Ltd Insect repelling and heat insulating board
JPH05171706A (en) * 1991-12-10 1993-07-09 Matsushita Electric Works Ltd Insect repelling and sound insulation board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5323037A (en) * 1976-08-17 1978-03-03 Toshiba Corp Coolin g thyristor converters
JPS5326675A (en) * 1976-08-25 1978-03-11 Toshiba Corp Oil-cooled semiconductor converter

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5323037A (en) * 1976-08-17 1978-03-03 Toshiba Corp Coolin g thyristor converters
JPS5326675A (en) * 1976-08-25 1978-03-11 Toshiba Corp Oil-cooled semiconductor converter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05171707A (en) * 1991-12-10 1993-07-09 Matsushita Electric Works Ltd Insect repelling and heat insulating board
JPH05171706A (en) * 1991-12-10 1993-07-09 Matsushita Electric Works Ltd Insect repelling and sound insulation board

Also Published As

Publication number Publication date
JPS57178350A (en) 1982-11-02

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