JPS62261431A - Manufacture of cover with bag - Google Patents
Manufacture of cover with bagInfo
- Publication number
- JPS62261431A JPS62261431A JP61106036A JP10603686A JPS62261431A JP S62261431 A JPS62261431 A JP S62261431A JP 61106036 A JP61106036 A JP 61106036A JP 10603686 A JP10603686 A JP 10603686A JP S62261431 A JPS62261431 A JP S62261431A
- Authority
- JP
- Japan
- Prior art keywords
- bags
- bag
- frequency voltage
- cover
- voltage application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000000034 method Methods 0.000 claims description 30
- 239000002985 plastic film Substances 0.000 claims description 10
- 238000003466 welding Methods 0.000 description 22
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 238000002360 preparation method Methods 0.000 description 8
- 238000005304 joining Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000004744 fabric Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 229920000298 Cellophane Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 206010011224 Cough Diseases 0.000 description 1
- 208000002260 Keloid Diseases 0.000 description 1
- 206010023330 Keloid scar Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Packaging For Recording Disks (AREA)
- Bag Frames (AREA)
- Making Paper Articles (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、コンピューター用或いはワードプロセッサー
用等のフロッピーデスク、帳票類。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Use The present invention relates to floppy desks and forms for computers, word processors, etc.
カード類、その他の紙葉類(以下においては、これらを
フロッピーデスク等と称す)を収納するための袋付表紙
の製造方法に関する。The present invention relates to a method for producing a cover with a bag for storing cards and other paper sheets (hereinafter referred to as floppy desks, etc.).
従来技術と問題点
持分[759−53174号公報、実公昭58−854
8号公報等で8周波溶接可能な表紙にプラスチックシー
ト製のマチ付袋を高周波溶接して製品化する手段、該シ
ート製のマチ付袋を有する上記表紙が存在することなど
が開示されている。Prior art and problems [Publication No. 759-53174, Japanese Utility Model Publication No. 58-854
Publication No. 8 and the like discloses a method for producing a product by high-frequency welding a gusseted bag made of a plastic sheet to a cover that can be welded at 8 frequencies, and the existence of the above-mentioned cover having a gusseted bag made of the sheet. .
前者の公報が開示している従来の技術手段は、マチ形成
片を金枠に巻付け、そのマチ形成片巻付金枠を上下2枚
のプラスデックシー1〜間に挾み、高周波電圧を印加し
てマチ形成片を上下シートに熱融着する方法である。こ
の方法によるときは、マチ付袋を複数設けることが可能
なるも、その作業性に劣ることは前者の公報に記載され
た通りである。The conventional technical means disclosed in the former publication is to wrap a gusset-forming piece around a metal frame, sandwich the metal frame with the gusset-forming piece wrapped between two upper and lower Plus Decks 1, and apply a high-frequency voltage. This is a method of heat-sealing the gusset forming pieces to the upper and lower sheets by applying heat. When using this method, it is possible to provide a plurality of gusseted bags, but the workability is inferior, as described in the former publication.
前者の公報は、上記従来の技術手段にみられる問題点を
解決するべく、金枠が着脱自在に嵌る可能な台枠に、マ
チ形成片をのせ、ついで、金枠に基台に[してマチ形成
片を折曲げることにより、巻付は作業を容易に行う加工
法を提案している。この加工法によるときは、前記従来
の技術手段におけるマチ形成片の金枠に対する巻付は作
業が幾分能率化されるかもしれないが、多数のマチ付袋
を構成しようとするときは、袋数と同じ回数だけマチ形
成片の巻付は作業を行う必要があり、必ずしも能率的な
加工法ということができない。In the former publication, in order to solve the problems seen in the above-mentioned conventional technical means, a gusset forming piece is placed on a base frame into which a metal frame can be detachably fitted, and then a gusset forming piece is placed on the base frame on the metal frame. We have proposed a processing method that facilitates wrapping by bending the gusset-forming piece. When using this processing method, the work of wrapping the gusset forming piece around the metal frame in the conventional technical means may be somewhat streamlined, but when trying to construct a large number of gusseted bags, the bag It is necessary to wrap the gusset forming pieces the same number of times as the number of times, so it is not necessarily an efficient processing method.
後者の公報は、周知のマチ付袋を有する表紙において、
マチの下側部に開放部を形成した構造を提案し、この構
造によってマチをスムーズに拡げ得るようにしたもので
ある。従って、この公報が開示している構造を得るため
の加工法は、前者の公報が有すると同様な問題点を有し
ているものである。The latter publication has a cover with a well-known gusseted bag,
We have proposed a structure in which an opening is formed on the lower side of the gusset, and this structure allows the gusset to expand smoothly. Therefore, the processing method for obtaining the structure disclosed in this publication has the same problems as the former publication.
本発明は、上記従来技術の問題点に着目してなしたもの
で、予め構成した多数の袋体を一挙に能率よく高周波溶
接し、その高周波溶接された多数の袋体を高周波溶接可
能な表紙にへ周波溶接することにより、全体の作業を一
連の流れ作業として能率よく行うことができ、かつ均質
な製品を能率よく大ωに提供できる貸付表紙の¥IJm
方法の提案を目的とする。The present invention has been made by paying attention to the problems of the prior art described above, and is capable of efficiently high-frequency welding a large number of pre-configured bags at once, and then attaching the high-frequency welded large number of bags to a cover that can be high-frequency welded. By using frequency welding, the entire work can be performed efficiently as a series of assembly operations, and homogeneous products can be efficiently provided in large quantities.
The purpose is to propose a method.
問題点解決のための手段
本発明は、上記目的を達成するため、多数のプラスチッ
クシート製袋体を相互に面接触せしめて配列し、両端の
袋体内部又は袋体外部に夫々配置した電極を高周波電源
に電気的接続し、高周波電圧を印加して上記各袋体の面
接触部における一部を相互に溶接し、両端の袋体におけ
る相互溶接壁と反対側の壁を高周波溶接可能な表紙の片
面に高周波溶接するという技術手段を提案する。Means for Solving the Problems In order to achieve the above object, the present invention arranges a large number of plastic sheet bags in surface contact with each other, and electrodes are arranged inside or outside the bags at both ends. A cover that can be electrically connected to a high-frequency power source and applied a high-frequency voltage to weld parts of the surface contact portions of each bag body to each other, and a wall on the opposite side to the mutually welded wall of the bag bodies at both ends can be high-frequency welded. We propose a technical means of high-frequency welding on one side of the
作用効果
本発明は、上記手段からなるので、多数のプラスチック
シート製袋体を一回の高周波電圧の印加で溶接して接合
することができ、最も時間のかかる加工工程を頗る能率
的に行うことができると共に、各袋体の相互溶接部がケ
ロイド状を?したり、極端に肉薄くなって切裂けやす(
なったりすることがなく、きれいに仕上げることができ
る。そして、^周波溶接された多数の袋体は、高周波溶
接可能な表紙の片面に常法によって高周波溶接するだけ
ですむので、これまた能率よく作業を終ることができる
。Effects of the Invention Since the present invention is comprised of the above-mentioned means, it is possible to weld and join a large number of plastic sheet bag bodies with one application of high-frequency voltage, thereby efficiently performing the most time-consuming processing step. At the same time, the mutual welds of each bag form a keloid-like shape? The wall may become extremely thin and tear easily (
It can be finished neatly without causing any damage. Moreover, since a large number of frequency-welded bags need only be high-frequency welded to one side of the high-frequency weldable cover using a conventional method, the work can be completed efficiently.
従って、袋体がマチ付であるとないとを問わず、格別の
熟練を必要とすることもなく、全作業を終了することが
できる。Therefore, regardless of whether the bag has a gusset or not, the entire work can be completed without requiring special skill.
実施例
本発明の実施例を使用可能な袋体、高周波電圧印加装置
、使用可能な表紙、製造方法などの順に説明する。Embodiments Examples of the present invention will be explained in the order of usable bags, high-frequency voltage application devices, usable covers, manufacturing methods, etc.
使用可能な多数の袋体は、周知の補材袋体或いは周知の
襠なし袋体のいずれでも構わないが、いずれであっても
予め構成しておく。該袋体は、プラスデックシートで角
形2円形など適宜の形状に構成する。高周波電圧印加W
A置は、多数の袋体を面接触配列せしめたとき、両端に
位置する袋体内又は袋体外に必ず配置する可動電極(Φ
極及びe極)と、それら各電極を電気的に接続する高周
波電源とで構成する。可elf極は、高周波電圧印加の
際に各袋体の溶接すべき壁を部分的に加圧するために可
動式に構成する。使用可能な表紙は、高周波溶接可能な
周知の表紙であればよい。たとえば、片面に銀紙を貼着
した厚紙芯をプラスチックシートで包被して構成したも
の、厚紙芯だけをプラスチックシートで包被して構成し
たもの、プラスチック板で構成したもの、プラスチック
板にプラスチックシートを接合したものなど各種の構造
体が使用できる。The numerous bags that can be used may be either well-known auxiliary material bags or well-known gusset-free bags, but either one is configured in advance. The bag body is formed of a plus deck sheet into an appropriate shape such as a rectangular or bicircular shape. High frequency voltage application W
Position A is a movable electrode (Φ
(pole and e-pole) and a high-frequency power source that electrically connects each of these electrodes. The flexible elf pole is configured to be movable in order to partially pressurize the wall of each bag to be welded when a high frequency voltage is applied. The usable cover may be any known cover that can be high-frequency welded. For example, a cardboard core with silver paper pasted on one side and wrapped in a plastic sheet, a cardboard core wrapped in a plastic sheet, a plastic plate, and a plastic plate covered with a plastic sheet. Various structures can be used, such as those joined together.
次に製造方法を説明する。Next, the manufacturing method will be explained.
第1例:多数の袋体(たとえば、10枚以内の袋体)は
襠なしを使用し、高周波電圧印加装置の可動電極(■極
とelfi)を袋体内に配貨した。First example: A large number of bags (for example, 10 or less bags) were made without gusset, and movable electrodes (■ poles and ELFI) of a high-frequency voltage application device were placed inside the bags.
まず、多数の袋体内に絶縁フィルム(たとえば、セロハ
ン、テフロンフィルム、シリコンクロス、エンパイヤク
ロス、その伯の双極子を有しない絶縁フィルム類で、袋
体内一杯の大きさのフィルム)を差込み、該袋体の壁を
相互に面接触せしめて袋体を配列すると共に、絶縁フィ
ルムを入れない袋体を両端に面接触配列せしめる。First, insert an insulating film (for example, cellophane, Teflon film, silicone cloth, empire cloth, or similar insulating film that does not have a dipole, and fill the bags) into a large number of bags. The bags are arranged with the walls of the body in surface contact with each other, and the bags without an insulating film are arranged in surface contact at both ends.
上記袋体配列工程と共に、両端の袋体内に適宜な枠形の
可動電極(一端の袋体にe極、他端の袋体にe極)を夫
々配置し、高周波電源に電気的に接続する。Along with the above bag arrangement step, appropriate frame-shaped movable electrodes (e-pole on one end of the bag, e-pole on the other end) are placed inside the bags at both ends, and electrically connected to a high-frequency power source. .
上記高周波電圧印加準備工程についで、各袋体の相互接
触壁を可動電極で加圧(挟圧)しながら高周波電圧を印
加する。印加された高周波電圧は、双極子を有しない絶
縁フィルムを通過し、各袋体の相互接触壁を溶接せしめ
、各袋体を相互に接合し、恰もアコーディオン状に構成
せしめる。Following the high-frequency voltage application preparation step, a high-frequency voltage is applied while pressing (squeezing) the mutually contacting walls of each bag with a movable electrode. The applied high frequency voltage passes through the dipole-free insulating film and welds the mutually contacting walls of each bag, joining each bag to each other and forming an accordion-like configuration.
しかして、絶縁フィルムを上記の如く使用すれば、絶縁
フィルムが双極子を有していないことによって、該フィ
ルムは高周波電圧を通過せしめるも発熱ぜず、該フィル
ムを差込んだ各袋体の両側壁を溶接せしめることはない
。Therefore, if the insulating film is used as described above, since the insulating film does not have a dipole, the film will not generate heat even when a high frequency voltage is passed through it, and both sides of each bag into which the film is inserted will be heated. No welding of walls.
該高周波電圧印加工程についで、表紙溶接工程に移るが
、この工程は、アコーディオン状に構成された多数の袋
体のうち、両端の袋体を高周波溶接可能な表紙の片面に
常法によって高周波溶接せしめ、製品を得る。Following the high-frequency voltage application step, the cover welding step begins; in this step, out of a large number of accordion-shaped bags, the bags at both ends are welded by high-frequency welding to one side of the cover, which can be high-frequency welded. Get the product.
第2例:多数の袋体は、襠なしであるが、使用枚数は第
1例よりも多い(たとえば、10枚以上の袋体を使用し
た)。高周波電圧印加装置は可動電極及び固定電極を有
し、可動電極は、両端の袋体内に配置し、固定電極は、
中央部の袋体内に配置した。Second example: Many bags are without gusset, but the number of bags used is greater than in the first example (for example, 10 or more bags were used). The high frequency voltage application device has a movable electrode and a fixed electrode, the movable electrode is arranged inside the bag at both ends, and the fixed electrode is
It was placed inside the bag in the center.
まず、多数の袋体の壁を相互に面接触せしめて袋体を配
列すると共に、両端及び中央部の袋体以外の袋体内に第
1例と同様の絶縁フィルムを差込む。First, the walls of a large number of bags are brought into surface contact with each other and the bags are arranged, and the same insulating film as in the first example is inserted into the bags except for the bags at both ends and the center.
この袋体配列工程と共に、両端の袋体内に適宜な枠形の
可動電極(両方の袋体ともe極)を夫々配置し、かつ中
央部の袋体内に可動電極と同形枠形の固定電極(Φl4
i)を配し、該各電極を高周波電源に電気的に接続する
。Along with this bag arrangement step, appropriate frame-shaped movable electrodes (both bags have e-poles) are placed inside the bags at both ends, and fixed electrodes (with the same frame shape as the movable electrodes) are placed inside the central bag. Φl4
i), and each electrode is electrically connected to a high frequency power source.
該高周波電圧印加準備工程についで、各袋体の相互接触
壁を可動電極で固定電極側へ加圧しながら高周波電圧を
印加する。この工程における各袋体の溶接接合の原理は
、第1例の高周波電圧印加工程のそれと同じである。Following the high-frequency voltage application preparation step, a high-frequency voltage is applied while pressing the mutually contacting walls of each bag body toward the fixed electrode side using a movable electrode. The principle of welding and joining each bag in this step is the same as that of the high frequency voltage application step of the first example.
なお、中央部の袋体内に配した固定電極(e極)は、必
ずしも必要としないが、配置したほうが均一に溶接でき
る。Although the fixed electrode (e-electrode) disposed inside the bag at the center is not necessarily required, welding can be more uniform if it is disposed.
上記高周波電圧印加工程についで、第1例の表紙溶接工
程と同じ工程に移り、製品を得る。Following the high-frequency voltage application process, the same process as the cover welding process of the first example is performed to obtain a product.
第3例:多数の袋体は、襠なしであり、使用枚数は、前
記2つの実施例にりもさらに多い。Third example: A large number of bags are without gusset, and the number of bags used is even greater than in the above two examples.
高周波電圧印加装置は、可動電極及び金枠を有し、可動
電極を両端の袋体内に配し、それら以外の袋体内に金枠
を配した。The high-frequency voltage application device had a movable electrode and a metal frame, the movable electrodes were placed inside bags at both ends, and the metal frames were placed inside the other bags.
まず、多数の袋体の壁を相互に面接触せしめて袋体を配
列する。First, the bags are arranged by bringing the walls of a large number of bags into surface contact with each other.
該袋体配列工程と共に、両端の袋体内に適宜な枠形の可
動電極(一端の袋体はΦ極、他端の袋体にe極〉を夫々
配置し、かつ該袋体以外の各袋体内に可動電極と同形枠
形の金型を配置して高周波電源に電気的に接続する。Along with the bag arrangement step, appropriate frame-shaped movable electrodes (Φ pole for the bag at one end, e pole for the bag at the other end) are placed in the bags at both ends, and each bag other than the bag is A mold with the same frame shape as the movable electrode is placed inside the body and electrically connected to a high-frequency power source.
この高周波電圧印加準備工程についで、各袋体の相互接
触壁を可a電極で加圧(挟圧)しながら高周波電圧を印
加する。金枠を配置したことによって、高周波電圧は各
袋体の相互接触壁を溶接せしめ、各袋体を相互に接合し
、恰もアコーディオン状に構成せしめる。Following this high-frequency voltage application preparation step, a high-frequency voltage is applied while pressing (squeezing) the mutually contacting walls of each bag with a flexible electrode. By arranging the metal frame, the high frequency voltage causes the mutually contacting walls of each bag to be welded, joining each bag to each other and forming an accordion-like configuration.
この高周波電圧印加工程についで、第1例と同様の表紙
溶接工程に移り、製品を得る。Following this high-frequency voltage application process, a cover welding process similar to the first example is performed to obtain a product.
第4例:多数の袋体(第1例と同枚数)は襠なしを使用
し、高周波電圧印加装置の可動電極(e極とe極)を袋
体外部に配置した。Fourth example: A large number of bags (same number as in the first example) were made without gusset, and the movable electrodes (e-pole and e-pole) of the high-frequency voltage application device were arranged outside the bags.
袋体配列工程:全袋体内に第1例と同様の絶縁フィルム
を差込み、該袋体の壁を相互に面接触せしめて袋体を配
列せしめる。Bag arrangement step: Insulating films similar to those in the first example are inserted into all the bags, and the walls of the bags are brought into surface contact with each other to arrange the bags.
高周波電圧印加Q備工程二袋体配列工程と共に、両端の
袋体外面(該袋体の相互接触壁と反対側の壁外面)に適
宜な枠形の可動電極(一端の袋体外面にΦ極、他端の袋
体外面にe極)を夫々配置し、高周波電源に電気的接続
する。In addition to the high-frequency voltage application Q preparation process and the two-bag arrangement process, appropriate frame-shaped movable electrodes (Φ electrodes are attached to the outer surface of the bag at one end) are attached to the outer surfaces of the bags at both ends (the outer surfaces of the walls opposite to the mutual contact walls of the bags). , e-pole) are arranged on the outer surface of the bag body at the other end and electrically connected to a high frequency power source.
高周波電圧印加工程:第1例の高周波電圧印加工程に同
じ。各袋体の溶接接合原理も第1例に同じ。High-frequency voltage application process: Same as the high-frequency voltage application process in the first example. The principle of welding and joining each bag is the same as in the first example.
表紙溶接工程:第1例に同じ。Cover welding process: Same as the first example.
上記各実施例において襠付き袋体を使用しても、全く同
じ様に製造できる。Even if a bag with a gusset is used in each of the above embodiments, it can be manufactured in exactly the same way.
特許出願人 株式会社 イ シ ツ カ手続?1
暑1正書
昭和61年 8月 5日
炉い
特許庁長官 黒 1) 明 雄 殿
−・す・(特許庁審査官
殿)1、事件の表示
昭和 61 年 特許願 第 106036 号2、
発明の名称
貸付表紙の製造方法
3、補正をする者
事件との関係 特 許 出 願 人氏名(名称
) 株式会社 イ シ ツ カ4、代理人
住 所 東京都文京区白山5丁目14番7号早川ピル
電話東京946−0531番(代表)■明細書の発明の
詳細な説明の欄
補 正 書
1、明am第5頁11t1目〜11頁4行目までを下記
のJ、うに補正する。Patent applicant Ishitsuka procedure? 1
Summer 1st Book August 5, 1986 Director-General of the Patent Office Black 1) Mr. Akio
−・su・(Patent Office Examiner
) 1. Indication of the case: 1988 Patent Application No. 106036 2.
Name of the invention Method for manufacturing loan covers 3, Relationship with the amended case Patent applicant name Ishitsuka 4, agent address 5-14-7 Hakusan, Bunkyo-ku, Tokyo Hayakawa Pill Telephone Tokyo 946-0531 (Representative) ■ Amendment to the Detailed Description of the Invention in the Specification Book 1, Mei Am, page 5, page 11, line 1 to page 11, line 4, are amended as shown in J below.
記
使用可能な多数の袋体(1)は、周知の補材袋体或いは
周知の襠なし袋体のいずれでも構わないが、いずれであ
っても予め構成しておく(図面は襠なし袋体の例を示す
)。該袋体は、プラスデックシートで角形9円形など適
宜の形状に構成する。高周波電圧印加装置(2)は、多
数の袋体(1)を面接触配列往しめた時、両端に位置す
る袋体(1)内又は袋体(1)外に必ず配置する可動型
l!1(201) (Φ極及びe極)と、それら各電
極を電気的に接続する高周波電源(202)とで構成す
る。可ω1電極(201)は、高周波電圧印加の際に各
袋体(1)の溶接すべき壁を部分的に加圧するために可
動式に構成する。The numerous bags (1) that can be used may be either well-known auxiliary material bags or well-known gusset-free bags, but either type should be configured in advance (the drawing shows gusset-free bags). example). The bag body is formed of a plus deck sheet into an appropriate shape such as a rectangular nine-circle shape. The high-frequency voltage application device (2) is a movable type l! which is always placed inside or outside the bag (1) located at both ends when a large number of bags (1) are moved in a surface contact arrangement. 1 (201) (Φ pole and e pole) and a high frequency power source (202) that electrically connects each of these electrodes. The movable ω1 electrode (201) is configured to be movable in order to partially pressurize the wall of each bag (1) to be welded when applying a high frequency voltage.
使用可能な表紙(不図示)は、高周波溶接可能な周知の
表紙であればよい。たとえば、片面に銀紙を貼るした厚
紙芯をプラスチックシートで包被して構成したもの、厚
紙芯だけをプラスチックシートで包被して構成したもの
、プラスチック板で構成したもの、プラスチック板にプ
ラスチックシートを接合したものなど各種の構造体が使
用できる。The usable cover (not shown) may be any known cover that can be high-frequency welded. For example, a cardboard core with silver paper pasted on one side and wrapped in a plastic sheet, a cardboard core wrapped in a plastic sheet, a plastic plate, and a plastic plate covered with a plastic sheet. Various structures such as bonded structures can be used.
次に製造方法を説明する。Next, the manufacturing method will be explained.
第1例(第2図示、第3図示):多数の袋体(1) (
たとえば、10枚以内の袋体)は襠なしを使用し、高周
波電圧印加装置(2)の可動電極(201) (e極
とe極)を両端に位置する袋体(1)内に配置した。First example (second illustration, third illustration): Many bags (1) (
For example, the bag (of 10 sheets or less) was made without gusset, and the movable electrodes (201) (e-pole and e-pole) of the high-frequency voltage application device (2) were placed inside the bag (1) located at both ends. .
まず、多数の袋体(1)内に絶縁フィルム(3) (た
とえば、セロハン、テフロンフィルム、シリコンクロス
、エンバイヤクロス、その他の双極子を有しない絶縁フ
ィルム類で、袋体内一杯の大きさのフィルム)を差込み
、該袋体の壁を相互に面接触せしめて袋体(1)を配列
すると共に、絶縁フィルム(3)を入れない袋体(1)
を両端に面接触配列゛せしめる。First, insulating films (3) (for example, cellophane, Teflon film, silicone cloth, environment cloth, and other insulating films that do not have dipoles) are placed inside a large number of bags (1), and the size of the bag is filled. The bags (1) are arranged by inserting the insulating film (film) and bringing the walls of the bags into surface contact with each other, and the bags (1) without the insulating film (3) inserted.
A surface contact arrangement is made on both ends.
上記袋体(1)の配列工程と共に、両端の袋体(1)内
に適宜な枠形の可動電極(201)(一端の袋体にΦ極
、他端の袋体にe極)を夫々配置し、高周波電源(20
2)に電気的に接続する。Along with the arrangement process of the bags (1), appropriate frame-shaped movable electrodes (201) (Φ pole on one end of the bag, e pole on the other end) are placed inside the bags (1) at both ends. Place the high frequency power supply (20
2) Electrically connect to.
(第2図参照)
上記高周波型「印加準備工程についで、各袋体(1)の
相互接触壁を可動電極(201)で加圧(挟圧)しなが
ら高周波電圧を印加する。(第3図参照)。印加された
高周波電圧は、双極子を有しない絶縁フィルムを通過し
、各袋体(1)の相互接触壁における可動電極対応部位
を溶接(W)せしめ、各袋体(1)を相互に接合し、恰
もアコーディオン状に構成せしめる。(第7図参照)。(See Figure 2) Following the high-frequency voltage application preparation step, a high-frequency voltage is applied while pressing (squeezing) the mutual contact walls of each bag body (1) with the movable electrode (201). (See the figure).The applied high-frequency voltage passes through an insulating film that does not have a dipole, welds (W) the portion corresponding to the movable electrode on the mutual contact wall of each bag (1), and are joined together to form an accordion-like configuration (see Figure 7).
しかして、絶縁フィルム(3)を上記の如く使用すれば
、その絶縁フィルムが双極子を有していないことによっ
て、該フィルムは高周波電圧を通過せしめるも発熱「ず
、該フィルムを差込んだ各袋体(1)の両側壁を溶接せ
しめることはない。Therefore, if the insulating film (3) is used as described above, since the insulating film does not have a dipole, the film will not generate heat even though it passes a high frequency voltage, and will not generate heat when the film is inserted. There is no welding of both side walls of the bag body (1).
該高周波電圧印加工程についで、不図示の表紙溶接工程
に移るが、この工程は、アコーディオン状に構成された
多数の袋体のうち、両端の袋体を高周波溶接可能な表紙
の片面に常法によって高周波溶接せしめ、製品を得る。Following the high-frequency voltage application process, the process moves to a cover welding process (not shown), in which the bags at both ends of a large number of accordion-shaped bags are welded to one side of the cover, which can be high-frequency welded. The product is obtained by high frequency welding.
第2例(第4図示):多数の袋体(1)は、福なしであ
るが、使用枚数は第1例よりも多い(たとえば、10枚
以上の袋体を使用した)。高周波電圧印加装置(2)は
可!!IJ電極(201)及び固定電極(203)を有
し、可動電極(201)は、両端の袋体(1)内に配置
し、固定電極(203>は、中央部の袋体(1)内に配
置した。Second example (illustrated in the fourth diagram): A large number of bags (1) have no good fortune, but the number of bags used is greater than in the first example (for example, 10 or more bags were used). High frequency voltage application device (2) is allowed! ! It has an IJ electrode (201) and a fixed electrode (203), the movable electrode (201) is placed inside the bag (1) at both ends, and the fixed electrode (203> is placed inside the bag (1) at the center). It was placed in
まず、多数の袋体(1)の壁を相互に面接触せしめて各
袋体(1)を配列すると共に、両端及び中央部の袋体(
1)以外の袋体(1)内に第1例と同様の絶縁フィルム
(3)を差込む。First, the walls of a large number of bags (1) are brought into surface contact with each other, and the bags (1) are arranged, and the bags at both ends and the center (
Insert the same insulating film (3) as in the first example into the bag (1) other than 1).
この袋体配列工程と共に、両端の袋体(1)内に適宜な
枠形の可動型41(201) (両方の袋体ともe極
)をそれぞれ配置し、かつ中央部の袋体(1)内に可動
電極(201)と同形枠形の固定電極(203) (
Φ極)を配し、該各電極を高周波電源(202)に電気
的に接続する。Along with this bag arrangement process, appropriate frame-shaped movable molds 41 (201) (both bags have e-pole) are arranged inside the bags (1) at both ends, and the central bag (1) There is a fixed electrode (203) in the same frame shape as the movable electrode (201) (
Φ poles) are arranged, and each electrode is electrically connected to a high frequency power source (202).
該高周波電圧印加準備工程についで、各袋体(1)の相
互接触壁を可動電極(201)で固定電極(203)側
へ加圧しながら高周波電圧を印加する。この工程におけ
る各袋体(1)の溶接接合の原理は、第1例の高周波電
圧印加工程のそれと同じである。(相互に接合された多
数の袋体は第7図参照)。Following the high-frequency voltage application preparation step, a high-frequency voltage is applied while pressing the mutually contacting walls of each bag body (1) toward the fixed electrode (203) with the movable electrode (201). The principle of welding and joining each bag (1) in this step is the same as that in the high frequency voltage application step of the first example. (See Figure 7 for multiple bags joined together).
なお、中央部の袋体(1)内に配した固定電極(203
) (ΦVi)は、必ずしも必要としないが、配置し
たほうが均一に溶接できる。In addition, the fixed electrode (203) arranged inside the central bag (1)
) (ΦVi) is not necessarily required, but more uniform welding can be achieved by arranging it.
上記高周波電圧印加工程についで、第1例の表紙溶接工
程と同じ工程に移り、製品を19る。Following the above-mentioned high frequency voltage application process, the same process as the cover welding process of the first example is carried out, and the product is made 19.
第3例(第5図示):多数の袋体(1)は、襠なしであ
り、使用枚数は、前記2つの実施例よりもさらに多い。Third example (shown in the fifth figure): A large number of bags (1) are without gusset, and the number of bags used is even greater than in the two examples.
(但し、図面では多数の袋体の一部を省略し、第1例と
同様の枚数を図示した)。(However, in the drawing, some of the many bags are omitted, and the same number as in the first example is illustrated).
高周波電圧印加装置(2)は、可動電極(201’)及
び金枠(203’ ) ’!i:有し、可1jJ 雷h
(201) ヲ両端の袋体(1)内に配し、それら以
外の袋体(1)内に金枠(203’ )を配した。The high frequency voltage application device (2) includes a movable electrode (201') and a metal frame (203')'! i: Yes, possible 1jJ thunder h
(201) A metal frame (203') was placed inside the bags (1) at both ends, and a metal frame (203') was placed inside the other bags (1).
まず、多数の袋体(1)の壁を相互に面接触せしめて各
袋体(1)を配列する。First, a large number of bags (1) are arranged by bringing their walls into surface contact with each other.
該袋体配列工程と共に、両端の袋体(1)内に適宜な枠
形の可8電極(201) (一端の袋体はe極、他端
の袋体にe極)を夫々配置し、かつ咳袋体以外の各袋体
(1)内に可動電極(201)と同形枠形の金枠(20
3’ )を配置して高周波電源(202)に電気的に接
続する。Along with the bag arrangement step, appropriate frame-shaped movable electrodes (201) are arranged in the bag bodies (1) at both ends (e-pole in the bag body at one end, e-pole in the bag body at the other end), respectively. Moreover, inside each bag body (1) other than the cough bag body, a metal frame (20
3') and electrically connect to the high frequency power source (202).
この高周波電圧印加準備工程についで、各袋体(1)の
相互接触壁を可動電極(201)で加圧(挟圧)しなが
ら高周波電圧を印加する。金枠(203’ ”)を配置
したことによって、高周波電圧は各袋体(1)の相互接
触壁における可動電極と金枠との対応部位及び金枠相互
の対応部位を溶接せしめ、各袋体(1)を相互に接合し
、恰もアコーディオン状に構成せしめる。(第7図参照
)。Following this high-frequency voltage application preparation step, a high-frequency voltage is applied while pressing (squeezing) the mutually contacting walls of each bag body (1) with the movable electrode (201). By arranging the metal frame (203'''), the high-frequency voltage welds the corresponding parts of the movable electrode and the metal frame on the mutual contact wall of each bag (1) and the corresponding parts of the metal frames, so that each bag body (1) are joined together to form an accordion-like configuration (see Figure 7).
この高周波電圧印加工程についで、第1例と同様の表紙
溶接工程に移り、製品を得る。Following this high-frequency voltage application process, a cover welding process similar to the first example is performed to obtain a product.
第4例(第6図示):多数の袋体(1)(第1例と同枚
数)は襠なしを使用し、高周波型圧印加装”11 (2
) (1)可!flJ’R極(201) <e極とe
極)を袋体外部に配置した。Fourth example (shown in the sixth diagram): A large number of bags (1) (same number as in the first example) are made without gore, and a high-frequency pressure application device "11 (2
) (1) Possible! flJ'R pole (201) <e pole and e
poles) were placed outside the bag.
袋体配列工程:全袋体(1)内に第1例と同様の絶縁フ
ィルム(3)を差込み、該袋体の壁を相互に面接触せし
めて各袋体(1)を配列せしめる。Bag arrangement step: Insulating films (3) similar to those in the first example are inserted into all the bags (1), and the bags (1) are arranged by bringing the walls of the bags into surface contact with each other.
高周波電圧印加準備工程二袋体配列工程と共に、両端の
袋体外面(該袋体の相互接触壁と反対側の壁外面)に適
宜な枠形の可vJ電極(201)(一端の袋体外面に■
極、伯端の袋体外面にe極)を夫々配置し、高周波電源
(202)に電気的接続する。High-frequency voltage application preparation step In addition to the two-bag arrangement step, an appropriate frame-shaped vJ electrode (201) is attached to the outer surface of the bag at both ends (the outer surface of the wall opposite to the mutual contact wall of the bag) (the outer surface of the bag at one end). To■
A pole and a pole (e) are placed on the outer surface of the bag at the round end, respectively, and electrically connected to a high frequency power source (202).
高周波電圧印加工程:第1例の高周波電圧印加工程に同
じ。各袋体(1)の溶接接合原理も第1例に同じ。(相
互に接合された多数の袋体は第7図参照)。High-frequency voltage application process: Same as the high-frequency voltage application process in the first example. The principle of welding and joining each bag (1) is also the same as in the first example. (See Figure 7 for multiple bags joined together).
表紙溶接工程:第1例に同じ。Cover welding process: Same as the first example.
上記各実施例において補材袋体を使用しても、全く同じ
様に製造できる。Even if an auxiliary material bag is used in each of the above embodiments, it can be manufactured in exactly the same way.
2、明WINの発明の詳細な説明の欄の次に「4、図面
の簡単な説明」の欄を下記の如く補充する。2. Next to the column of detailed explanation of MingWIN's invention, the column of "4. Brief explanation of drawings" is supplemented as follows.
記Record
第1図は本発明製造方法に使用する袋体の1例を示す斜
視図、第2図及び第3図は本発明製造方法の第1例を示
す工程概略説明図、第4図は当該製造方法の第2例を示
す概略説明図、第5図は当該製造方法の第3例を示す概
略説明図、第6図は当該lIl造方法の第4例を示す概
略説明図、第7図は当該製造方法によって接合された多
数の袋体を示す斜視図である。
図中
(1)・・・袋 体
(2)・・・高周波電圧印加装置
(201)・・・可動電極
(202)・・・高周波電源
(203)・・・固定電極
3、別紙図面(第1図〜第7図)を補充する。FIG. 1 is a perspective view showing one example of a bag used in the manufacturing method of the present invention, FIGS. 2 and 3 are process schematic explanatory diagrams showing the first example of the manufacturing method of the present invention, and FIG. A schematic explanatory diagram showing a second example of the method, FIG. 5 is a schematic explanatory diagram showing a third example of the manufacturing method, FIG. It is a perspective view showing a large number of bags joined by the manufacturing method. In the figure (1)...Bag body (2)...High frequency voltage application device (201)...Movable electrode (202)...High frequency power source (203)...Fixed electrode 3, attached drawing (see 1 to 7).
Claims (1)
めて配列し、両端の袋体内部又は袋体外部に夫々配置し
た電極を高周波電源に電気的接続し、高周波電圧を印加
して上記各袋体の面接触部における一部を相互に溶接し
、両端の袋体における相互溶接壁と反対側の壁を高周波
溶接可能な表紙の片面に高周波溶接することを特徴とす
る袋付表紙の製造方法。A large number of plastic sheet bags are arranged in surface contact with each other, electrodes placed inside or outside the bags at both ends are electrically connected to a high frequency power source, and a high frequency voltage is applied to each bag. A method for manufacturing a cover with a bag, characterized in that a part of the surface contact portions of the bags are welded to each other, and a wall on the side opposite to the mutually welded wall of the bag body at both ends is high-frequency welded to one side of the cover which can be high-frequency welded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61106036A JPS62261431A (en) | 1986-05-09 | 1986-05-09 | Manufacture of cover with bag |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61106036A JPS62261431A (en) | 1986-05-09 | 1986-05-09 | Manufacture of cover with bag |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62261431A true JPS62261431A (en) | 1987-11-13 |
Family
ID=14423412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61106036A Pending JPS62261431A (en) | 1986-05-09 | 1986-05-09 | Manufacture of cover with bag |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62261431A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009285887A (en) * | 2008-05-27 | 2009-12-10 | Ohira Kogyo Kk | Bag-like body with gusset and its method for manufacturing |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5746840A (en) * | 1980-07-22 | 1982-03-17 | Masuhiro Mitsuyama | Manufacture of plastic sheet bag laminate with gusset |
-
1986
- 1986-05-09 JP JP61106036A patent/JPS62261431A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5746840A (en) * | 1980-07-22 | 1982-03-17 | Masuhiro Mitsuyama | Manufacture of plastic sheet bag laminate with gusset |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009285887A (en) * | 2008-05-27 | 2009-12-10 | Ohira Kogyo Kk | Bag-like body with gusset and its method for manufacturing |
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