JPS62261118A - Method of coating end surfaces of chip parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention particularly relates to a coating method for forming a coating film such as an electrode on the end face of a microchip component.

The conventional method for forming coating films such as electrodes on the end surfaces of distorted chip components involves manually aligning the chip components and placing them into a jig configured to accommodate a large number of individual chip components. , a silver paste electrode or the like is applied to the protruding end, and after drying, the chip component is turned over and an electrode or the like is similarly applied to the other end.

The problem that we tried to solve: This method of coating the four edges of chip components is very time-consuming because each chip component must be inserted into the jig one by one while being aligned manually. At the same time, it is difficult to handle micro-sized chip components, which is an obstacle to automating the process of taking out chip components and applying electrodes, etc. to their end surfaces.

The present invention was developed in view of the problem of ridges, and it is possible to take out the chip parts from the conveying section and apply electrodes, etc. to the end faces of even ultra-small chip parts by automation using a machine. The purpose was to provide a method.

. In order to achieve the above-mentioned object of reducing the amount of adhesive tape by one head, the present invention provides a plurality of guide rollers between the supply section and the take-up section of the adhesive tape, and the adhesive tape is conveyed between the pair of guide rollers. After adhering the chip component to the adhesive tape by pressing the adhesive side of the adhesive tape, move the chip component to the application section provided between the next guide rollers and form a predetermined coating film on the end surface of the chip component. The gist was

In the method for coating the edge surface of a chip component of the present invention, a certain amount of tension is applied to the adhesive tape supported by a pair of tape guide rollers, and the adhesive surface of the adhesive tape is coated between the pair of guide rollers. Transfer the chip to the side, press the adhesive tape from the back side (non-adhesive side) of the adhesive tape with a chip adhesion press, etc., adhere the chip component to the adhesive tape, take it out from the conveyance section, and in that state, proceed to the next step. The device is moved to the coating section of the process, and a coating film such as an electrode is formed on the end surface of the chip component.

1-Group-charcoal An embodiment of the present invention will be explained based on the drawings. Fig. 1 is a front view of the embodiment of the present invention with details omitted, and Fig. 2 is a front view of the embodiment of the present invention.
3 is a side view of the application section, and FIG. 4 is a plan view of the roller of the winding section. In these figures, reference numeral 1 denotes an adhesive tape having an adhesive surface on one side, which is sent from a supply roller 2 to a take-up roller 3, and the take-up roller 3 is intermittently driven to take up the adhesive tape 1. However, the supply roller 2
Tension is applied in the opposite direction to give tension to the adhesive tape 1. The width of the adhesive tape 1 is the same as or slightly narrower than the width between both ends to which electrodes and the like of a chip component 4 to be described later are applied.

In the conveyance direction of the adhesive tape 1, there are 3
Guide rollers 5a, 5b, and 5c are arranged substantially in a line on the non-adhesive side of the adhesive tape 1. On the adhesive surface side of the adhesive tape 1 between the pair of guide rollers 5a and 5b, a parts feeder 6 is disposed at a position that is conveyed in a direction orthogonal to the traveling direction of the adhesive tape 1 and is slightly away from the adhesive tape 1.
In this way, the ultra-small, rectangular parallelepiped chip component 4 is transported. The chip components 4 are fed in a direction in which coating films such as electrodes are formed on both ends perpendicular to the conveyance direction, and in synchronization with the intermittent movement of the adhesive tape 1, with the leading chip component 4 being fed to the parts feeder 6. is conveyed so that it comes into contact with the stopper at the tip of the guide groove.

A chip adhesion press 7 is provided on the back side of the adhesive tape 1 and is capable of pressing the adhesive tape 1 to the position of the chip components 4 being transported by the parts feeder 6. When the chip adhesion press 7 presses the adhesive tape 1 in synchronization with the intermittent feeding and the chip adhesion press 7 stops feeding, the chip component 4 adheres to the adhesive tape 1, and then the pressing force of the chip adhesion press 7 is released. When the chip bonding press 7 is returned to its original position, the chip component 4 can be taken out from the parts feeder 6 by the tension exerted by the adhesive tape l.
Thereafter, the adhesive tape 1 is moved to the application section 8 for the next step with the chip component 4 adhered thereto.

In the application section 8, a pair of application rollers 9 are applied to the chip component 4.
They are arranged on both sides of the adhesive tape 1 in the width direction at intervals corresponding to the width of the chip component 4, and are configured to be able to apply a silver paste electrode coating to both ends of the chip component 4 at the same time. To this coating roller 9, two coating rollers 10 are attached to each coating roller 9 for uniformly coating the silver paste, and as shown in FIG.
0 are configured to be able to independently reciprocate in their axial directions.

The winding roller 3 for winding up the non-adhesive side of the adhesive tape 1 is sleeve-shaped and configured to be movable in its axial direction, and the lead of movement is set to the width of the adhesive tape 1. As shown in FIG. 4, the structure is such that even when the winding section roller 3 rotates, the adhesive tape 1 can be wound up one after another without overlapping. If the winding section roller 3 is configured to be removable, it can be carried to the next step such as drying together with the adhesive tape 1 while the chip part 4 remains adhered thereto.

The application of electrodes, etc. to the chi/knob parts 4 by the end face coating method of this embodiment involves feeding the adhesive tape 1 from the supply roller 2 to the take-up roller 3 intermittently and under tension. The adhesive tape l is supported by two guide rollers 5a and 5b placed in the middle of the guide rollers 5a.

5b, the chip component 4 is conveyed by the parts feeder 6 to the adhesive surface side, and the adhesive tape 1 is pressed from the non-adhesive surface side to the parts feeder 6 position by the chip adhesive press 7. At the same time, the chip component 4 is transferred to the adhesive tape 1. Glue. Thereafter, when the chip bonding press 7 is returned to its original position, the adhesive tape 1 takes out the chip component 4 from the parts feeder 6 due to the tension exerted on the adhesive tape 1. According to this method, it is only necessary to adhere the chip component 4 to the adhesive tape l, so even if the chip component 4 is extremely small, it can be reliably taken out from the parts feeder 6, and automation with a machine is also possible. It is possible.

The adhesive tape 1 with the chip component 4 adhered thereto is moved to the next step, the coating section 8, where it is passed between a pair of coating rollers 9 that constitute the coating section 8, and silver paste electrodes are coated on both ends of the chip component 4. Forms a film. At this time, the width of the adhesive tape 1 is set to be approximately the same or slightly narrower than the width of the chip component 4 on the application side, so even if the application roller 9 is installed in the width direction of the adhesive tape 1, the coating film will not be formed. It can be formed without any problem. Furthermore, since two coating rollers IO are provided in contact with each of the pair of coating rollers 9, and the coating rollers 10 are reciprocated in the axial direction thereof, the coating film can be formed by the coating rollers 9. can be done uniformly.

Further, the adhesive tape 1 is fed and the non-adhesive surface side of the adhesive tape 1 is wound up on the winding section roller 3 with the chip component 4 on which the coating film is formed being adhered. The winding section roller 3 is covered with adhesive tape l.
Since the adhesive tapes 1 are moved in the axial direction by a lead having a width of , even if the adhesive tapes 1 are sequentially wound by rotating the winding roller 3, the adhesive tapes 1 can be wound without overlapping each other.

Then, as described above, remove the winding section roller 3.
If the adhesive tape 1 is configured so that electrodes are applied to the ends of the plurality of chip components 4, it can be removed as is, which is convenient when transporting the chip components 4 for drying or the like.

The method of coating the edge of a chip component according to the present invention is to convey the chip component to the adhesive side of the adhesive tape, press the adhesive tape from the non-adhesive side with a Chi-Nobu adhesive press, etc., and apply the chip to the end surface of the chip component. After the component is attached to the adhesive tape and taken out, it can be moved directly to the application section, so even if the chip component is extremely small, it only needs to be attached to the adhesive tape, so the child knob component can be reliably removed from the conveyance section. Therefore, it can be easily moved to the coating section for the next process.

Therefore, even for ultra-small chip parts, it is possible to form coating films such as electrodes on the end surfaces of chip parts by automation using machines, which saves labor and improves productivity. It has significant effects such as contributing to cost reduction.

[Brief explanation of drawings]

Figure 1 is a front view of an embodiment of the present invention with details omitted;
The figures are a plan view of FIG. 1, FIG. 3 is a side view of the applicator, and FIG. 4 is a plan view of the roller of the winding section. 1: Adhesive tape, 2: Supply section! -Ra, 3: Winding section roller, 4: Chip parts, 5 (5a, 5b
, 5c) Ni guide roller, 6:, parts feeder,
7: Chip adhesion press, 8: Application section, 9゛: Application roller, 10: Konashi roller.

Claims (3)

[Claims] (1) A plurality of guide rollers are provided between the supply section and the winding section of the adhesive tape, and the chip components conveyed between the pair of guide rollers are pressed against the adhesive side of the adhesive tape to form the adhesive tape. A method for coating an end surface of a chip component, which comprises, after adhering, moving the chip component to a coating section provided between the next guide rollers and forming a predetermined coating film on the end surface of the chip component. (2) The method for coating an end surface of a chip component according to claim 1, wherein the coating film is formed by a pair of paste coating rollers disposed on both sides of the adhesive tape in the width direction. (3) Claim 1 or 2, characterized in that the winding unit winds up the adhesive tape in a spiral shape.
Coating method for the end surface of chip components as described in section.