JPS62260853A - Phenolic resin molding material - Google Patents
Phenolic resin molding materialInfo
- Publication number
- JPS62260853A JPS62260853A JP10404486A JP10404486A JPS62260853A JP S62260853 A JPS62260853 A JP S62260853A JP 10404486 A JP10404486 A JP 10404486A JP 10404486 A JP10404486 A JP 10404486A JP S62260853 A JPS62260853 A JP S62260853A
- Authority
- JP
- Japan
- Prior art keywords
- zelkova
- molding material
- phenolic resin
- resin molding
- woodmeal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 17
- 239000012778 molding material Substances 0.000 title claims abstract description 12
- 229920001568 phenolic resin Polymers 0.000 title claims abstract description 10
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 7
- 241000190021 Zelkova Species 0.000 claims abstract 7
- 239000002023 wood Substances 0.000 claims description 15
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 8
- 238000000465 moulding Methods 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003086 colorant Substances 0.000 abstract description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 abstract description 2
- 239000004312 hexamethylene tetramine Substances 0.000 abstract description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000000047 product Substances 0.000 description 6
- 235000013312 flour Nutrition 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 241000218645 Cedrus Species 0.000 description 1
- 241000218691 Cupressaceae Species 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 241000190020 Zelkova serrata Species 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 235000019256 formaldehyde Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229920005610 lignin Polymers 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は食器、厨房器具部品、家庭用品、雑貨用品等に
弔いられる漆器用フェノール樹脂成形材料に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a phenolic resin molding material for lacquerware used in tableware, kitchen appliance parts, household goods, miscellaneous goods, and the like.
従来、食器、E房器具部品、家庭用品、雑貨用品等にI
ηAられる漆器用成形材料は成形品表面て塗装を施す等
することにより漆器類似品を得るもので、音質、表面硬
度、熱伝導性、軽さ等において木a感を与えることが重
要視され、杉木粉含有フェノール樹脂成形材料が用いら
れていたが木質感は不充分であった。Conventionally, I was used for tableware, E-room appliance parts, household goods, miscellaneous goods, etc.
ηA's lacquerware molding materials are made to resemble lacquerware by applying a coating to the surface of the molded product, and emphasis is placed on providing a wood-like feel in terms of sound quality, surface hardness, thermal conductivity, lightness, etc. A phenolic resin molding material containing cedar wood powder was used, but the wood texture was insufficient.
本発明の目的とするところは、木質感のある漆器用成形
材料を提供することにある。An object of the present invention is to provide a molding material for lacquerware that has a woody feel.
本発明はtlI木粉を含有したことを特徴とするフェノ
ール樹脂のため、音S1表面俊度、熱伝導性、軽さ等の
木質感を向上せしめることができたもので、以下本発明
の詳細な説明する。The present invention is a phenolic resin characterized by containing tlI wood flour, which can improve the wood texture of Sound S1, such as surface agility, thermal conductivity, and lightness.The details of the present invention are as follows. Explain.
本発明に用いる鴎木粉は囁材を扮砕すること【より得ら
れるもので、好ましくは全量の30〜70重、1%(以
下道に憾と記す)を含有せしめることが望ましい。即ち
30チ未満では充分な木質感を与えると・とができて<
<、70%をこえると成形性が低下する傾向にあるため
である。唸木粉の誼πは好ましく80メブシー篩を用込
全涌するq2であることが望ましい。即ち80メツシユ
篩で篩上に残留する粒度では成形品の外観が低下し塗装
後の商品価値を低下する傾向にあるからである。又、棒
木粉は好ましくは堵樹皮のみを粉砕したものであること
がより木質感を向上させることができるので望ましいこ
とである。フェノール樹脂につ論では、フェノール、ク
レゾール、キシレノール等のフェノール類の単独又は混
合物とホルマリン、パラホルムアルデヒド等のホルムア
ルデヒド類とを所定のモル比に配合し、酸性触媒下で反
応させて得られるノボラック型フェノール樹脂やフルカ
リ性触媒下で反応させて得られるレゾール型フェノール
樹脂或はこれらの、a密、リグニン、ナフタリン、キシ
レン、石油系芳香族炭化水素による変性フェノール樹脂
を用いることができる。なおノポラリク型フェノール4
に+脂を用いる際には硬化剤としてヘキサミンを、樹脂
lOO重量部(以下上に部と記す)に対し5〜15部添
加するものである。フェノール樹脂、′硬化剤、欅木扮
以外の配合剤としては必要に応じて無機質充填剤、4憔
型剤、着色剤等を添加し混合、混練、粉砕し更((必要
だ応じて造粒しフェノール樹脂成形材料を舟、該フェノ
ール樹脂成形材料を圧線成型、トランス7丁成形、射出
成形、押出成形等の任意手段で加熱加圧成形して漆器用
成形品を得るものである。The Kamo wood powder used in the present invention is obtained by crushing the cypress wood, and preferably contains 30 to 70 weight of the total amount, or 1% (hereinafter referred to as Michi ni regret) of the total amount. In other words, if the wood is less than 30 inches, it will give a sufficient wood texture.
This is because moldability tends to decrease when it exceeds 70%. The radius π of the wood flour is preferably q2, which is equivalent to 80 Mevsie sieves. That is, if the particle size remains on the 80 mesh sieve, the appearance of the molded product tends to deteriorate and the commercial value after coating tends to decrease. In addition, it is preferable that the stick wood flour is one obtained by pulverizing only the bark of the tree, since this can further improve the wood texture. Regarding phenolic resins, novolak type resins are obtained by blending phenols such as phenol, cresol, xylenol, etc. alone or in mixtures with formaldehydes such as formalin and paraformaldehyde in a predetermined molar ratio, and reacting them under an acidic catalyst. Phenol resins, resol-type phenol resins obtained by reaction under a flukaline catalyst, or phenol resins modified with a-density, lignin, naphthalene, xylene, or petroleum-based aromatic hydrocarbons can be used. In addition, nopolaric type phenol 4
When using resin, 5 to 15 parts of hexamine is added as a hardening agent per 10 parts by weight of the resin (hereinafter referred to as "parts"). In addition to the phenol resin, curing agent, and keyaki wood, inorganic fillers, molding agents, coloring agents, etc. may be added as needed, mixed, kneaded, pulverized, and then granulated (if necessary). A molded product for lacquerware is obtained by heating and press-molding the phenol resin molding material by any means such as pressure wire molding, transformer molding, injection molding, or extrusion molding.
以下本発明を実施例にもとづし)て説r!Aする。The present invention will be explained below based on examples). A.
実施例1乃至3と従来品
フェノール1モル% 4シyk−シムアルデヒド0.8
6モルを37暢ホルマリンで加えてから塩酸υ媒で酸性
殿で反応させ、次いで脱水煮詰して融点90℃のノボラ
ック型フェノール樹脂を得% 該7エ/ A/樹脂を
用−第1表に従って混合、混練、粉砕してフェノール樹
脂成形材料を得、該フェノール樹脂成形材料を成形圧力
’50に9/cds tso℃、3分間圧縮成形して
漆器用成形品を得た。Examples 1 to 3 and conventional product Phenol 1 mol% 4cyk-simaldehyde 0.8
After adding 6 mol of 37% formalin, it was reacted in an acidic precipitate with hydrochloric acid, and then dehydrated and boiled down to obtain a novolak type phenolic resin with a melting point of 90°C. A phenol resin molding material was obtained by mixing, kneading, and pulverizing, and the phenol resin molding material was compression molded at a molding pressure of '50 at 9/cds tso° C. for 3 minutes to obtain a molded product for lacquerware.
第 1 表
嗟
〔発明の効果〕
実施例1乃至3と従来;4qjの漆器fd成形品の性能
は第2表で明白なように本発明のものの性幡はよく、本
発明の優れてbることを確認した。Table 1 [Effects of the Invention] Examples 1 to 3 and the conventional; As is clear from Table 2, the performance of the lacquerware fd molded products of 4qj is good, and the properties of the present invention are excellent. It was confirmed.
gz表gz table
Claims (3)
脂成形材料。(1) A phenolic resin molding material characterized by containing zelkova wood powder.
を特徴とする特許請求の範囲第1項記載のフェノール樹
脂成形材料。(2) The phenolic resin molding material according to claim 1, wherein the amount of zelkova wood powder is 30 to 70% by weight of the total amount.
求の範囲第1項、第2項記載のフェノール樹脂成形材料
。(3) The phenolic resin molding material according to claims 1 and 2, wherein the zelkova wood powder is zelkova bark powder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10404486A JPS62260853A (en) | 1986-05-07 | 1986-05-07 | Phenolic resin molding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10404486A JPS62260853A (en) | 1986-05-07 | 1986-05-07 | Phenolic resin molding material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62260853A true JPS62260853A (en) | 1987-11-13 |
Family
ID=14370217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10404486A Pending JPS62260853A (en) | 1986-05-07 | 1986-05-07 | Phenolic resin molding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62260853A (en) |
-
1986
- 1986-05-07 JP JP10404486A patent/JPS62260853A/en active Pending
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