JPS6226061U - - Google Patents
Info
- Publication number
 - JPS6226061U JPS6226061U JP11798085U JP11798085U JPS6226061U JP S6226061 U JPS6226061 U JP S6226061U JP 11798085 U JP11798085 U JP 11798085U JP 11798085 U JP11798085 U JP 11798085U JP S6226061 U JPS6226061 U JP S6226061U
 - Authority
 - JP
 - Japan
 - Prior art keywords
 - pattern portion
 - land
 - electronic component
 - bonding
 - circuit board
 - Prior art date
 - Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
 - Granted
 
Links
- 230000008878 coupling Effects 0.000 claims 1
 - 238000010168 coupling process Methods 0.000 claims 1
 - 238000005859 coupling reaction Methods 0.000 claims 1
 - 238000005476 soldering Methods 0.000 claims 1
 
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
 - Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
 - Structure Of Printed Boards (AREA)
 
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP11798085U JPH0319238Y2 (forum.php) | 1985-07-31 | 1985-07-31 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP11798085U JPH0319238Y2 (forum.php) | 1985-07-31 | 1985-07-31 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS6226061U true JPS6226061U (forum.php) | 1987-02-17 | 
| JPH0319238Y2 JPH0319238Y2 (forum.php) | 1991-04-23 | 
Family
ID=31004003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP11798085U Expired JPH0319238Y2 (forum.php) | 1985-07-31 | 1985-07-31 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPH0319238Y2 (forum.php) | 
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JP2016100497A (ja) * | 2014-11-25 | 2016-05-30 | 富士通株式会社 | 配線基板及び配線基板の製造方法 | 
- 
        1985
        
- 1985-07-31 JP JP11798085U patent/JPH0319238Y2/ja not_active Expired
 
 
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JP2016100497A (ja) * | 2014-11-25 | 2016-05-30 | 富士通株式会社 | 配線基板及び配線基板の製造方法 | 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPH0319238Y2 (forum.php) | 1991-04-23 |