JPS6226061U - - Google Patents
Info
- Publication number
- JPS6226061U JPS6226061U JP11798085U JP11798085U JPS6226061U JP S6226061 U JPS6226061 U JP S6226061U JP 11798085 U JP11798085 U JP 11798085U JP 11798085 U JP11798085 U JP 11798085U JP S6226061 U JPS6226061 U JP S6226061U
- Authority
- JP
- Japan
- Prior art keywords
- pattern portion
- land
- electronic component
- bonding
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11798085U JPH0319238Y2 (en18) | 1985-07-31 | 1985-07-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11798085U JPH0319238Y2 (en18) | 1985-07-31 | 1985-07-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6226061U true JPS6226061U (en18) | 1987-02-17 |
JPH0319238Y2 JPH0319238Y2 (en18) | 1991-04-23 |
Family
ID=31004003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11798085U Expired JPH0319238Y2 (en18) | 1985-07-31 | 1985-07-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0319238Y2 (en18) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016100497A (ja) * | 2014-11-25 | 2016-05-30 | 富士通株式会社 | 配線基板及び配線基板の製造方法 |
-
1985
- 1985-07-31 JP JP11798085U patent/JPH0319238Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016100497A (ja) * | 2014-11-25 | 2016-05-30 | 富士通株式会社 | 配線基板及び配線基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0319238Y2 (en18) | 1991-04-23 |