JPS6226046U - - Google Patents
Info
- Publication number
- JPS6226046U JPS6226046U JP1985117436U JP11743685U JPS6226046U JP S6226046 U JPS6226046 U JP S6226046U JP 1985117436 U JP1985117436 U JP 1985117436U JP 11743685 U JP11743685 U JP 11743685U JP S6226046 U JPS6226046 U JP S6226046U
- Authority
- JP
- Japan
- Prior art keywords
- view
- sectional
- showing
- insulating frame
- plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985117436U JPS6226046U (US06521211-20030218-C00004.png) | 1985-07-30 | 1985-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985117436U JPS6226046U (US06521211-20030218-C00004.png) | 1985-07-30 | 1985-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6226046U true JPS6226046U (US06521211-20030218-C00004.png) | 1987-02-17 |
Family
ID=31002945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985117436U Pending JPS6226046U (US06521211-20030218-C00004.png) | 1985-07-30 | 1985-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6226046U (US06521211-20030218-C00004.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH039973A (ja) * | 1989-06-07 | 1991-01-17 | Shinko Electric Ind Co Ltd | Ｔａｂ用テープ及びこれを用いた半導体装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5284969A (en) * | 1976-01-07 | 1977-07-14 | Hitachi Ltd | Electrode connection method and lead tape used for the same |
| JPS6046040A (ja) * | 1983-08-24 | 1985-03-12 | Nec Corp | 半導体装置 |
-
1985
- 1985-07-30 JP JP1985117436U patent/JPS6226046U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5284969A (en) * | 1976-01-07 | 1977-07-14 | Hitachi Ltd | Electrode connection method and lead tape used for the same |
| JPS6046040A (ja) * | 1983-08-24 | 1985-03-12 | Nec Corp | 半導体装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH039973A (ja) * | 1989-06-07 | 1991-01-17 | Shinko Electric Ind Co Ltd | Ｔａｂ用テープ及びこれを用いた半導体装置 |
