JPS6223450U - - Google Patents
Info
- Publication number
- JPS6223450U JPS6223450U JP11543085U JP11543085U JPS6223450U JP S6223450 U JPS6223450 U JP S6223450U JP 11543085 U JP11543085 U JP 11543085U JP 11543085 U JP11543085 U JP 11543085U JP S6223450 U JPS6223450 U JP S6223450U
- Authority
- JP
- Japan
- Prior art keywords
- glass
- outer ring
- metal outer
- airtight terminal
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11543085U JPH0337232Y2 (US06566495-20030520-M00011.png) | 1985-07-26 | 1985-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11543085U JPH0337232Y2 (US06566495-20030520-M00011.png) | 1985-07-26 | 1985-07-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6223450U true JPS6223450U (US06566495-20030520-M00011.png) | 1987-02-13 |
| JPH0337232Y2 JPH0337232Y2 (US06566495-20030520-M00011.png) | 1991-08-07 |
Family
ID=30999075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11543085U Expired JPH0337232Y2 (US06566495-20030520-M00011.png) | 1985-07-26 | 1985-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0337232Y2 (US06566495-20030520-M00011.png) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100409043B1 (ko) * | 2001-03-07 | 2003-12-11 | (주)케이브이씨인스트루먼트 | 커패시턴스 진공센서의 전극판 제조방법 |
| KR100409045B1 (ko) * | 2001-03-07 | 2003-12-11 | (주)케이브이씨인스트루먼트 | 커패시턴스 진공센서의 간극조정 구조 |
| KR100409044B1 (ko) * | 2001-03-07 | 2003-12-11 | (주)케이브이씨인스트루먼트 | 커패시턴스 진공 센서구조 |
| KR100409046B1 (ko) * | 2001-03-07 | 2003-12-11 | (주)케이브이씨인스트루먼트 | 커패시턴스 진공 센서의 절연체 구조 |
| JP2012524000A (ja) * | 2009-04-16 | 2012-10-11 | エマーソン エレクトリック カンパニー | ガラス−金属密封封止アセンブリおよびガラス−金属密封封止アセンブリの製造方法 |
-
1985
- 1985-07-26 JP JP11543085U patent/JPH0337232Y2/ja not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100409043B1 (ko) * | 2001-03-07 | 2003-12-11 | (주)케이브이씨인스트루먼트 | 커패시턴스 진공센서의 전극판 제조방법 |
| KR100409045B1 (ko) * | 2001-03-07 | 2003-12-11 | (주)케이브이씨인스트루먼트 | 커패시턴스 진공센서의 간극조정 구조 |
| KR100409044B1 (ko) * | 2001-03-07 | 2003-12-11 | (주)케이브이씨인스트루먼트 | 커패시턴스 진공 센서구조 |
| KR100409046B1 (ko) * | 2001-03-07 | 2003-12-11 | (주)케이브이씨인스트루먼트 | 커패시턴스 진공 센서의 절연체 구조 |
| JP2012524000A (ja) * | 2009-04-16 | 2012-10-11 | エマーソン エレクトリック カンパニー | ガラス−金属密封封止アセンブリおよびガラス−金属密封封止アセンブリの製造方法 |
| US9175999B2 (en) | 2009-04-16 | 2015-11-03 | Emerson Electric Co. | Hermetic glass-to-metal seal assembly and method of manufacturing hermetic glass-to-metal seal assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0337232Y2 (US06566495-20030520-M00011.png) | 1991-08-07 |
