JPS62231712A - Synthetic resin molded article - Google Patents
Synthetic resin molded articleInfo
- Publication number
- JPS62231712A JPS62231712A JP30762086A JP30762086A JPS62231712A JP S62231712 A JPS62231712 A JP S62231712A JP 30762086 A JP30762086 A JP 30762086A JP 30762086 A JP30762086 A JP 30762086A JP S62231712 A JPS62231712 A JP S62231712A
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- molded article
- resin molded
- template
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920003002 synthetic resin Polymers 0.000 title claims abstract description 36
- 239000000057 synthetic resin Substances 0.000 title claims abstract description 35
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- 239000010409 thin film Substances 0.000 claims abstract description 23
- 239000010408 film Substances 0.000 claims abstract description 20
- 239000002994 raw material Substances 0.000 claims abstract description 16
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 10
- 239000008199 coating composition Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- NNWNNQTUZYVQRK-UHFFFAOYSA-N 5-bromo-1h-pyrrolo[2,3-c]pyridine-2-carboxylic acid Chemical compound BrC1=NC=C2NC(C(=O)O)=CC2=C1 NNWNNQTUZYVQRK-UHFFFAOYSA-N 0.000 claims 1
- 229920002574 CR-39 Polymers 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 18
- 238000000576 coating method Methods 0.000 abstract description 11
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 abstract description 10
- 238000005299 abrasion Methods 0.000 abstract description 9
- 239000011248 coating agent Substances 0.000 abstract description 9
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 238000005266 casting Methods 0.000 abstract description 2
- 230000037303 wrinkles Effects 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract 5
- 230000002349 favourable effect Effects 0.000 abstract 1
- -1 methacryloyloxy groups Chemical group 0.000 description 30
- 239000000047 product Substances 0.000 description 26
- 239000000203 mixture Substances 0.000 description 13
- 125000000217 alkyl group Chemical group 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000113 methacrylic resin Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 3
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- 210000002268 wool Anatomy 0.000 description 2
- ADVORQMAWLEPOI-XHTSQIMGSA-N (e)-4-hydroxypent-3-en-2-one;oxotitanium Chemical compound [Ti]=O.C\C(O)=C/C(C)=O.C\C(O)=C/C(C)=O ADVORQMAWLEPOI-XHTSQIMGSA-N 0.000 description 1
- DIOZVWSHACHNRT-UHFFFAOYSA-N 2-(2-prop-2-enoxyethoxy)ethanol Chemical compound OCCOCCOCC=C DIOZVWSHACHNRT-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- HOLOIDMYVKIMCS-UHFFFAOYSA-N 2-[dimethoxy(methyl)silyl]ethyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCOC(=O)C(C)=C HOLOIDMYVKIMCS-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- UZGMIJRIMKLOJK-UHFFFAOYSA-N 2-methoxyethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound C(C1CO1)OCCC[SiH2]OCCOC UZGMIJRIMKLOJK-UHFFFAOYSA-N 0.000 description 1
- PSLRXNFNXYNXEK-UHFFFAOYSA-N 2-triethoxysilylethyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCOC(=O)C=C PSLRXNFNXYNXEK-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- KHVFOZZWLSKDAT-UHFFFAOYSA-N 3-[dimethoxy(phenyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](OC)(OC)C1=CC=CC=C1 KHVFOZZWLSKDAT-UHFFFAOYSA-N 0.000 description 1
- VJWXEQUFROPJBO-UHFFFAOYSA-N 3-[dimethoxy-[3-(2-methylprop-2-enoyloxy)propyl]silyl]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](OC)(CCCOC(=O)C(C)=C)OC VJWXEQUFROPJBO-UHFFFAOYSA-N 0.000 description 1
- JSOZORWBKQSQCJ-UHFFFAOYSA-N 3-[ethoxy(dimethyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(C)CCCOC(=O)C(C)=C JSOZORWBKQSQCJ-UHFFFAOYSA-N 0.000 description 1
- DGBFOBNYTYHFPN-UHFFFAOYSA-N 3-[ethoxy(dimethyl)silyl]propyl prop-2-enoate Chemical compound CCO[Si](C)(C)CCCOC(=O)C=C DGBFOBNYTYHFPN-UHFFFAOYSA-N 0.000 description 1
- AGSDYWSVHVHBPP-UHFFFAOYSA-N 3-[ethoxy-bis[3-(2-methylprop-2-enoyloxy)propyl]silyl]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](OCC)(CCCOC(=O)C(C)=C)CCCOC(=O)C(C)=C AGSDYWSVHVHBPP-UHFFFAOYSA-N 0.000 description 1
- JBDMKOVTOUIKFI-UHFFFAOYSA-N 3-[methoxy(dimethyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(C)CCCOC(=O)C(C)=C JBDMKOVTOUIKFI-UHFFFAOYSA-N 0.000 description 1
- ZCRUJAKCJLCJCP-UHFFFAOYSA-N 3-[methoxy(dimethyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(C)CCCOC(=O)C=C ZCRUJAKCJLCJCP-UHFFFAOYSA-N 0.000 description 1
- GDDNTTHUKVNJRA-UHFFFAOYSA-N 3-bromo-3,3-difluoroprop-1-ene Chemical compound FC(F)(Br)C=C GDDNTTHUKVNJRA-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- IRFKFVOVGQDZTN-UHFFFAOYSA-N 4-[dimethoxy(methyl)silyl]butyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCCOC(=O)C(C)=C IRFKFVOVGQDZTN-UHFFFAOYSA-N 0.000 description 1
- MDHOEIZPQKRXHF-UHFFFAOYSA-N 4-[dimethoxy(methyl)silyl]butyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCCOC(=O)C=C MDHOEIZPQKRXHF-UHFFFAOYSA-N 0.000 description 1
- QYHWHNCFMJHPKY-UHFFFAOYSA-N 4-[methoxy(dimethyl)silyl]butyl prop-2-enoate Chemical compound CO[Si](C)(C)CCCCOC(=O)C=C QYHWHNCFMJHPKY-UHFFFAOYSA-N 0.000 description 1
- QQLLXLMGANLVAX-UHFFFAOYSA-N 4-triethoxysilylbutyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCCOC(=O)C(C)=C QQLLXLMGANLVAX-UHFFFAOYSA-N 0.000 description 1
- ORKJFLQNNVDBKY-UHFFFAOYSA-N 4-trimethoxysilylbutyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCOC(=O)C(C)=C ORKJFLQNNVDBKY-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- XNCOSPRUTUOJCJ-UHFFFAOYSA-N Biguanide Chemical compound NC(N)=NC(N)=N XNCOSPRUTUOJCJ-UHFFFAOYSA-N 0.000 description 1
- 229940123208 Biguanide Drugs 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- RRJNRIIFEMOZGO-UHFFFAOYSA-N C(C(=C)C)(=O)OCC[Si](OC)(CCOC(C(=C)C)=O)CCOC(C(=C)C)=O Chemical compound C(C(=C)C)(=O)OCC[Si](OC)(CCOC(C(=C)C)=O)CCOC(C(=C)C)=O RRJNRIIFEMOZGO-UHFFFAOYSA-N 0.000 description 1
- YLDJAWMBOFBXFH-UHFFFAOYSA-N C(C(=C)C)(=O)OCC[Si](OC)(OC)CCOC(C(=C)C)=O Chemical compound C(C(=C)C)(=O)OCC[Si](OC)(OC)CCOC(C(=C)C)=O YLDJAWMBOFBXFH-UHFFFAOYSA-N 0.000 description 1
- FPHOFJVSTCTLOW-UHFFFAOYSA-N C(C=C)(=O)OCCC[Si](OC)(OC)C=C Chemical compound C(C=C)(=O)OCCC[Si](OC)(OC)C=C FPHOFJVSTCTLOW-UHFFFAOYSA-N 0.000 description 1
- WKMBXPMILKSMRY-UHFFFAOYSA-N C(C=C)(=O)OC[Si](OC)(COC(C=C)=O)COC(C=C)=O Chemical compound C(C=C)(=O)OC[Si](OC)(COC(C=C)=O)COC(C=C)=O WKMBXPMILKSMRY-UHFFFAOYSA-N 0.000 description 1
- ROAAGMSYNIPBEX-UHFFFAOYSA-N C(C=C)(=O)OC[Si](OCC)(COC(C=C)=O)COC(C=C)=O Chemical compound C(C=C)(=O)OC[Si](OCC)(COC(C=C)=O)COC(C=C)=O ROAAGMSYNIPBEX-UHFFFAOYSA-N 0.000 description 1
- KMLTUQLZFGALMK-UHFFFAOYSA-N CCO[SiH2]CCCOC(=O)C(C)=C Chemical compound CCO[SiH2]CCCOC(=O)C(C)=C KMLTUQLZFGALMK-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 244000208060 Lawsonia inermis Species 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical class [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 235000010599 Verbascum thapsus Nutrition 0.000 description 1
- 244000178289 Verbascum thapsus Species 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- YAWNFGAHEUCLNJ-UHFFFAOYSA-N [B].OB(O)O Chemical compound [B].OB(O)O YAWNFGAHEUCLNJ-UHFFFAOYSA-N 0.000 description 1
- NXVGVIDVSSNBPV-UHFFFAOYSA-N [ethyl(dimethoxy)silyl]methyl prop-2-enoate Chemical compound CC[Si](OC)(OC)COC(=O)C=C NXVGVIDVSSNBPV-UHFFFAOYSA-N 0.000 description 1
- HZIABGAGAIMOQZ-UHFFFAOYSA-N [methoxy(dimethyl)silyl]methyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(C)COC(=O)C(C)=C HZIABGAGAIMOQZ-UHFFFAOYSA-N 0.000 description 1
- CDVLARZRMIEPMF-UHFFFAOYSA-N [methoxy(dimethyl)silyl]methyl prop-2-enoate Chemical compound CO[Si](C)(C)COC(=O)C=C CDVLARZRMIEPMF-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005083 alkoxyalkoxy group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- SYFOAKAXGNMQAX-UHFFFAOYSA-N bis(prop-2-enyl) carbonate;2-(2-hydroxyethoxy)ethanol Chemical compound OCCOCCO.C=CCOC(=O)OCC=C SYFOAKAXGNMQAX-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- NGQBIUKDKBUSSE-UHFFFAOYSA-N but-3-enoxy-diethoxy-methylsilane Chemical compound CCO[Si](C)(OCC)OCCC=C NGQBIUKDKBUSSE-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- FJDJVBXSSLDNJB-LNTINUHCSA-N cobalt;(z)-4-hydroxypent-3-en-2-one Chemical compound [Co].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O FJDJVBXSSLDNJB-LNTINUHCSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 108010011222 cyclo(Arg-Pro) Proteins 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- YTUPSNLWAAEFPL-UHFFFAOYSA-N ethenyl(ethoxy)silane Chemical compound CCO[SiH2]C=C YTUPSNLWAAEFPL-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- MLSKXPOBNQFGHW-UHFFFAOYSA-N methoxy(dioxido)borane Chemical compound COB([O-])[O-] MLSKXPOBNQFGHW-UHFFFAOYSA-N 0.000 description 1
- YIZSUQBDNDPXET-UHFFFAOYSA-N methoxysilylmethyl 2-methylprop-2-enoate Chemical compound CO[SiH2]COC(=O)C(C)=C YIZSUQBDNDPXET-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- MOVRCMBPGBESLI-UHFFFAOYSA-N prop-2-enoyloxysilicon Chemical compound [Si]OC(=O)C=C MOVRCMBPGBESLI-UHFFFAOYSA-N 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- RLJWTAURUFQFJP-UHFFFAOYSA-N propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)O.CC(C)O.CC(C)O RLJWTAURUFQFJP-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 239000004447 silicone coating Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 239000008279 sol Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- JREYOWJEWZVAOR-UHFFFAOYSA-N triazanium;[3-methylbut-3-enoxy(oxido)phosphoryl] phosphate Chemical compound [NH4+].[NH4+].[NH4+].CC(=C)CCOP([O-])(=O)OP([O-])([O-])=O JREYOWJEWZVAOR-UHFFFAOYSA-N 0.000 description 1
- HHPPHUYKUOAWJV-UHFFFAOYSA-N triethoxy-[4-(oxiran-2-yl)butyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCCC1CO1 HHPPHUYKUOAWJV-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- DBUFXGVMAMMWSD-UHFFFAOYSA-N trimethoxy-[3-(7-oxabicyclo[4.1.0]heptan-4-yl)propyl]silane Chemical compound C1C(CCC[Si](OC)(OC)OC)CCC2OC21 DBUFXGVMAMMWSD-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229920001221 xylan Polymers 0.000 description 1
- 150000004823 xylans Chemical class 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、耐擦10性および耐候性に浸れた被膜を形成
してなる合成樹脂成形品に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a synthetic resin molded article formed with a coating having excellent scratch resistance and weather resistance.
(従来の技術)
現在、ガラス、金属、木等の従来の材質型の成形品に代
わり、多くの合成樹脂成形品が市販されており、これら
は多くの優れた性質を有している。(Prior Art) Currently, many synthetic resin molded products are commercially available in place of molded products made of conventional materials such as glass, metal, and wood, and these have many excellent properties.
しかしながら、合成樹脂成形品は、一般に耐摩耗性が充
分ではなく、この点が改良されれば更に多くの発展が期
待される。However, synthetic resin molded products generally do not have sufficient wear resistance, and if this point is improved, further development is expected.
さて、これらの合成樹脂成形品の耐摩耗性向上法として
は、種々のものが開発されているが、その表面に他の硬
い凹凸のない平滑な耐摩耗性薄膜を何らかの方法で付着
させることが、合成樹脂の本来右する優れた諸性質を損
うことなく改良できる最も有効な方法であると考えられ
ている。Now, various methods have been developed to improve the wear resistance of these synthetic resin molded products, but it is difficult to attach a smooth wear-resistant thin film without other hard irregularities to the surface by some method. is considered to be the most effective method for improving synthetic resins without impairing their inherently excellent properties.
このにうな方法の1つとして、装造工程の簡略化もあわ
せて行なうことを目的として、鋳型にアリルメタクリレ
ート、エチレンジメタクリレート等の栗橋性単徂体とそ
の重合開始へ11との混合物を塗布した後、これにあら
かじめ製造された基材樹脂を密着させ加熱する方法(特
公昭37−9.827号)があるが、基材樹脂を架橋剤
と重合開始剤との混合物に密着さVる際に気泡が入り易
く、その気泡を除去することが困難であり、工業化する
には操作1難しい問題を含んでいる。また、アルカンジ
オールのジメタクリレー1へあるいはジエチレングリコ
ールジメタクリレート、トリエチレングリコールジメク
クリレート等の架橋性用吊体とその重合開始剤の混合物
を鋳型に塗布し乾燥して薄膜を形成さけ、その俊基材樹
脂原料をその鋳型に注入して重合を行なう方法(特公昭
35−17.487号)があるが、この方法では薄膜が
充分に重合していないために、薄jI!が樹脂原料に膨
潤または溶解し1bすく、そのため表面薄膜と基材との
界面に線状のクラックが生じやすい。このため薄膜と親
和性のないフィルムを密着させ酸素遮断下で薄膜を重合
硬化させた後フィルムのみを剥離し、その11i基材樹
脂原料を注入する方法(特公昭47−13.417号、
特公昭49−36.829号)が提唱され、さらに架橋
性重合物を1分子中に少なくとも3個の7クリロイルオ
キシ基および/またはメタアクリロイルオキシ基を有し
かつ各アクリロイルオキシ基および/またはメタアクリ
ロイルオキシ基間が飽和炭化水素基で結合された化合物
単独または該化合物を30%以上含有する他の重合可能
な化合物との混合物へと変更しく特公昭49−22,9
51号)、また薄膜の重合硬化がある程度進行した後は
、フィルムを剥離しくあるいは不活性基体雰囲気下を解
除し)で重合硬化する(特公昭54−14,617@、
特公昭54−14.618号)などの改良が加えられて
いる。しかしながら、これらの方法は、操作が煩雑であ
るばかりでなく、薄膜の素材が満足できるものではない
ために、曝露後の耐擦傷性の低下、密着性の低下は避け
がたく、jJられる合成樹脂の最終製品は、耐摩耗性に
ムラのあるものとなりやすい欠点を有している。As one of these methods, a mixture of Kurihashi monolayers such as allyl methacrylate and ethylene dimethacrylate and 11 is applied to the mold to initiate polymerization, with the aim of simplifying the packaging process. After that, there is a method (Japanese Patent Publication No. 37-9.827) in which a pre-prepared base resin is brought into close contact with the mixture and heated. In this process, air bubbles are easily formed, and it is difficult to remove the air bubbles, which poses a problem in step 1 for industrialization. In addition, a mixture of a crosslinkable suspension such as alkanediol dimethacrylate 1 or diethylene glycol dimethacrylate or triethylene glycol dimecacrylate and its polymerization initiator is applied to a mold and dried to form a thin film, and the base material is There is a method (Japanese Patent Publication No. 35-17.487) in which a resin raw material is injected into the mold and polymerized, but this method does not polymerize the thin film sufficiently, resulting in a thin film. swells or dissolves in the resin raw material, which tends to cause linear cracks at the interface between the surface thin film and the base material. For this reason, there is a method in which a film that has no affinity with the thin film is brought into close contact with the thin film, the thin film is polymerized and cured under oxygen-blocking conditions, only the film is peeled off, and the 11i base resin raw material is injected (Japanese Patent Publication No. 47-13-417,
Japanese Patent Publication No. 49-36.829) was proposed, and furthermore, a crosslinkable polymer having at least three 7-acryloyloxy groups and/or methacryloyloxy groups in one molecule, and each acryloyloxy group and/or A compound in which methacryloyloxy groups are bonded with a saturated hydrocarbon group alone or in a mixture with other polymerizable compounds containing 30% or more of the compound;
No. 51), and after the polymerization and hardening of the thin film has progressed to a certain extent, the film is polymerized and hardened by peeling it off or removing the inert substrate atmosphere (Japanese Patent Publication No. 14, 1983, 617@,
Improvements such as Special Publication No. 54-14.618) have been added. However, these methods are not only complicated to operate, but also because the material used for the thin film is not satisfactory, resulting in a decrease in scratch resistance and adhesion after exposure. The final product has the disadvantage that it tends to have uneven wear resistance.
一方、耐候性に優れているといわれるオルガノポリシロ
キサン系コーティング組成物での同様な方法においても
、耐擦IH性および耐候性の優れた表面を有する合成樹
脂成形品は得られていない。On the other hand, even in a similar method using an organopolysiloxane coating composition said to have excellent weather resistance, a synthetic resin molded article having a surface with excellent scratch resistance and weather resistance has not been obtained.
これは白化、ヒケなどの表面欠点のない外観良好で密着
性が十分な耐摩耗性のすぐれた表面を有する合成樹脂成
形品が得られないためである。This is because it is not possible to obtain a synthetic resin molded product that has a surface with good appearance, sufficient adhesion, and excellent abrasion resistance without surface defects such as whitening and sink marks.
(発明が解決しようとする問題点)
従って、本発明の目的は、新規な合成樹脂成形品を提供
することにある。詳しく述べると、本発明は、簡便な処
理工程により耐MFj性、耐候性および外観性等に優れ
た表面を有する合成樹脂成形品を提供することを目的と
する。更に本発明は、曝露後の耐擦傷性の低下、密着性
の低下がなく耐候性に滑れたΩ4摩耗性にムラのない被
膜を付与された表面を有する合成樹脂成形品を提供する
ことを目的とする。(Problems to be Solved by the Invention) Therefore, an object of the present invention is to provide a novel synthetic resin molded product. Specifically, an object of the present invention is to provide a synthetic resin molded article having a surface with excellent MFj resistance, weather resistance, appearance, etc. through a simple treatment process. Furthermore, it is an object of the present invention to provide a synthetic resin molded product having a surface coated with a coating that has an even resistance to weathering and Ω4 abrasion resistance without reducing scratch resistance or adhesion after exposure. shall be.
(問題点をiff決するtこめの手段)上記諸口的は、
(メタ)アクリロキシ壜含右アル]キシシランの加水分
子f(物およびシルカゾルを含イiするコーティング組
成物を、鋳型の少なくとも一内面に塗イIし、必らかし
め加熱乾燥して薄1模を形成したのち、基材4M脂原料
を鋳型に注入し、重合を行なって成形される、少なくと
も一表面が上記コーティング組成物由来の硬化膜により
被覆されていることを特徴とする合成樹脂成形品により
達成される。(The best way to resolve the issue) The above terms are as follows:
A coating composition containing hydrated molecules of (meth)acryloxysilane and silkasol is applied to at least one inner surface of the mold, caulked, and dried by heating to form a thin 1-mold mold. After forming, a synthetic resin molded product characterized in that at least one surface is covered with a cured film derived from the above coating composition, which is formed by injecting a base 4M resin raw material into a mold and polymerizing it. achieved.
(作用) 以下、本発明をより詳細に説明する。(effect) The present invention will be explained in more detail below.
本発明の合成樹脂成形品は、鋳込重合により成形される
ものであり、新規なコーティング組成物を、塁祠樹脂原
料を注入する前に鋳型内面に塗イ5し、必らがじめ加熱
乾燥させてaIlaを鋳型内面に形成し、その後基材樹
脂原ス′31を注入し一般的な鋳込重合を行なうことに
よって優れtこ表面特性を付与されるものである。The synthetic resin molded product of the present invention is molded by cast polymerization, and the new coating composition is applied to the inner surface of the mold before injecting the base resin raw material, and must be heated first. Excellent surface properties are imparted by drying and forming aIla on the inner surface of the mold, then injecting base resin stock 31 and performing general casting polymerization.
本発明の合成樹脂成形品を製造するために用いられるコ
ーティング組成物中に含まれる(メタ)アクリロキシ阜
含有アルコキシシランの加水分解物とは、一般式1、
2n
R’ −3i −(OR3) 4−IIl−o(I
)((ILL、、式中R1はアクリロキシ基またはメタ
クリロキシ基で置換されtこ炭素数1〜4、好ましくは
3〜4の同じまたは異なるアルキルであり、R2は炭素
数1〜8、好ましくは1〜6の同じまたは異なるアルキ
ル、アルケニル、フェニルであり、R3は炭素数1〜5
、好ましくは1〜4の同じまたは異なるアルキル、アル
コキシアルキルであり、またnはO〜2、好ましくはO
〜]の整数、mは1〜3、好ましくは1〜2の整数でお
りかつm十〇≦3である。)で表わされる化合物の加水
分解物などでおる。一般式(I)で表わされる化合物と
しては、例えばアクリロキシメチル1〜リメ1〜キシシ
ラン、アクリロキシメチル(メチル)ツメ1〜ギシシラ
ン、アクリロキシメチル(ジメチル)メトキシシラン、
アクリロキシメチル1−リエ1〜キシシラン、β−アク
リロキシエヂルトリメトキシシラン、β−アクリロギシ
エチルくメチル)ジメトキシシラン、β−7クリロキシ
エチル(エチル)ジメトキシシラン、β−7クリロ主ジ
エチル(ジメチル)メトキシシラン、β−アクリロキシ
エチルトリエ1−キシシラン、γ−アクリロキシプロピ
ルトリメトキシシラン
ルトリエトキシシラン、γ−7クリロキシプロピル(メ
チル)ジメトキシシラン、γーアクリロキシプロピル(
ジメチル)メトキシシラン、γーアクリロキシプロピル
(ジメチル)エトキシシラン、γーアクリロキシプロピ
ル(ビニル)ジメトキシシラン、γーアクリロキシプロ
ピル(フェニル)ツメ1−キシシラン、γーアクリロキ
シプロピルトリ(メトキジエトキシ)シラン、δ−アク
リロキシブチル1へりメトキシシラン、δ−アクリロキ
シブチル1〜リエ1〜キシシラン、δ−アクリロキシブ
チル(メチル)ジメトキシシラン、δ−アクリロキシブ
チル(ジメチル)メトキシシラン、ビス(7クリロキシ
メチル)ツメ1〜キシシラン、ビス(アクリロキシメチ
ル)ジェトキシシラン、ビス(アクリロキシエチル)ジ
メトキシシラン、ビス(アクリロキシエチル)ジェトキ
シシラン、ビス(アクリロキシプロピル)ツメ1−キシ
シラン、ビス(アクリロキシプロピル)ジェトキシシラ
ン、トリス(アクリロキシメチル)メトキシシラン、ト
リス(アクリロキシメチル)エトキシシラン、1−リス
(アクリロキシエチル)メトキシシラン、1〜リス(ア
クリロキシエチル)工1−キシシラン、トリス(アクリ
ロキシプロピル〉メトキシシラン、1〜リス(アクリロ
キシプロピル)エトキシシラン、メタクリロキシメチル
1−ジメトキシシラン、メタクリロキシメチル(メチル
)ジメ)・キシシラン、メタクリロキシメチル(ジメチ
ル)メ1−キシシラン、メタクリロキシメチルトリエト
キシシランβ−メタクリロキシエチルトリメ1〜キシシ
ラン、β−メタクリロキシエチル1〜リエ1〜キシシラ
ン、β−メタクリロキシエチル(メチル)ジメトキシシ
ラン、β−メタクリロキシエチル(エチル)ツメ1〜キ
シシラン、β−メタクリロキシエチル(ジメチル)メ1
〜キシシラン、γーメタクリロギシブロピル1〜リメト
キシシラン、γーメタクリロキシプロピル1〜リエトキ
シシラン、γーメタクリロキシプロピル(メチル)ジメ
トキシシラン、γーメタクリロキシプロピル(ジメチル
)メ1〜キシシラン、γーメタクリロキシプロピル(ジ
メチル)エトキシシラン、γーメタクリロキシプロピル
(ビニル)ツメ1〜キシシラン、γーメタクリロキシプ
ロピル(フェニル)ジメトキシシラン、γーメタクリロ
主ジプロピルトリ(メトキシエトキシ)シラン、δ−メ
タクリロキシブチルトリメトキシシラン、δ−メタクリ
ロキシブチルトリエトキシシラン、δ−メタクリロキシ
ブチル(メチル)ジメトキシシラン、δ−メタクリロキ
シブチル(ジメチル)メ1−キシシラン、ビス(メタク
リロキシメチル)ジスl−キシシラン、ビス(メタクリ
ロキシメチル)ジェトキシシラン、ビス(メタクリロキ
シエチル)ジメトキシシラン、ビス(メタクリロキシエ
チル)ジェトキシシラン、ビス(メタクリロキシプロピ
ル)ジメトキシシラン、ビス(メタクリロキシプロピル
)ジエ)−キシシラン、トリス(メタクリロキシメチル
)メトキシシラン、1〜すス(メタクリロキシエチル)
工1−キシシラン、トリス(メタクリロキシエチル)メ
トキシシラン、1−リス(メタクリロキシエチル)エト
キシシラン、1〜リス(メタクリロキシプロピル)メト
キシシラン、トリス(メタクリロキシプロピル)エトキ
シシランなどがある。The (meth)acryloxy-containing alkoxysilane hydrolyzate contained in the coating composition used to produce the synthetic resin molded article of the present invention has the general formula 1, 2n R' -3i -(OR3) 4 -IIl-o(I
)((ILL, where R1 is the same or different alkyl having 1 to 4 carbon atoms, preferably 3 to 4 carbon atoms, substituted with an acryloxy group or methacryloxy group, and R2 is the same or different alkyl having 1 to 8 carbon atoms, preferably 1 ~6 same or different alkyl, alkenyl, phenyl, R3 has 1 to 5 carbon atoms
, preferably 1 to 4 same or different alkyl, alkoxyalkyl, and n is O to 2, preferably O
~], m is an integer of 1 to 3, preferably 1 to 2, and m10≦3. ) and the like. Examples of the compound represented by the general formula (I) include acryloxymethyl-1-rime-1-xysilane, acryloxymethyl (methyl)tsume-1-gishsilane, acryloxymethyl (dimethyl)methoxysilane,
Acryloxymethyl (ethyl)dimethoxysilane, β-acryloxydiyltrimethoxysilane, β-acrylogyethyl(ethyl)dimethoxysilane, β-7cryloxyethyl(ethyl)dimethoxysilane, dimethyl)methoxysilane, β-acryloxyethyltriethoxysilane, γ-acryloxypropyltrimethoxysilanerutriethoxysilane, γ-7cryloxypropyl(methyl)dimethoxysilane, γ-acryloxypropyl(
dimethyl)methoxysilane, γ-acryloxypropyl(dimethyl)ethoxysilane, γ-acryloxypropyl(vinyl)dimethoxysilane, γ-acryloxypropyl(phenyl)tume 1-xysilane, γ-acryloxypropyltri(methoxydiethoxy) ) silane, δ-acryloxybutyl 1-helymethoxysilane, δ-acryloxybutyl 1-rie 1-xysilane, δ-acryloxybutyl(methyl)dimethoxysilane, δ-acryloxybutyl(dimethyl)methoxysilane, bis(7) Acryloxymethyl) Tsume 1-xysilane, bis(acryloxymethyl)jethoxysilane, bis(acryloxyethyl)dimethoxysilane, bis(acryloxyethyl)jethoxysilane, bis(acryloxypropyl) Tsume 1-xysilane, bis (acryloxypropyl)jetoxysilane, tris(acryloxymethyl)methoxysilane, tris(acryloxymethyl)ethoxysilane, 1-lis(acryloxyethyl)methoxysilane, 1-lis(acryloxyethyl)methoxysilane , tris(acryloxypropyl>methoxysilane, 1-lis(acryloxypropyl)ethoxysilane, methacryloxymethyl 1-dimethoxysilane, methacryloxymethyl(methyl)dime)xysilane, methacryloxymethyl(dimethyl)methoxysilane , methacryloxymethyltriethoxysilane β-methacryloxyethyl trime 1-xysilane, β-methacryloxyethyl 1-rie 1-xysilane, β-methacryloxyethyl (methyl) dimethoxysilane, β-methacryloxyethyl (ethyl) trime 1 ~Xysilane, β-methacryloxyethyl (dimethyl)meth1
~xysilane, γ-methacryloxypropyl 1-rimethoxysilane, γ-methacryloxypropyl 1-ethoxysilane, γ-methacryloxypropyl (methyl) dimethoxysilane, γ-methacryloxypropyl (dimethyl) methoxysilane , γ-methacryloxypropyl (dimethyl) ethoxysilane, γ-methacryloxypropyl (vinyl) 1-xysilane, γ-methacryloxypropyl (phenyl) dimethoxysilane, γ-methacrylo-mainly dipropyltri(methoxyethoxy)silane, δ-methacryloxy Butyltrimethoxysilane, δ-methacryloxybutyltriethoxysilane, δ-methacryloxybutyl(methyl)dimethoxysilane, δ-methacryloxybutyl(dimethyl)m-1-xysilane, bis(methacryloxymethyl)dis-l-xysilane, bis (methacryloxymethyl)jethoxysilane, bis(methacryloxyethyl)dimethoxysilane, bis(methacryloxyethyl)jethoxysilane, bis(methacryloxypropyl)dimethoxysilane, bis(methacryloxypropyl)die)-xysilane, tris( (methacryloxymethyl) methoxysilane, 1-soot (methacryloxyethyl)
Examples include 1-xysilane, tris(methacryloxyethyl)methoxysilane, 1-lis(methacryloxyethyl)ethoxysilane, 1-lis(methacryloxypropyl)methoxysilane, and tris(methacryloxypropyl)ethoxysilane.
(メタ)アクリロキシ基含有アルコキシシランの加水分
解物は、上記のにうな(メタ)アクリロキシ基含有アル
コキシシランのアルコキシ填めるいはアルコキシアルコ
キシ基の一部または全部が水酸基に置換されたものおよ
び@換された水f[4同志が一部結合したものを含lυ
でいる。これらの加水分前物は、公知のように、例えば
純水または塩酸などの酸性水溶液を添加、1党拌するこ
とににって製造される。Hydrolysates of (meth)acryloxy group-containing alkoxysilanes include those in which a part or all of the alkoxy-filled or alkoxyalkoxy groups of the above-mentioned (meth)acryloxy group-containing alkoxysilanes are substituted with hydroxyl groups, and water f[including those in which 4 comrades are partially combined lυ
I'm here. These hydrolyzed preforms are produced, as is known, by adding pure water or an acidic aqueous solution such as hydrochloric acid and stirring the mixture.
このにうな(メタ)アクリロキシ基含有アルコキシシラ
ンの加水分解物は、単独でおるいは2種以上を組合ぜて
用いてもよい。この(メタ)アクリロキシ基含有アルコ
キシシランは、通常コーティング組成物中に固形分換算
で2〜40重間%、好ましくは3〜35重辺%含まれる
。すなわち、2重量%未満であると、得られろ合成樹脂
成形品において硬化膜と基材樹脂との密着性が十分とな
らず、一方、40重D%を超える場合には、製造時に基
材樹脂と鋳型との剥離不良が発生し外観の良好な合成樹
脂成形品が17られない虞れがあるためである。These (meth)acryloxy group-containing alkoxysilane hydrolysates may be used alone or in combination of two or more. This (meth)acryloxy group-containing alkoxysilane is usually contained in the coating composition in an amount of 2 to 40% by weight, preferably 3 to 35% by weight in terms of solid content. That is, if it is less than 2% by weight, the adhesion between the cured film and the base resin will not be sufficient in the resulting synthetic resin molded product, while if it exceeds 40% by weight, the base material will not be adhered to during production. This is because there is a risk that defective peeling between the resin and the mold may occur and a synthetic resin molded product with a good appearance may not be produced.
またコーティング組成物中に含まれるシリカゾルとは、
分散媒、たとえば水またはアルコールなどの有機分散媒
に、無水ケイ酸の微粒子、好ましくは粒径1〜100ミ
リミクロンの微粒子を分散させたコロイド溶液であり、
周知の方法で製造され市販されているものである。なお
シリカゾルにおける固形分は全型口の20〜40%程度
でおる。In addition, the silica sol contained in the coating composition is
It is a colloidal solution in which fine particles of silicic anhydride, preferably fine particles with a particle size of 1 to 100 millimicrons, are dispersed in a dispersion medium, for example, an organic dispersion medium such as water or alcohol.
It is manufactured by a well-known method and is commercially available. The solid content in the silica sol is approximately 20 to 40% of the total mold opening.
このシリカゾルは通常コーティング組成物中に固形分換
算で10〜70重M%、好ましくは20〜65重ω%含
有される。すなわち10重吊上未満であると、得られる
合成樹脂成形品の耐摩耗性(特にテーパー摩耗)の向上
が十分なものとはならずまtこ耐候性もにりなく、一方
70重但亢奮亀える場合には、製造時におけろ成膜が七
分になされない虞れがあるためである。This silica sol is usually contained in the coating composition in an amount of 10 to 70 wt M%, preferably 20 to 65 wt M%, in terms of solid content. In other words, if the lifting weight is less than 10 times, the abrasion resistance (especially taper wear) of the resulting synthetic resin molded product will not be sufficiently improved, and the weather resistance will also be poor. This is because if there is a problem, there is a possibility that the film formation will not be completed completely during manufacturing.
また本発明の合成樹脂成形品を製造するのに用いられる
」−ティング組成物中には、上記の(メタ)アクリロキ
シ基含有アルコキシシランの加水分解物およびシリカゾ
ル成分の伯に、任意のその他のアルコキシシランの加水
分解物が含まれている。In addition, in the coating composition used for producing the synthetic resin molded article of the present invention, in addition to the hydrolyzate of the (meth)acryloxy group-containing alkoxysilane and the silica sol component, any other alkoxysilane may be added. Contains silane hydrolyzate.
その他のアルコキシシランの加水分解物としては、例え
ば一般式(It)
R1゜−3i (OR5) 4−Q (II
)(イロし式中R4は、炭素数1〜6の同じまたは異な
るアルキル、シクロアルキル、アルケニル、)工二ルあ
るいはこれらのハロゲン、アミン、エポキシ、グリシド
、グリシジル、メルカプ1ヘナどの首換体であり、R5
は炭素@1〜5、好ましくは1〜4の同じまたは異なる
アルキル、アルコキシアルキルであり、まはqはO〜3
の整数である。)で表わされる化合物の加水分iff物
がある。一般式11で表わされる化合物としては、具体
的には、1〜リメチルメ1−キシシラン、ジメチルジメ
トキシシラン、メチルトリメトキシシラン、テトラブト
キシシラン、テトラブトキシシラン、テトラプロポキシ
シラン、テトラブトキシシラン、メチルトリエトキシシ
ラン、ジメチルジメトキシシラン、1〜リメチルエトキ
シシラン、フェニル1へリエトキシシラン、シフェニル
ジエ1〜キシシラン、フェニル(メチル)ジェトキシシ
ラン、ビニル1〜リエトキシシラン、ビニル(メチル)
トリエトキシシラン、ビニルトリス(β−メトキシエト
キシ)シラン、γ−クロロプロピル1〜リメ)・キシシ
ラン、γ、γ。Other hydrolysates of alkoxysilanes include, for example, general formula (It) R1゜-3i (OR5) 4-Q (II
) (In the formula, R4 is the same or different alkyl having 1 to 6 carbon atoms, cycloalkyl, alkenyl,) engineering or a substituted derivative thereof such as halogen, amine, epoxy, glycide, glycidyl, mercap 1 henna, etc. , R5
is the same or different alkyl, alkoxyalkyl of carbon@1 to 5, preferably 1 to 4, or q is O to 3
is an integer. ) There is a hydrolyzed product of the compound represented by Specific examples of the compound represented by the general formula 11 include 1-lymethylmethoxysilane, dimethyldimethoxysilane, methyltrimethoxysilane, tetrabutoxysilane, tetrabutoxysilane, tetrapropoxysilane, tetrabutoxysilane, and methyltriethoxysilane. Silane, dimethyldimethoxysilane, 1-limethylethoxysilane, phenyl-1-helyethoxysilane, cyphenyldie-1-xysilane, phenyl(methyl)jethoxysilane, vinyl 1-ethoxysilane, vinyl(methyl)
Triethoxysilane, vinyltris(β-methoxyethoxy)silane, γ-chloropropyl 1-rime) xysilane, γ, γ.
γ−1−リフルオロプロピルトリメトキシシランγーメ
ルカプトプロピルトリメトキシシランーアミノプロピル
トリエトキシシラン、N−β−(アミノエチル)−γー
アミノプロピル1ーリメトキシシラン、N−ビス(β−
ヒドロキシエチル)−γー7ミノブロピルトリエトキシ
シラン、N−β−(アミノエチル)−γーアミノプロピ
ル(メチル)ジス1〜キシシラン、γーグリシドキシプ
ロピル1〜リメトキシシラン、γ−グリシドキシブロピ
ル1−リエトキシシラン、γ−グリシドキシプロピル(
メトキシエトキシ)シラン、γ−グリシジルプロピルト
リエトキシシラン、3.4−エポキシシクロへキシルプ
ロピルトリメトキシシランなどが含まれる。γ-1-Lifluoropropyltrimethoxysilane γ-mercaptopropyltrimethoxysilane-aminopropyltriethoxysilane, N-β-(aminoethyl)-γ-aminopropyl-1-rimethoxysilane, N-bis(β-
hydroxyethyl)-γ-7 minopropyltriethoxysilane, N-β-(aminoethyl)-γ-aminopropyl(methyl)dis1-xysilane, γ-glycidoxypropyl1-rimethoxysilane, γ-glycidoxy Bropyl 1-ethoxysilane, γ-glycidoxypropyl (
methoxyethoxy)silane, γ-glycidylpropyltriethoxysilane, 3,4-epoxycyclohexylpropyltrimethoxysilane, and the like.
その他のアルコキシシランの加水分m物は(メタ)アク
リロキシ基金イ1アルコキシシランの110水分解物の
場合と同様、上記のごとき有[1含有アルコキシシラン
のアルコキシ基あるいはアルコキシアルコキシ基の一部
または全部が水酸基に置換されたものおよび置換されr
こ水酸基同志が一部縮合したものを含んでいる。これら
の加水分解物は公知のように、例えば純水または塩酸な
どの酸性水溶液を添加、撹拌することによって製造され
る。Other hydrolyzed m-products of alkoxysilanes include (meth)acryloxy groups, as in the case of the 110-hydrolyzate of alkoxysilanes, as described above. is substituted with a hydroxyl group and substituted r
Contains some hydroxyl groups condensed together. These hydrolysates are produced, as is known, by, for example, adding pure water or an acidic aqueous solution such as hydrochloric acid and stirring.
このようなその他のアルコキシシランの加水分解物は、
単独であるいは2種以上を組合せて用いてもにい。その
他のアルコキシシランの加水分解物は、固形分換算で通
常コーティング組成物中に10〜88重量%、好ましく
は15〜70川但%含まれる。この範囲から外れるとい
ずれもコーチインク組成物中の(メタ)アクリロキシ基
含有アルコキシシランの加水分解物の作用を阻害してし
まう虞れがあるためである。しかして(メタ)アクリロ
キシ基含有アルコキシシラン、シリカゾルおよびその他
のアルコキシシランの合計徂は、コーティング組成物の
固形分換算で100重最%となる。These other alkoxysilane hydrolysates are
Can be used alone or in combination of two or more. The hydrolyzate of other alkoxysilanes is usually contained in the coating composition in an amount of 10 to 88% by weight, preferably 15 to 70% by weight in terms of solid content. This is because if it deviates from this range, the effect of the hydrolyzate of the (meth)acryloxy group-containing alkoxysilane in the coach ink composition may be inhibited. Therefore, the total amount of the (meth)acryloxy group-containing alkoxysilane, silica sol, and other alkoxysilanes is 100% by weight in terms of the solid content of the coating composition.
上記のコーティング組成物の硬化にあっては、硬化を促
進する目的で各種の硬化剤が使用できる。In curing the above coating composition, various curing agents can be used for the purpose of accelerating curing.
これらの硬化剤としては、例えば、過塩素酸アンモニウ
ム、過塩素酸、塩酸、硝酸、リン的、硫酸、スルホン酸
、パラトルエンスルボン酸、三フッ化ホウ素及びその電
子供与体との錯体、5nC14、ZnC1z 、FeC
l3、AlCl3.5bC1s 、T ! CI 4な
どのルイス酸およびその錯体、酢酸ナトリウム、ナフテ
ン酸亜鉛、ナフテン酸コバルト、オクチル酸スズ、オク
チル酸スズ等の有機酸金属塩、ホウフッ化亜鉛、ホウフ
ッ化スズ等のホウフッ化金属塩類、ホウ酸エチル、ホウ
酸メチル等のホウ酸有機ニスデル類、水酸化ナトリウム
、水酸化カリウム等のアルカリ類、テl〜ラブドキシチ
タン、テトライソプロポキシチタン等のチタネートエス
テル類、グロムアセチルアセトネー1−、チタニルアセ
チルアセト、ネー1−、アルミニウムアセチルアセトネ
−1・、コバルトアセチルアセトネート、ニツケルアセ
チルアセトネ−1・等の金属アセチルアセトネ−1・類
、n−ブチルアミン、ジ−n−ブチルアミン、1〜リー
n−ブチルアミン、グアニジン、ビグアニド、イミダゾ
ール等のアミン類等が挙げられる。これらの硬化剤のう
ち特に好ましくは、トリーローブチルアミンなどのよう
なアミン系硬化剤である。Examples of these curing agents include ammonium perchlorate, perchloric acid, hydrochloric acid, nitric acid, phosphoric acid, sulfuric acid, sulfonic acid, paratoluenesulfonic acid, boron trifluoride and its complex with an electron donor, 5nC14 , ZnC1z, FeC
l3, AlCl3.5bC1s, T! Lewis acids and their complexes such as CI 4, metal salts of organic acids such as sodium acetate, zinc naphthenate, cobalt naphthenate, tin octylate, tin octylate, metal salts of fluoroborates such as zinc borofluoride and tin borofluoride, boron Boric acid organic Nisderates such as ethyl acid and methyl borate, alkalis such as sodium hydroxide and potassium hydroxide, titanate esters such as tel~rhabdoxytitanium and tetraisopropoxytitanium, glomoacetylacetonate 1-, Titanylacetylacetonate, aluminum acetylacetonate-1, metal acetylacetonates such as cobalt acetylacetonate, nickel acetylacetonate-1, n-butylamine, di-n-butylamine, 1 Examples include amines such as n-butylamine, guanidine, biguanide, and imidazole. Among these curing agents, amine curing agents such as trilobylamine are particularly preferred.
またこのコーティング組成物は、使用に際して、通常は
塗布に適した濃度に希釈される。用いられる溶剤として
は、アルコール類、ケ1−ン類、エーテル類、セロソル
ブ類、エステル類、ハロゲン化物、カルボン酸類、芳香
族化合物類、脂肪族炭化水素類などを挙げろことができ
、これらは1種または2種以上の混合物として用いるこ
とができろ。In addition, the coating composition is usually diluted to a concentration suitable for application before use. Examples of solvents that can be used include alcohols, ketones, ethers, cellosolves, esters, halides, carboxylic acids, aromatic compounds, aliphatic hydrocarbons, etc. It can be used as a species or a mixture of two or more.
これらの溶剤のうち特に好ましくは、メタノール、エタ
ノール、n−プロパツール、イソプロパツール、n−ブ
タノール、5ec−ブタノール、tert −ブタノー
ルなどの低級アルコール類、メチルセロソルブ、エチル
セロソルブ、ブチルセロソルブなどのセロソルブ類、ギ
酸、酢酸、プロピオン酸、酪Mなどの低級カルボン酸類
、トルエン、キシレンなどのような芳香族化合物類、酢
酸エチル、酢酸ブチルなどのようなエステル類の1種ま
たは2種以上の混合物である。Among these solvents, particularly preferred are lower alcohols such as methanol, ethanol, n-propatool, isopropatool, n-butanol, 5ec-butanol, and tert-butanol, and cellosolves such as methyl cellosolve, ethyl cellosolve, and butyl cellosolve. , lower carboxylic acids such as formic acid, acetic acid, propionic acid, butylene M, aromatic compounds such as toluene, xylene, etc., and esters such as ethyl acetate, butyl acetate, etc., or a mixture of two or more thereof. .
ざらにコーティング組成物中には、必要に応じて、IJ
JA人面の摩擦係数向上のためにレベリング剤を添加す
ることができろ。レベリング剤としては、市販の、例え
ば住友スリーエム製 FC−431(商品名)のような
フッ素系界面活性剤や、1・−レシリコーン社¥’!4
SH−28(商品名〉のようなシリコーン系界面活性剤
などを用いることができる。これらのレベリング剤の添
加量は少退で十分であり、組成物全体に対し0.01〜
5重遣%程度でよい。In the coating composition, if necessary, IJ
Is it possible to add a leveling agent to improve the friction coefficient of JA's face? As a leveling agent, a commercially available fluorine-based surfactant such as FC-431 (trade name) manufactured by Sumitomo 3M, or 1.-Resilicone Company ¥'! 4
A silicone surfactant such as SH-28 (trade name) can be used.The amount of these leveling agents added may be small, and it is sufficient to add 0.01 to 100% of the total composition.
Approximately 5% weight is sufficient.
また、コーティング組成物中に、紫外線吸収剤や酸化防
止剤などの劣化防止剤、顔料や染料などの4色剤、アル
ミナゾル、グラファイト、ガラス繊維、炭素繊維などの
充填剤を含有させることは任意である。Furthermore, it is optional to include anti-deterioration agents such as ultraviolet absorbers and antioxidants, four-color agents such as pigments and dyes, and fillers such as alumina sol, graphite, glass fiber, and carbon fiber. be.
一方、このようなコーティング組成物由来の硬化膜を表
面にイ」与される基材樹脂としては、一般に鋳込重合可
能な合成樹脂であれば特に限定されないが、アクリル系
樹脂1、アリルジグリコールカーボネートおよびスチレ
ン系樹脂などが好ましく特にメチルメタクリレートL4
i独但含体、メチルメタクリレートを主成分とする他の
共重合し得る単m体との共重合体およびt’cR−39
Jとして知られるジエヂレングリコールビスアリルカー
ボネートが好ましい。従って本発明の合成樹脂成形品の
製造に用いられる基材樹脂原料としては上記のごとき合
成樹脂の常圧で液状の鋳込重合可能な単量体または部分
重合体が用いられる。例えばアクリル系合成樹脂の場合
、メチル(メタ)アクリレートなどのようなアルキル(
メタ)アクリレート単独もしくは2種以上のアルキルく
メタ)アクリレートの混合物またはアルキル(メタ)ア
クリレートを主成分とする他の共重合し得る単量体、例
えばヒドロキシ(メタ〉アクリレート、(メタ〉アクリ
ル酸、(メタ)アクリルM塩、塩化ビニル、酢酸ビニル
、(メタ)アクリロニトリル、(メタ)アクリルアミド
、スチレン、α−メチルスチレン、ビニルトルエン、無
水マレインM等との混合物あるいはこれらの部分重合体
などが基材樹脂原料となる。On the other hand, the base resin on which the cured film derived from such a coating composition is applied is not particularly limited as long as it is a synthetic resin that can generally be cast polymerized, but acrylic resin 1, allyl diglycol, etc. Carbonate and styrene resins are preferred, especially methyl methacrylate L4.
A copolymer with other copolymerizable monomers containing methyl methacrylate as a main component, and t'cR-39
Diethylene glycol bisallyl carbonate, known as J, is preferred. Therefore, as the base resin raw material used in the production of the synthetic resin molded article of the present invention, monomers or partial polymers of the above-mentioned synthetic resins that can be cast in a liquid state at normal pressure are used. For example, in the case of acrylic synthetic resin, alkyl (meth)acrylate, etc.
meth)acrylate alone or a mixture of two or more alkyl(meth)acrylates or other copolymerizable monomers based on alkyl(meth)acrylates, such as hydroxy(meth)acrylate, (meth)acrylic acid, The base material is a mixture with (meth)acrylic M salt, vinyl chloride, vinyl acetate, (meth)acrylonitrile, (meth)acrylamide, styrene, α-methylstyrene, vinyltoluene, maleic anhydride M, etc., or a partial polymer thereof. It becomes a raw material for resin.
基材樹118原ス31の重合開始△11としては、油溶
性の過酸化物、アゾ化合部のような公知のラジカル重合
開始剤が一般に使用可能でおる。また、必要に応じて、
可塑剤、難燃化剤、着色剤、紫外線吸収剤などの助剤ま
たは添加剤を基材樹脂原料中に添加することも可能でお
る。As the polymerization initiation Δ11 of the base material tree 118 and raw material 31, a known radical polymerization initiator such as an oil-soluble peroxide or an azo compound can generally be used. Also, if necessary,
It is also possible to add auxiliary agents or additives such as plasticizers, flame retardants, colorants, ultraviolet absorbers, etc. to the base resin raw material.
本発明の合成樹脂成形品は、上記のごときコーティング
組成物および基材樹11u原わ1を用いて、例えば以下
のようにして製造される。The synthetic resin molded article of the present invention is manufactured, for example, in the following manner using the coating composition described above and the base material tree 11u raw material 1.
まず上記のごときコーティング組成物が、例えばステン
レス鋼、無機ガラス板などにより組立てられる通常用い
られる鋳型の内面となる部位へ刷毛塗り、スプレー、ロ
ールコータ−などの適当な手段で、泡やムラのないよう
に均一に塗布される。First, the coating composition as described above is coated onto the inner surface of a commonly used mold made of stainless steel, inorganic glass plates, etc., using an appropriate method such as brushing, spraying, or using a roll coater to prevent bubbles or unevenness. It is applied evenly.
この際、コーティング組成物の鋳型の内面となる部位へ
の塗布は、かならずしも内面仝而に対して行なう必要は
なく、例えば片面のみ高い耐摩耗性を有する樹脂成形品
を得ようとする場合には、相当する鋳型の一内面にコー
ティング組成物を塗布すれば足りる。次に100’〜1
20℃で5〜10分間程度加熱乾燥さt!鋳型の内面と
なる部位に0.003〜0.03mm、好ましくは0.
005〜0.02…mの厚さの薄膜を形成する。次に、
少なくとも一内面に薄膜を形成さけた該鋳型を組立て、
その間に上記のごとき基材樹脂原料と重合Un始剤との
混合物を注入する。基材樹脂原料を常法により重合さ「
た後、鋳型から成形品を剥離すると、鋳型から移行した
硬化膜がその表面に付着した合成樹脂成形品が得られる
。At this time, it is not always necessary to apply the coating composition to the inner surface of the mold; for example, when trying to obtain a resin molded product with high wear resistance on only one side, , it is sufficient to apply the coating composition to one inner surface of the corresponding mold. Next 100'~1
Dry by heating at 20℃ for about 5 to 10 minutes! A thickness of 0.003 to 0.03 mm, preferably 0.03 mm, is applied to the inner surface of the mold.
A thin film having a thickness of 0.005 to 0.02...m is formed. next,
Assembling the mold in which a thin film is formed on at least one inner surface,
During this time, a mixture of the base resin raw material and the polymerization initiator as described above is injected. The base resin raw material is polymerized by a conventional method.
After that, when the molded product is peeled from the mold, a synthetic resin molded product with the cured film transferred from the mold attached to its surface is obtained.
このようにして製造される本発明の合成樹脂成形品は、
上記のごときコーティング組成物由来の硬化膜、望まし
くは0.003〜0.03mm1’f−さの硬化膜が基
材樹脂表面に強く密着しており、この硬化膜によりその
表面の耐擦傷性は著しく改善されており、長時間曝露後
においても耐擦傷性、密着性等にほとんど変化は見られ
ず耐候性も良好なものである。またこの表面は、小皺、
凹凸などの外観不良もなく、鋳型の表面を完全に写しと
ることができ、鋳型からの取外しも容易である。The synthetic resin molded product of the present invention produced in this way is
A cured film derived from the above coating composition, preferably a 0.003 to 0.03 mm 1'f-thick cured film, adheres strongly to the base resin surface, and this cured film improves the scratch resistance of the surface. It has been significantly improved, and even after long-term exposure, there is almost no change in scratch resistance, adhesion, etc., and weather resistance is also good. This surface also has fine wrinkles,
There are no appearance defects such as unevenness, the surface of the mold can be completely copied, and it is easy to remove from the mold.
(実施例)
以下、実施例を挙げて本発明をさらに具体的に説明する
。(Example) Hereinafter, the present invention will be described in more detail with reference to Examples.
なお実施例および比較91により得られた合成樹脂成形
品の性能は以下の方法によって調べられた。The performance of the synthetic resin molded products obtained in Examples and Comparative No. 91 was examined by the following method.
密着性
密着性は基盤目試験により行ない、剥離しない部分の割
合を%で示した。Adhesion Adhesion was determined by a base plate test, and the percentage of the area that did not peel off was expressed as a percentage.
肚鼠監U
耐擦傷性は、試験片の表面に#OOOのスチールウール
の治具を一定?+Fi重(100[J/Cll1)下で
押しく−1り一定速回で50回往(すさせ1察傷前後の
曇価の差を摩耗値とした。なお曇価は次の式によって表
わされろ。肚鼠控 U Is the scratch resistance constant by using #OOO steel wool jig on the surface of the test piece? Press under +Fi weight (100 [J/Cll1) -1 at a constant speed 50 times (slip) The difference in haze value before and after 1 scratch was taken as the abrasion value.The haze value is expressed by the following formula. Let's go.
耐候性 耐候性試験は紫外線曝露試験機(東洋精機製。Weatherability The weather resistance test was performed using an ultraviolet exposure tester (manufactured by Toyo Seiki).
ALTAS −UVC0N )湿制50°C415間→
70℃ 紫外線曝露のみ8時間の丈イクルで700時間
実施し、外貌、密着性、i4擦傷性を試験した。ALTAS -UVC0N) Humidity control 50°C 415 →
Exposure to ultraviolet rays at 70° C. was carried out for 700 hours at an 8-hour cycle, and appearance, adhesion, and i4 scratch resistance were tested.
実施例1
メチル11〜キシシラン45重但部、γ−メタクリロキ
シプロピル1〜リメ1〜キシラン5重M部、メタノール
シリカゾル50重w部(いずれも固形分換算)を有する
固形分20%含有コーティング組成物をガラス板の片面
にアプリケーターで表面薄膜の厚みが0.005111
1nになるように均一に塗!5し、A゛−アン中で12
0’Cで5分間1損v!、乾燥の後、2枚のガラスを表
面薄膜が内側となるように対向さけ、その間にアゾイソ
ブチロニトリル0.5唄徂%を含むメククリル酸メチル
部分重合体を注入し、周囲を軟質塩化ビニル製ガスケッ
トで封じ、樹脂板が5mm厚になるように型ガラスの間
隔を調整し、60℃で8時間、次いで120’Cで2時
間加熱重合させた。冷却後ガラス板から得られた重合樹
脂板を剥離すると、表面薄膜は完全にメタクリル樹脂板
の方に移行し、かつ表面に凹凸がなく光学歪のないきれ
いな表面を有する樹脂板が得られた。この樹脂板の密着
性を測定したところ100%密着しており、また耐摩耗
性を測定した結果、このようなコーティングを行なって
いないメタクリル樹脂板の摩耗値が19%であるのに対
し、本実施例の樹脂板の摩耗値はO−0,1%であり、
はとんど信のつかない状態であった。また耐候性試験の
結果、外観に異常はなく、密着性100%、摩耗性O%
と密着性、耐擦傷性共に性能低下は見られず、市販品(
例えば成形品塗布方式によるシリコン系コーティングに
お1プる性能低下は0.5〜1%、成形品塗布方式によ
るアクリル系コーティングでは5〜10%、型塗布方式
によるアクリル系コーティングでは1〜2%程度でめっ
た。)に対し優れた耐候性を示した。Example 1 Coating composition containing 20% solids containing 11 methyl to 45 parts of xysilane, 1 to 1 part of γ-methacryloxypropyl to 5 parts of xylan, and 50 parts by weight of methanol silica sol (all calculated as solid content) Apply the material to one side of the glass plate with an applicator until the thickness of the surface thin film is 0.005111.
Apply evenly to 1n! 5 and 12 in A-an
1 loss for 5 minutes at 0'C! After drying, two pieces of glass were placed facing each other so that the surface thin film was on the inside, and a methyl meccrylate partial polymer containing 0.5% azoisobutyronitrile was injected between them to soften the surrounding area. The resin plate was sealed with a vinyl gasket, the distance between the mold glasses was adjusted so that the resin plate had a thickness of 5 mm, and polymerization was carried out by heating at 60° C. for 8 hours and then at 120° C. for 2 hours. When the obtained polymeric resin plate was peeled from the glass plate after cooling, the surface thin film was completely transferred to the methacrylic resin plate, and a resin plate was obtained that had a clean surface with no irregularities and no optical distortion. The adhesion of this resin plate was measured and it was found to be 100% adhered, and the abrasion resistance of the methacrylic resin plate without such coating was 19%, whereas this The abrasion value of the resin plate in the example is O-0.1%,
was in an almost unbelievable state. In addition, as a result of the weather resistance test, there was no abnormality in appearance, adhesion was 100%, and abrasion resistance was 0%.
There was no performance deterioration in both adhesion and scratch resistance, compared to commercially available products (
For example, the drop in performance for silicone coatings applied to molded parts is 0.5 to 1%, 5 to 10% for acrylic coatings applied to molded parts, and 1 to 2% for acrylic coatings applied by mold application. I was pretty disappointed. ) showed excellent weather resistance.
実施例2〜5および比較例1〜4
実施例1と同様にして第1表で示す配合のコーティング
組成物を用いて、樹脂板を製迄した。得られた樹脂板の
性能を実施例1と同様に調べた。Examples 2 to 5 and Comparative Examples 1 to 4 Resin plates were manufactured in the same manner as in Example 1 using coating compositions having the formulations shown in Table 1. The performance of the obtained resin plate was examined in the same manner as in Example 1.
実施例2〜4では、表面薄膜は完全にメタクリル樹脂板
の方に移行し、かつ表面に凹凸がなく、光学歪のないき
れいな表面を有する樹脂板が得られ、また第1表に示す
結果からも明らかなように、密蜜着性100%、摩耗性
Q%であった。これに対し第1表から明らかなように、
比較例1,3ではでは薄膜の密着性が得られず、比較例
2では表面薄膜は1#I脂仮に移行するもののテーパー
摩耗値が高く、耐候性試験ではクラックが発生し、そし
て比較ll944では成膜できないなどいずれも満足な
合成樹脂成形品を得ることはできなかった。In Examples 2 to 4, the surface thin film was completely transferred to the methacrylic resin plate, and resin plates with no unevenness and a clean surface without optical distortion were obtained, and from the results shown in Table 1. As is clear, the adhesiveness was 100% and the abrasion resistance was Q%. On the other hand, as is clear from Table 1,
In Comparative Examples 1 and 3, the adhesion of the thin film could not be obtained, in Comparative Example 2, the surface thin film was transferred to 1#I oil but had a high taper wear value, and cracks occurred in the weather resistance test, and in Comparative ll944. In all cases, it was not possible to obtain a satisfactory synthetic resin molded product due to the inability to form a film.
実施例6
実施例1に示すコーディング組成物を、眼鏡レンズ用ガ
ラス型の片面にスプレー法で表面薄膜の厚みが0.00
5mtnになるように均一に塗イロし、オーブン中で1
00’Cで5分間加熱乾燥の後、オス・メス2枚のガラ
ス型を表面薄膜が内側となるように対向させてガスケッ
トにより所望の間隔に組立て、その間にジイソプロピル
パーオキシジカーボネ−1−(IPP)3.0%を含む
ジエチレングリコールごスアリルカーボネート単層体(
PPG社rcR−39J )を注入し、電気炉中で徐々
に100’Cまで温度を上昇させ、18時間かけて重合
を完了させた。冷却後離型して得られたレンズは、表面
薄膜が完全にレンズ表面に移行し、表面が型形状を十分
に転写し、光学特性にすぐれ、スチールウール摩擦でも
傷のつかない良好なレンズが1qられた。Example 6 The coating composition shown in Example 1 was sprayed onto one side of a glass mold for eyeglass lenses until the thickness of the surface thin film was 0.00.
Apply it evenly to a thickness of 5 mtn and heat it in the oven for 1 minute.
After heating and drying at 00'C for 5 minutes, assemble two male and female glass molds facing each other with the thin surface film on the inside at the desired spacing using gaskets. (IPP) monolayer of diethylene glycol and sallyl carbonate containing 3.0% (
PPG Corporation rcR-39J) was injected, the temperature was gradually raised to 100'C in an electric furnace, and polymerization was completed over 18 hours. In the lenses obtained by releasing the mold after cooling, the thin film on the surface completely transfers to the lens surface, the surface sufficiently transfers the shape of the mold, and the lens has excellent optical properties and does not get scratched even by friction with steel wool. I was given 1q.
(以下余白)
遭L−二L−j袈
実施例2 実施例3 実施例4 実施例5
ユユヱヱ2り曵盛換徂店(固形分換算 重量%)シリカ
ゾル
シリカゾル
メナルエチルケトンシリ力ゾル:触媒化成型 固形分3
0% 粒径10〜20mμ比較例1 比較例2
比較例3 比較例4− 0.1
− −一 膜クラツク発生 −−
:メチルトリエトキシシラン。(Leaving space below) Encounter L-2 L-j kesa Example 2 Example 3 Example 4 Example 5
Silica sol Menal ethyl ketone Silica sol: Catalytic molding Solid content 3
0% Particle size 10-20mμ Comparative example 1 Comparative example 2
Comparative example 3 Comparative example 4- 0.1
− −1 Membrane crack occurrence −−: Methyltriethoxysilane.
(発明の効果)
以上述べたように本発明は、(メタ)アクリロキシ基含
有アルコキシシランの加水分解物およびシルカゾルを含
有するコーティング組成物を、鋳型の少なくとも一内面
に塗布し、あらかじめ加熱乾燥して薄膜を形成したのち
、基材樹脂原料を鋳型に注入し、重合を行なって成形さ
れる、少なくとも一表面が上記コーティング組成物由来
の硬化膜により被覆されていることを特徴とする合成樹
脂成形品であるから、曝露後の耐擦傷性、密着性の低下
ちなく、耐i9傷性、外観性および耐候性に優れた製品
である。従って、本発明により、例えば自動車用グレー
ジング(はめ込み窓)および外装部品、屋外各種カバー
類、建築用グレージングおよびドームなどに対し粉塵な
どの衝突によるキズの発生あるいは清掃ないし洗車時な
どのモツプ、ワイパー等によるキズの発生を抑え長期間
透明性あるいは光沢を維持した合成樹脂成形品を提供で
きる。さらに、眼鏡レンズ、カメラレンズなどでは、特
に多焦点レンズなど複雑な形状に対しても、成形品への
硬化塗料の浸漬塗り、スプレー塗りなとて発生する塗り
ムラ、タレ、ブツなどの欠陥を解消して外観良好な製品
が得られるだけでなく、硬質膜をノアくできることによ
り耐すり酊、耐薬品、耐曲げクランク性などが大幅に改
勝てきる。また本発明の合成樹脂成形品は、何ら繁雑な
処理工程を必要とせず、一般的な鋳込重合法に若干の変
更を加えるのみで成形と同時に7&覆形成されるために
製造面においても有利である。(Effects of the Invention) As described above, the present invention applies a coating composition containing a hydrolyzate of a (meth)acryloxy group-containing alkoxysilane and silcasol to at least one inner surface of a mold, and heat-dries it in advance. A synthetic resin molded article characterized in that at least one surface is covered with a cured film derived from the coating composition, which is formed by forming a thin film, injecting a base resin raw material into a mold, and polymerizing it. Therefore, the product is excellent in i9 scratch resistance, appearance, and weather resistance without any deterioration in scratch resistance and adhesion after exposure. Therefore, according to the present invention, for example, scratches may occur on automobile glazing (inset windows), exterior parts, various outdoor covers, architectural glazing, domes, etc. due to collisions with dust, mops, wipers, etc. during cleaning or car washing. It is possible to provide a synthetic resin molded product that suppresses the occurrence of scratches and maintains transparency or gloss for a long period of time. In addition, for eyeglass lenses, camera lenses, etc., especially for complex shapes such as multifocal lenses, we can prevent defects such as uneven coating, sagging, and spots that occur when applying hardened paint to molded products by dipping or spraying. Not only can a product with a good appearance be obtained by removing the scratches, but by eliminating the hard film, the scratch resistance, chemical resistance, bending crank resistance, etc. can be greatly improved. In addition, the synthetic resin molded product of the present invention does not require any complicated processing steps, and is advantageous in terms of manufacturing because it can be formed simultaneously with molding by making slight changes to the general cast polymerization method. It is.
特許出願人 協和ガス化学工業株式会社特許出
願人 日本粘化株式会社代Patent applicant: Kyowa Gas Chemical Industry Co., Ltd. Patent applicant: Nippon Kika Co., Ltd.
Claims (3)
加水分解物およびシルカゾルを含有するコーティング組
成物を、鋳型の少なくとも一内面に塗布し、あらかじめ
加熱乾燥して薄膜を形成したのち、基材樹脂原料を鋳型
に注入し、重合を行なって成形される、少なくとも一表
面が上記コーティング組成物由来の硬化膜により被覆さ
れていることを特徴とする合成樹脂成形品。(1) A coating composition containing a hydrolyzate of a (meth)acryloxy group-containing alkoxysilane and silcasol is applied to at least one inner surface of a mold, and after being heated and dried in advance to form a thin film, a base resin raw material is applied. 1. A synthetic resin molded article, characterized in that at least one surface thereof is covered with a cured film derived from the above-mentioned coating composition, which is injected into a mold and molded by polymerization.
である特許請求の範囲第1項に記載の合成樹脂成形品。(2) The synthetic resin molded article according to claim 1, wherein the cured film has a thickness of 0.003 to 0.03 mm.
ーボネート樹脂またはスチレン系樹脂である特許請求の
範囲第1項に記載の合成樹脂成形品。(3) The synthetic resin molded article according to claim 1, wherein the base material is an acrylic resin, an allyl diglycol carbonate resin, or a styrene resin.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29621485 | 1985-12-27 | ||
JP60-296214 | 1985-12-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62231712A true JPS62231712A (en) | 1987-10-12 |
JPH069829B2 JPH069829B2 (en) | 1994-02-09 |
Family
ID=17830652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30762086A Expired - Fee Related JPH069829B2 (en) | 1985-12-27 | 1986-12-25 | Synthetic resin molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH069829B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5096626A (en) * | 1988-06-10 | 1992-03-17 | Asahi Kogaku Kogyo Kabushiki Kaisha | Process of molding a coated plastic lens |
WO2001021375A1 (en) * | 1999-09-21 | 2001-03-29 | Sola International Holdings Ltd | Method of forming a coated optical element |
US8003022B2 (en) | 1999-09-21 | 2011-08-23 | Carl Zeiss Vision Australia Holdings Limited | Method of forming a coated optical element |
-
1986
- 1986-12-25 JP JP30762086A patent/JPH069829B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5096626A (en) * | 1988-06-10 | 1992-03-17 | Asahi Kogaku Kogyo Kabushiki Kaisha | Process of molding a coated plastic lens |
WO2001021375A1 (en) * | 1999-09-21 | 2001-03-29 | Sola International Holdings Ltd | Method of forming a coated optical element |
US8003022B2 (en) | 1999-09-21 | 2011-08-23 | Carl Zeiss Vision Australia Holdings Limited | Method of forming a coated optical element |
Also Published As
Publication number | Publication date |
---|---|
JPH069829B2 (en) | 1994-02-09 |
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