JPS622297U - - Google Patents
Info
- Publication number
- JPS622297U JPS622297U JP9157685U JP9157685U JPS622297U JP S622297 U JPS622297 U JP S622297U JP 9157685 U JP9157685 U JP 9157685U JP 9157685 U JP9157685 U JP 9157685U JP S622297 U JPS622297 U JP S622297U
- Authority
- JP
- Japan
- Prior art keywords
- shield case
- wiring board
- printed wiring
- soldered
- soldering surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9157685U JPS622297U (pt) | 1985-06-19 | 1985-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9157685U JPS622297U (pt) | 1985-06-19 | 1985-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS622297U true JPS622297U (pt) | 1987-01-08 |
Family
ID=30647588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9157685U Pending JPS622297U (pt) | 1985-06-19 | 1985-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS622297U (pt) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004006973A (ja) * | 2003-08-01 | 2004-01-08 | Kitagawa Ind Co Ltd | 電磁波シールド構造及び電磁波シールド方法 |
| JP2010192756A (ja) * | 2009-02-19 | 2010-09-02 | Brother Ind Ltd | 通信装置、高周波回路装置、無線通信端末、並びにシールドケース装着方法 |
| JP2013532389A (ja) * | 2010-07-02 | 2013-08-15 | トムソン ライセンシング | 電子装置における接地のためのシステム |
-
1985
- 1985-06-19 JP JP9157685U patent/JPS622297U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004006973A (ja) * | 2003-08-01 | 2004-01-08 | Kitagawa Ind Co Ltd | 電磁波シールド構造及び電磁波シールド方法 |
| JP2010192756A (ja) * | 2009-02-19 | 2010-09-02 | Brother Ind Ltd | 通信装置、高周波回路装置、無線通信端末、並びにシールドケース装着方法 |
| JP2013532389A (ja) * | 2010-07-02 | 2013-08-15 | トムソン ライセンシング | 電子装置における接地のためのシステム |