JPS622249U - - Google Patents

Info

Publication number
JPS622249U
JPS622249U JP9371485U JP9371485U JPS622249U JP S622249 U JPS622249 U JP S622249U JP 9371485 U JP9371485 U JP 9371485U JP 9371485 U JP9371485 U JP 9371485U JP S622249 U JPS622249 U JP S622249U
Authority
JP
Japan
Prior art keywords
lead frame
island
subchip
semiconductor device
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9371485U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9371485U priority Critical patent/JPS622249U/ja
Publication of JPS622249U publication Critical patent/JPS622249U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5449Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9371485U 1985-06-20 1985-06-20 Pending JPS622249U (ca)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9371485U JPS622249U (ca) 1985-06-20 1985-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9371485U JPS622249U (ca) 1985-06-20 1985-06-20

Publications (1)

Publication Number Publication Date
JPS622249U true JPS622249U (ca) 1987-01-08

Family

ID=30651638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9371485U Pending JPS622249U (ca) 1985-06-20 1985-06-20

Country Status (1)

Country Link
JP (1) JPS622249U (ca)

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