JPS62224488A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPS62224488A JPS62224488A JP61067079A JP6707986A JPS62224488A JP S62224488 A JPS62224488 A JP S62224488A JP 61067079 A JP61067079 A JP 61067079A JP 6707986 A JP6707986 A JP 6707986A JP S62224488 A JPS62224488 A JP S62224488A
- Authority
- JP
- Japan
- Prior art keywords
- reflecting mirror
- laser
- laser light
- bend
- reflecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 17
- 238000005452 bending Methods 0.000 claims description 16
- 239000002184 metal Substances 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010330 laser marking Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
(産業上の利用分野)
本発明はレーザ加工装置に係り、特にレーザ光の光束を
整形する光学系に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser processing device, and particularly to an optical system for shaping a beam of laser light.
(従来の技術)
レーザ加工技術は多方面で実用化され目覚しい成果をあ
げている。印刷やけがきに代わシ、レーザ光を物体に照
射することで表面に傷をつけて行うレーザマーキング加
工もその一つである。レーザマーキング加工技術にはX
Y走査ミラーやXYテーブルを使ってレーザ光と被照射
物とを相対的に走査して行う方式と、所定のパターンを
切欠して形成したマスクを用い、パターンを通過したレ
ーザ光を結像して行う方式の二連シがある。前者の方式
ではYAG@の固体レーザが用いられ、後者では一般T
Fi A (Transversely Excit
ed Atomos−pherlc Pressure
)■2レーザが用いられている。(Conventional technology) Laser processing technology has been put into practical use in many fields and has achieved remarkable results. One example of such processing is laser marking, which involves scratching the surface of an object by irradiating it with laser light, instead of printing or marking. X for laser marking processing technology
One method uses a Y-scanning mirror or an XY table to scan the laser beam and the object to be irradiated relative to another, and the other uses a mask formed by cutting out a predetermined pattern to form an image of the laser beam that has passed through the pattern. There is a two-part method of doing this. The former method uses a YAG@ solid-state laser, while the latter uses a general T laser.
Fi A (Transversally Excit
ed Atomos-pherlc Pressure
) ■Two lasers are used.
この後者の方式における装置の一例を第2図を用いて説
明する。すなわち、(1)はT B A CO2レーザ
発撮装置1(以下、単にレーザ発振装置と略す)、(2
) 、 (3)は放出されたレーザ光(4)を反射して
被照射物(5)に向う光路に変える一対の反射fffl
、(6)は後段に位置する反射鏡(3)で反射された反
射光路に設けられて上記レーザ光(4)の光束を整形す
る光学系としてのシリンドリカルレンズ、(7)はマス
ク、(8)はマスク(7)を通過したレーザ光を集光す
る集光レンズである。上記の構成における問題点として
はレーザ光(4)の波長が10.6μmであるので、レ
ンズ系、すなわちンリンドリ力ルレンズ(6)は上記波
長を吸収してしまうガラスが使えず、KCl、 Zn5
e等の上記波長を吸収しにくい結晶材料にしなければな
らない点にある。これらの材料はガラスに比べて高価で
あるという価格上の問題もあるが、それ以上にこの種の
材料は吸湿性があシ、使用環境における湿度管理を厳し
くしないと透過率に変化をきたし、安定なレーザ加工が
実施できなくなるという問題も抱えていた。An example of a device using this latter method will be explained using FIG. 2. That is, (1) is T B A CO2 laser emission device 1 (hereinafter simply referred to as laser oscillation device), (2
), (3) are a pair of reflection fffl that reflect the emitted laser beam (4) and change it into an optical path toward the irradiated object (5).
, (6) is a cylindrical lens as an optical system that is installed in the reflected optical path reflected by the reflecting mirror (3) located at the rear stage and shapes the luminous flux of the laser beam (4), (7) is a mask, (8) ) is a condensing lens that condenses the laser beam that has passed through the mask (7). The problem with the above configuration is that the wavelength of the laser beam (4) is 10.6 μm, so the lens system, that is, the optical lens (6), cannot use glass that absorbs the above wavelength, so KCl, Zn5
The point is that a crystal material must be used that is difficult to absorb the above wavelengths such as e. There is a price problem in that these materials are more expensive than glass, but moreover, these materials tend to absorb moisture, and unless the humidity in the environment in which they are used is not strictly controlled, the transmittance will change. Another problem was that stable laser processing could not be performed.
(発明が解決しようとする問題点)
そこでこのような材料特性からくる不具合を解消し、レ
ーザ光の波長に影響されずにレーザ光束を整形する光学
系を備えたレーザ加工装置を提供することを目的とする
。(Problems to be Solved by the Invention) Therefore, it is an object of the present invention to provide a laser processing device that eliminates the problems caused by such material characteristics and is equipped with an optical system that shapes the laser beam without being affected by the wavelength of the laser beam. purpose.
(問題点を解決するための手段と作用)レーザ発振器と
このレーザ発振器力識ら放出されたレーザ光の光束を整
形する光学系を備えたレーザ加工装置において、光学系
を二つの反射平面によって180度未満の屈曲反射面に
形成された屈曲反射鏡とを上記レーザ光路上シリンドリ
カル反射鏡とで構成し、光透過性の素材を使った光学系
を極力省き管理上の煩雑を解消せしめたものである。(Means and effects for solving the problem) In a laser processing device equipped with a laser oscillator and an optical system that shapes the beam of laser light emitted from the laser oscillator, the optical system is connected to a 180-degree angle by two reflecting planes. It consists of a bending reflector formed on a bending reflection surface with a bending angle of less than 30 degrees and the above-mentioned laser beam path cylindrical reflector, eliminating the need for an optical system using a light-transmitting material as much as possible and eliminating management complications. be.
(実施例) 以下、実施例を示す第1図に基いて説明する。(Example) Hereinafter, an explanation will be given based on FIG. 1 showing an example.
なお、第2図と共通する部分には同一符号を付し説明は
省略する。すなわち、第1図において、レーザ発振装置
(1)から水平方向に放出されたレーザ光(4)の光路
には、この光路を水平方向でかつ直角に光路変換させる
屈曲反射tR翰が設置されている。Note that parts common to those in FIG. 2 are designated by the same reference numerals, and explanations thereof will be omitted. That is, in FIG. 1, a bending reflector tR is installed in the optical path of the laser beam (4) emitted horizontally from the laser oscillation device (1) to change the optical path horizontally and at right angles. There is.
この屈曲反射鏡(10は金属製の二つの反射平面(ll
a)。This bending reflector (10 is two metal reflective planes (ll
a).
(llb)によって180度未満の角度の屈曲平面に形
成したものである。この屈曲反射鏡(IQはその屈曲境
界線α2にレーザ光(4)を入光させ上記二つの反射平
面(lla)、(llb) K均等に撮υ分けて反射さ
せるようにレーザ光(4)に対峙している。また、屈曲
反射鏡(10)に対峙して同じく金属製のシリンドリカ
ル反射鏡(l■が設置されている。この設置においては
シリンドリカル反射鏡−はその稜線方°向を上記屈曲境
界線Uに対して直角方向に向けられている。以上の屈曲
反射鏡tUtおよびシリンドリカル反射鏡a3とでレー
ザ光の光束を整形する光学系が構成されている。シリン
ドリカル反射鏡α国で反射されたレーザ光はマスク(7
)、集光レンズ(8)を経て被照射物(5)に入光する
ように構成されている。(llb) formed into a bent plane with an angle of less than 180 degrees. This bending reflector (IQ) allows the laser beam (4) to enter its bending boundary line α2 and reflects the laser beam (4) equally between the two reflecting planes (lla) and (llb). In addition, a cylindrical reflector (1), also made of metal, is installed opposite the bending reflector (10). It is oriented in a direction perpendicular to the bending boundary line U.The above bending reflector tUt and the cylindrical reflector a3 constitute an optical system that shapes the luminous flux of the laser beam.Reflection at the cylindrical reflector α The emitted laser light is passed through a mask (7
), the light enters the irradiated object (5) through the condensing lens (8).
以上の構成において、レーザ光(4)は屈曲反射鏡QO
Iによって図中(a)方向に縮められ、さらに、シリン
ドリカル反射体(131で全体的に図中(b)方向に縮
められてほぼマスクパターン形状に轄形される。In the above configuration, the laser beam (4) is transmitted through the bending reflector QO
It is shrunk in the direction (a) in the figure by I, and further shrunk in the direction (b) in the figure as a whole by the cylindrical reflector (131) to almost have a mask pattern shape.
なお、上記実施例では屈曲反射鏡をあたかも二つの平面
反射鏡を組合せてつくるように記載したが、一つの平面
反射鏡を所定の角度に折曲して形成してもよい。さらに
屈曲反射鏡とシリンドリカル反射鏡との配置は上記実施
例と逆の配置にしても何ら作用は変らなる。なお、これ
ら光学系は一組に限らず複数組を配置しレーザ光の光束
を複数段に整形しても差し支えないものである。また、
レーザマーキング加工の例を示したが、焼入れ等の熱処
理等の加工に適用が可能である。In the above embodiments, the bending reflecting mirror is described as if it were made by combining two plane reflecting mirrors, but it may be formed by bending one plane reflecting mirror at a predetermined angle. Further, even if the arrangement of the bending reflector and the cylindrical reflector is reversed to that of the above embodiment, the effect will not change in any way. Note that these optical systems are not limited to one set, but a plurality of sets may be arranged to shape the beam of laser light into multiple stages. Also,
Although an example of laser marking processing is shown, it can be applied to processing such as heat treatment such as hardening.
レーザ光の光束を光透過性の材料でなく反射光学系で整
形するようにしたので価格、管理上の問題が解消され、
安定なレーザ加工が行えるようになった。Since the beam of laser light is shaped using a reflective optical system instead of using a transparent material, cost and management problems are solved.
Stable laser processing is now possible.
第1図は本発明の一実施例を示す構成図、第2図は従来
例を示す構成図である。
(1)・・・レーザ発振器、
α1・・・屈曲反射鏡、
α謙・・・シリンドリカル反射鏡。FIG. 1 is a block diagram showing an embodiment of the present invention, and FIG. 2 is a block diagram showing a conventional example. (1)... Laser oscillator, α1... Bent reflector, α-ken... Cylindrical reflector.
Claims (2)
レーザ光の光束を整形する光学系を備えたレーザ加工装
置において、上記光学系は二つの反射平面によって18
0度未満の角度の屈曲反射面に形成された屈曲反射鏡と
、シリンドリカル反射鏡とをレーザ光路上に配設して構
成されたことを特徴とするレーザ加工装置。(1) In a laser processing device equipped with a laser oscillator and an optical system that shapes the beam of laser light emitted from the laser oscillator, the optical system has two reflecting planes that
1. A laser processing device characterized in that a bent reflecting mirror formed on a bent reflecting surface having an angle of less than 0 degrees and a cylindrical reflecting mirror are disposed on a laser beam path.
の稜線とを互いに直角をなす向きにして配置したことを
特徴とする特許請求の範囲第1項記載のレーザ加工装置
。(2) The laser processing apparatus according to claim 1, wherein the bending boundary line of the bending reflector and the ridgeline of the cylindrical reflector are arranged at right angles to each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61067079A JPS62224488A (en) | 1986-03-27 | 1986-03-27 | Laser beam machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61067079A JPS62224488A (en) | 1986-03-27 | 1986-03-27 | Laser beam machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62224488A true JPS62224488A (en) | 1987-10-02 |
Family
ID=13334504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61067079A Pending JPS62224488A (en) | 1986-03-27 | 1986-03-27 | Laser beam machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62224488A (en) |
-
1986
- 1986-03-27 JP JP61067079A patent/JPS62224488A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4475787A (en) | Single facet wobble free scanner | |
US4606601A (en) | Single facet wobble free scanner | |
KR960013550A (en) | Optical devices for laser processing | |
KR970022404A (en) | Manufacturing method of liquid crystal display device using laser processing machine and the same machine | |
JPS5821714A (en) | Light flux divider | |
KR970028643A (en) | Photodetector | |
JP2577638B2 (en) | Laser marking method and apparatus | |
AU2826789A (en) | An optical system for laser marking | |
JPS60106686A (en) | Laser marking device | |
JPS62224488A (en) | Laser beam machine | |
KR20210131510A (en) | Apparatus for forming line beam | |
JPS6368288A (en) | Linear beam taking off device | |
JPH03127191A (en) | Optical scanner | |
JP3004625B2 (en) | High power laser beam splitter | |
JPS61249694A (en) | Laser beam machine | |
JPS61245989A (en) | Laser beam machine | |
JPH05228673A (en) | Laser beam machine | |
JPS58190918A (en) | Laser scanner | |
JP2002244059A (en) | Laser beam scanner | |
JPS61245990A (en) | Laser beam machine | |
JPS6037185Y2 (en) | Laser processing equipment | |
JP2504006Y2 (en) | Nitrogen laser excitation dye laser device | |
JPS5820413B2 (en) | hologram scanner | |
JP2004042076A (en) | Light source for machining | |
JPH055854A (en) | Laser beam scanning optical system |