JPS62220295A - Laser beam machine - Google Patents

Abstract

PURPOSE:To simultaneously perform a laser machining and a small hole drilling by providing a torch and rotary tool unit on a laser machining head and by fitting the rotary tool to the rotary tool unit freely attachably and detachably. CONSTITUTION:A laser light is projected onto the work of the above of a table 3 from the torch 9 by positioning the torch 9 at the prescribed position above the work of a die board, etc. The prescribed laser machining is simultaneously performed by feeding an assist gas. In case of a small bore hold drilling, a drill unit 20 is positioned by driving by moving adequately a table 3, saddle 6 and laser machining head 7. A small hole, etc. are pierced by a drill 21, etc. by rotating a main shaft 20a. By this working machine, there is no replacement of a work, so the total working time can be shortened and the work position accuracy of a small hole, etc. can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention relates to a laser processing machine that can perform laser processing and small diameter hole processing on a die board or the like to be processed in one step.

(b), Conventional technology Conventionally, with a laser processing machine, the process of drilling small diameter holes in the die board, etc. to be machined is through-circuiting. I set it up and went.

(C) 1. The problem that the invention attempts to solve However, in this case, the processing becomes two steps: laser processing using a laser processing machine and drilling of a small diameter hole using a drilling machine, etc., which is compared to the case where processing is completed in one step. Not only does this increase the total machining time, but also due to positional deviations due to workpiece changes, etc.
This causes the inconvenience that the machining position accuracy of small-diameter holes, etc., decreases.

SUMMARY OF THE INVENTION In order to eliminate the above-mentioned drawbacks, it is an object of the present invention to provide a laser processing machine that can perform laser processing and small diameter hole processing on a workpiece such as a die board to be machined in one step. .

(d) Means to solve 0 problems That is, one aspect of the present invention is a laser processing head (7).

A rotary tool unit (20) is provided, and a rotary tool (21) is removably attached to the rotary tool unit (20).9 Note that numbers in parentheses indicate corresponding elements in one drawing. 1. It is a matter of convenience, therefore.

This description is not limited to the description on the drawings.

The same applies to the column "r(e), Effect" below.

(e) 0 effect With the above-described configuration, the present invention enables the die board or the like to be processed to undergo predetermined laser processing using the torch (9), and then
It functions so that small-diameter hole machining can be performed using the rotary tool (21) without having to set the die board or the like in another machine or the like.

(f), Example Hereinafter, the present invention will be described in detail based on the drawings.

FIG. 1 is a front view showing the main parts of the saddle portion of a laser processing machine according to the present invention, and FIG. 2 is a side view of the saddle.

FIG. 3 is a diagram showing the engagement relationship between the trill unit support plate and the holder.

FIG. 4 is a perspective view showing an embodiment of the laser processing machine according to the present invention.

The laser processing machine 1 has five bodies 2 as shown in FIG. 4, and a table 3 having a workpiece mounting surface 3a formed on the upper part is provided on one body 2 so as to be movable in the directions of arrows A and B. It is being A column 5 is installed in the fuselage 2 so as to straddle the top of the table 3.

In column 5 there is a saddle 6 according to the invention, indicated by arrow A.

It is supported so as to be freely movable and driven in the direction of the arrow D (which is perpendicular to the direction of B).

As shown in FIG. 1, the saddle 6 has a saddle base 10 that is driven to move along the column 5 in a direction perpendicular to the plane of the drawing, that is, in the directions of arrows C and D.
Two guide rails 11.11 are formed parallel to each other on the right side in the figure in the directions of arrows E and F, that is, in the vertical direction in the figure. A laser processing head 7 is supported on the guide rail 11.11 so as to be freely movable and driven in the directions of arrows E and F along the guide rail 11.11, and the laser processing head 7 is movably driven along the guide rail 11.11.
At the tip of 7, a laser beam is emitted (--chi 9 is attached.

A drill unit support plate 12 is provided on the right side of the laser processing head 7 in FIG.
A drill unit 20 is attached to 2 via a holder 15. At the bottom of the diagram of the drill unit 20 is the main shaft 20.
a is supported so that it can protrude and retreat freely in the direction of arrow E-F and can be rotated, and the main! A drill 21 is removably attached to 1f120a via a chuck 20b.

Further, a block 22 is fixed to the lower end of the drill unit support plate 12 in the figure through a fixing means such as a bolt 23, and a screw hole 22a is provided in the center of the block 22 in the figure.
is threaded through in the direction of arrow EF. Screw hole 22a
, a drill height adjustment pole 1-25 is screwed through a stopper nand 26 with its tip 25a abuttingly engaged with the holder 1S, and a drill unit support Fi12
There are two T-grooves 1 on the right side of Figure 1, as shown in Figure 3.
2a and 12a are in the direction perpendicular to the plane of the paper in Figure 1, that is, arrows E and F.
The holes are formed in parallel in the direction.

The holder 15 holds the bolt 19 and the T-slot nut 1 fitted into the T-slots 12a, 12a.
3, the bolts 19 are supported to be movable and held in the directions of arrows E and F, and the bolts 19 are screwed into each of the T-groove nuts 13 through holes 15c drilled through the base portion 15b of the holder 15. ing. Furthermore, a key groove 12b is formed in the center of the drill unit support plate 12 in FIG.

On the other hand, the upper surface of the holder 15 in FIG. 3, that is, the drill unit 1
- A groove 15a is formed in the support plate 12 side in an angled shape, facing the keyway 12b.

A sliding key 16 is fitted and fixed in the groove L5a via a binding means such as a bolt 17, and the sliding key 16 is fitted into the key groove 12b with a holder 15. Therefore, it is fitted and engaged with the drill unit 2o so as to be slidable in the directions of arrows E and F.

Since the laser processing machine has one or more configurations, when positioning and fixing the drill unit 2o to the processing head 7 at the start of processing, each bolt 19
together with T-slot nut 13.

The holder 15 is tightened to engage the drill unit support plate 12. Note that arrows E and F of the drill unit 20
To determine the positioning direction, as shown in FIG. 1, with the bolt 19 loosened, loosen the locking nut 26 provided at the lower end of the drill unit support plate 12, and rotate the bolt 25 in the forward or reverse direction as appropriate. . Then, the bolt tip 25a moves in the directions of arrows E and F, and the boulder 15 in contact with the bolt tip 25a moves along the T-grooves L2a and 12a due to its own weight or against its own weight. Keyway 1.2
It moves in the directions of arrows E and F while being guided by b. In this way, the tip of the drill 21 is a predetermined distance L, ? from the lower end of the torch 9 in the figure. : When the holder 15 is positioned above the head 7, the holder 15 is fixed to the head 7 with the bolts 19 or the like as described above.

When the drill unit 20 is thus positioned at a predetermined position, predetermined laser machining and small diameter hole machining are performed on the die bow 1 and the like. Namely, first.

A workpiece such as a die board to be processed is mounted on the workpiece mounting surface 3a of the table 3. Then in that state.

The table 3 is moved in the directions of arrows A and B, the saddle 6 on which the laser processing head 7 is mounted is moved in the directions of arrows C and D, and the laser processing head 7 is appropriately moved in the directions of arrows E and F. In this way, when the torch 9 is positioned at a predetermined processing start position on the workpiece, a laser beam is supplied from a laser oscillator (not shown) to the laser processing head 7, and the beam is emitted from the torch 9 toward the workpiece on the table 3. Then, along with the assist gas supplied at the same time, predetermined laser processing is performed on the workpiece. During laser processing, drill units 1 to 2
0 is not driven, and the drill 21 is clamped by the chuck 20b.
does not protrude or rotate. Further, the tip of the drill 21 is located above the first VA by a distance L from the tip of the torch 9.

During laser processing using the torch 9, the drill 21 is in a retracted position away from the workpiece. Therefore, there is no interference between the drill 21 and the workpiece during L/-za machining, and the torch 9
Laser processing is performed smoothly. In this way, laser machining with the torch 9 is completed, and in order to perform small-diameter hole machining first, the workpiece is placed on the workpiece mounting surface 3a in the state S, and the table 3. The saddle 6 and the laser processing head 7 are moved and driven as appropriate to position the drill unit 20 so that the axis of the drill 21 is located on the center of the lJ/large diameter to be drilled. Drill 2 on the center of the small diameter hole.
1 is located, the drill unit 2o is driven by pneumatic pressure or the like to project the main shaft 41m20a in the direction of arrow F and rotate it, so that the drill 20 attached to the main shaft 20a is placed in the lower part of FIG. It plunges into the placed workpiece and penetrates it to drill a small diameter hole. At this time, the laser is not emitted from the tip 731 of the torch, and no laser processing is performed. After drilling the small diameter hole, the drill 21 moves back together with the main shaft 20a in the direction of arrow E and returns to the retracted position before protrusion, completing the small diameter hole drilling. Furthermore, when drilling a small diameter hole of the same diameter, the series of operations described above will be repeated. Note that it is of course possible to control the series of operations described above using an NC program.

Furthermore, in this embodiment, a case has been described in which the drill 21 is used as a rotary tool to drill a small diameter hole, but the tool attached to the chuck 20b is not limited to the drill 21.
Of course, it is also possible to attach an end mill or other rotary tool to perform groove machining or the like.

(g) 0 Effects of the Invention As described above, according to the present invention, the laser processing head 7 is provided with a rotary tool unit such as the drill unit 2o, and the rotary tool such as the drill 21 can be freely attached to and detached from the rotary tool unit. Since the workpiece to be machined, such as a die board, is subjected to the prescribed laser processing using the torch 9, the workpiece can be machined with a small diameter using a rotary tool such as the drill 21, without having to set the workpiece in a drilling machine or the like again. It is possible to immediately perform machining using a rotating tool such as hole machining. For this reason,
Compared to the case where machining with a single-rotation tool is performed on a separate machine after laser machining, the total machining time is not only reduced, but also the accuracy of machining positions for small-diameter holes can be improved since there is no need to change the workpiece. Note that the order of laser processing and rotary tool processing can be arbitrarily selected depending on the processing content, material, etc., making it possible to perform a wide variety of processing.

[Brief explanation of drawings]

FIG. 1 is a front view showing the main parts of the saddle portion of the laser processing machine according to the present invention. 2 is a side view of FIG. 1, FIG. 3 is a diagram showing the engagement relationship between the drill unit support plate and the holder, and FIG. 4 is a perspective view showing an embodiment of the laser processing machine according to the present invention. 1...Laser processing machine 6...Saddle 7...Laser processing head 9...Torch 20...Rotary tool unit (drill unit)
21...Rotary tool (drill) Applicant Yamazaki Mazak Co., Ltd. Agent Patent attorney Phase 1) Shinji (1 idiot)

Claims (1)

[Scope of Claims] A laser processing machine having a saddle, a laser processing head provided on the saddle, and a torch attached to the laser processing head, wherein a rotating tool unit is provided on the laser processing head, and the rotating tool A laser processing machine configured by attaching and detaching a rotary tool to a unit.