JPS62219533A - Bonding device - Google Patents

Bonding device

Info

Publication number
JPS62219533A
JPS62219533A JP61063331A JP6333186A JPS62219533A JP S62219533 A JPS62219533 A JP S62219533A JP 61063331 A JP61063331 A JP 61063331A JP 6333186 A JP6333186 A JP 6333186A JP S62219533 A JPS62219533 A JP S62219533A
Authority
JP
Japan
Prior art keywords
wedge
lead wire
bonding
cutting
press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61063331A
Other languages
Japanese (ja)
Inventor
Kunio Takatsuki
高月　邦男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP61063331A priority Critical patent/JPS62219533A/en
Publication of JPS62219533A publication Critical patent/JPS62219533A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To independently set the press bonding of a lead wire and the load of cutting as well as to enhance the reproducibility of cutting place without destructing a semiconductor element by a method wherein the press bonding part of the lead wire and the cutting part of the lead wire are independently provided on the wedge part of an ultrasonic wave bonding device. CONSTITUTION:The lead wire 11, with which a semiconductor element 9 and a semiconductor device container 10 will be connected, passes a clamp 12 and connected to the wedge 14 to be exclusively used for press bonding of the wedge 13, which is exclusively used for cutting of the lead wire, and the lead wire. The lead wire 11 is press- bonded on the bonding pad part 15 of the semiconductor element 9 by the wedge 14 to be used for press bonding only. Then, the clamp 12 is opened, the wedge 13 of cutting only and the wedge 14 of press bonding only are shifted to the semiconductor device container 10, and the lead wire 11 is press-bonded on the bonding pad part 16 of the semiconductor device container 10 with the wedge 14 to be exclusively used for press bonding. Then, the wedge 13 is fixed to the end part of the press-bonded part of the lead wire, the clamp 12 is closed and the wedge 14, to be exclusively used for press bonding, and the lead wire 11 are shifted upward, and the lead wire 11 is cut with the cutting only wedge 13.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体装置の組立に８いて、半導体素子特性
を外部へ引き出すために半導体素子のポンディングパッ
ドと半導体装置の蓉暮ヲ導線で接続するボンディング装
置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is used in the assembly of semiconductor devices, and uses a bonding pad of the semiconductor device and a connecting wire of the semiconductor device to bring out the characteristics of the semiconductor device to the outside. The present invention relates to a bonding device to be connected.

〔従来の技術〕[Conventional technology]

従来、半導体素子のポンディングパッドが小さい場合は
、導線の圧着幅が小さくすることが可能な超音波ボンデ
ィングが適用されていた。Conventionally, when the bonding pad of a semiconductor element is small, ultrasonic bonding has been applied, which allows the crimping width of the conductive wire to be made small.

その超音波ボンディングの装置の従来の具体例’ａ’喉
２図に示す。半導体素子１と半導体装置容器２ｖ接続す
る導線３がクランプ４′ｆｚｒ：通りウェッゾ５につな
がっている。第２図（ｂ）に前記ウェッゾの拡大図を示
す。まず、ウェッゾ５の圧着部６に工９導線３が半導体
素子１のポンディングパッド部７で圧着される。次にク
ランプ４が開き、ウェッゾ５が半導体装置容器２に移動
し半導体装置容器２のポンディングパッド部８上で導線
３をウェッゾ５の圧着部６により圧着される。次にクラ
ンプ４が閉じウェッゾ５と導線３を一緒に上方向に移動
する。導線の圧着部が半導体装置容器に固定され、また
圧着部が導線の圧着されていない部分より薄くなってい
るため、ウェッゾと導線を一緒に上方向に移動させた時
に導線が圧着部の端より切断される。A conventional example of the ultrasonic bonding device is shown in Figure 2 'a'. A conductive wire 3 connecting the semiconductor element 1 and the semiconductor device container 2v is connected to a clamp 4'fzr: wezzo 5. FIG. 2(b) shows an enlarged view of the wezzo. First, the conductor wire 3 is crimped to the crimping portion 6 of the wezzo 5 using the bonding pad portion 7 of the semiconductor element 1 . Next, the clamp 4 is opened, the wezzo 5 is moved to the semiconductor device container 2, and the conductive wire 3 is crimped onto the bonding pad portion 8 of the semiconductor device container 2 by the crimping portion 6 of the wezzo 5. Next, the clamp 4 is closed and the wezzo 5 and the conducting wire 3 are moved upward together. The crimped part of the conductor is fixed to the semiconductor device container, and the crimped part is thinner than the uncrimped part of the conductor, so when the wezzo and the conductor are moved upward together, the conductor will be lower than the end of the crimped part. disconnected.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、このようなウェッゾを使用したボンディング装
置では導線の切断か所を再現性良くすると切断か所が一
定しなくなる。However, in a bonding apparatus using such wezzo, if the reproducibility of the cutting location of the conductive wire is improved, the cutting location will not be constant.

本発明の目的は上記欠点を除去されたボンディング装置
を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a bonding device in which the above-mentioned drawbacks are eliminated.

〔問題点を解決するための手段〕[Means for solving problems]

本発明のボンディング装置は超音波ボンディング装置の
ウヱッヂ部が導線の圧着部と導線の切断部が独立してい
ることン特徴とする。The bonding apparatus of the present invention is characterized in that the wedge part of the ultrasonic bonding apparatus has an independent wire crimping part and a conductor cutting part.

〔実施例〕〔Example〕

水弁明乞実施例により説明する。 This will be explained using an example.

第１図は本発明？用いたボンディング装置の実施例であ
る。第１図のように半導体素子９と半導体装置容器ＩＱ
’ｙ、−接続する導線１１がクランプ１２’ａ−通り導
線夕切断する切断専用ウエツヂ１３と導線Ｚ圧着する正
置専用ウヱツヂ１４につながっている。Is Figure 1 the invention? This is an example of the bonding device used. As shown in FIG. 1, the semiconductor element 9 and the semiconductor device container IQ
The conductor 11 connected to the clamp 12'a is connected to a cutting wedge 13 for cutting the conductor and a positioning wedge 14 for crimping the conductor Z.

まず、圧着専用ウェブヂ１４に、ｃｖ導線１１が半導体
素子９のポンディングパッド部１５上で圧着される。次
にクランプ１２が開き、切断専用ウェッヂ１３と圧着専
用ウェッヂ１４が半導体装置容器１０に移動し半導体装
置容器１０のポンディングパッド部１６上で導線１１ｊ
・圧着専用ウェッヂ１４にニジ圧着される。次に切断専
用ウェッヂ１３が導線の圧着部の端に固定されクランプ
１２が閉じ圧着専用ウェッヂ１４と導線１１を上方向に
移動させ、導線１１を切断する。First, the CV conductor 11 is crimped onto the bonding pad portion 15 of the semiconductor element 9 on the crimping web 14 . Next, the clamp 12 is opened, and the wedge 13 for cutting and the wedge 14 for crimping move to the semiconductor device container 10 and touch the conductive wire 11j on the bonding pad portion 16 of the semiconductor device container 10.
- It is crimped to the wedge 14 exclusively for crimping. Next, the cutting wedge 13 is fixed to the end of the crimping portion of the conducting wire, the clamp 12 is closed, and the crimping wedge 14 and the conducting wire 11 are moved upward to cut the conducting wire 11.

〔発明の効果〕〔Effect of the invention〕

上記ボンディング装置を用いることにより、導線の圧着
と切断の荷重を独立して設定することが可能なため、半
導体素子を破壊することなく切断するか所を再現性良く
することが可能になる。By using the above-described bonding apparatus, it is possible to independently set the load for crimping and cutting the conductive wire, so that it is possible to improve the reproducibility of the place where the semiconductor element is cut without destroying it.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明のボンディング装置略図、第２図は従来
のボンディング装置略図である。 １．９・・・・・・半導体素子、２．１０・−・・・・
半導体容器、３，１１・・・・・・導線、４．１２・・
・・・・クランプ。 ５・・・・−・ウェッヂ、６・・・・・・ウェッヂ圧着
部、７゜１５・・・・−・半導体素子ボンディングバッ
ト部、８゜１６・・・・・・半導体容器ポンディングパ
ッド部、１３・・・・・・切断専用ウェッヂ、１４・・
・・−・圧着専用ウェソヂ。 羊　２ に （ｂ） 図FIG. 1 is a schematic diagram of a bonding apparatus according to the present invention, and FIG. 2 is a schematic diagram of a conventional bonding apparatus. 1.9... Semiconductor element, 2.10...
Semiconductor container, 3, 11... Conductor wire, 4.12...
... Clamp. 5...Wedge, 6...Wedge crimping portion, 7゜15...Semiconductor element bonding butt portion, 8゜16...Semiconductor container bonding pad portion , 13...Wedge for cutting, 14...
・・・－・Wesoji exclusively for crimping. Sheep 2 (b) Figure

Claims (1)

【特許請求の範囲】[Claims] 超音波ボンディング装置のウェッヂ部が導線の圧着部と
導線の切断部が独立していることを特徴とするボンディ
ング装置。A bonding device characterized in that a wedge portion of the ultrasonic bonding device has an independent conductor crimping portion and a conductor cutting portion.
JP61063331A 1986-03-19 1986-03-19 Bonding device Pending JPS62219533A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61063331A JPS62219533A (en) 1986-03-19 1986-03-19 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61063331A JPS62219533A (en) 1986-03-19 1986-03-19 Bonding device

Publications (1)

Publication Number Publication Date
JPS62219533A true JPS62219533A (en) 1987-09-26

Family

ID=13226157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61063331A Pending JPS62219533A (en) 1986-03-19 1986-03-19 Bonding device

Country Status (1)

Country Link
JP (1) JPS62219533A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4976392A (en) * 1989-08-11 1990-12-11 Orthodyne Electronics Corporation Ultrasonic wire bonder wire formation and cutter system
US5868300A (en) * 1995-06-29 1999-02-09 Orthodyne Electronics Corporation Articulated wire bonder
DE19752319C5 (en) * 1996-11-27 2011-02-17 Orthodyne Electronics Corp., Irvine An ultrasonic wire-bonding apparatus comprising a device for testing a bond connection and a method for testing a bond connection produced by means of an ultrasonic wire-bonding tool

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4976392A (en) * 1989-08-11 1990-12-11 Orthodyne Electronics Corporation Ultrasonic wire bonder wire formation and cutter system
US5868300A (en) * 1995-06-29 1999-02-09 Orthodyne Electronics Corporation Articulated wire bonder
DE19752319C5 (en) * 1996-11-27 2011-02-17 Orthodyne Electronics Corp., Irvine An ultrasonic wire-bonding apparatus comprising a device for testing a bond connection and a method for testing a bond connection produced by means of an ultrasonic wire-bonding tool

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