JPS6221550U - - Google Patents
Info
- Publication number
- JPS6221550U JPS6221550U JP11275185U JP11275185U JPS6221550U JP S6221550 U JPS6221550 U JP S6221550U JP 11275185 U JP11275185 U JP 11275185U JP 11275185 U JP11275185 U JP 11275185U JP S6221550 U JPS6221550 U JP S6221550U
- Authority
- JP
- Japan
- Prior art keywords
- area
- widened
- semiconductor integrated
- wiring material
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11275185U JPS6221550U (pt) | 1985-07-22 | 1985-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11275185U JPS6221550U (pt) | 1985-07-22 | 1985-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6221550U true JPS6221550U (pt) | 1987-02-09 |
Family
ID=30993914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11275185U Pending JPS6221550U (pt) | 1985-07-22 | 1985-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6221550U (pt) |
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1985
- 1985-07-22 JP JP11275185U patent/JPS6221550U/ja active Pending